JP6294421B2 - ビスマス電気めっき浴及び基材上にビスマスを電気めっきする方法 - Google Patents
ビスマス電気めっき浴及び基材上にビスマスを電気めっきする方法 Download PDFInfo
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- JP6294421B2 JP6294421B2 JP2016174236A JP2016174236A JP6294421B2 JP 6294421 B2 JP6294421 B2 JP 6294421B2 JP 2016174236 A JP2016174236 A JP 2016174236A JP 2016174236 A JP2016174236 A JP 2016174236A JP 6294421 B2 JP6294421 B2 JP 6294421B2
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- bismuth
- bath
- electroplating
- electroplating bath
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- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 title claims description 135
- 229910052797 bismuth Inorganic materials 0.000 title claims description 117
- 238000009713 electroplating Methods 0.000 title claims description 96
- 238000000034 method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- -1 polyoxyethylene Polymers 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 17
- 229910001451 bismuth ion Inorganic materials 0.000 claims description 14
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 12
- 150000007513 acids Chemical class 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 12
- 150000008378 aryl ethers Chemical class 0.000 claims description 11
- 239000002518 antifoaming agent Substances 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- 150000001412 amines Chemical class 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- 238000005275 alloying Methods 0.000 claims description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- 150000007522 mineralic acids Chemical class 0.000 claims description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 235000005985 organic acids Nutrition 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 claims description 2
- 229910000380 bismuth sulfate Inorganic materials 0.000 claims description 2
- 239000002738 chelating agent Substances 0.000 claims description 2
- 239000008139 complexing agent Substances 0.000 claims description 2
- BEQZMQXCOWIHRY-UHFFFAOYSA-H dibismuth;trisulfate Chemical compound [Bi+3].[Bi+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BEQZMQXCOWIHRY-UHFFFAOYSA-H 0.000 claims description 2
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 description 13
- 230000032683 aging Effects 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 239000000654 additive Substances 0.000 description 10
- 229910001092 metal group alloy Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000002244 precipitate Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- 229910001369 Brass Inorganic materials 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000004599 antimicrobial Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 150000001621 bismuth Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 3
- 238000007086 side reaction Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000002028 premature Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-butanediol Substances OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- LDMOEFOXLIZJOW-UHFFFAOYSA-N 1-dodecanesulfonic acid Chemical compound CCCCCCCCCCCCS(O)(=O)=O LDMOEFOXLIZJOW-UHFFFAOYSA-N 0.000 description 1
- KDKIWFRRJZZYRP-UHFFFAOYSA-N 1-hydroxypropane-2-sulfonic acid Chemical compound OCC(C)S(O)(=O)=O KDKIWFRRJZZYRP-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
- NSRGOAGKXKNHQX-UHFFFAOYSA-N 2-hydroxybutane-1-sulfonic acid Chemical compound CCC(O)CS(O)(=O)=O NSRGOAGKXKNHQX-UHFFFAOYSA-N 0.000 description 1
- ZWLIPWXABAEXNY-UHFFFAOYSA-N 2-hydroxydecane-1-sulfonic acid Chemical compound CCCCCCCCC(O)CS(O)(=O)=O ZWLIPWXABAEXNY-UHFFFAOYSA-N 0.000 description 1
- VRWFADPPHBJBER-UHFFFAOYSA-N 2-hydroxydodecane-1-sulfonic acid Chemical compound CCCCCCCCCCC(O)CS(O)(=O)=O VRWFADPPHBJBER-UHFFFAOYSA-N 0.000 description 1
- CZFRHHAIWDBFCI-UHFFFAOYSA-N 2-hydroxyhexane-1-sulfonic acid Chemical compound CCCCC(O)CS(O)(=O)=O CZFRHHAIWDBFCI-UHFFFAOYSA-N 0.000 description 1
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical compound CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 description 1
- ZMPRRFPMMJQXPP-UHFFFAOYSA-N 2-sulfobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1S(O)(=O)=O ZMPRRFPMMJQXPP-UHFFFAOYSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical compound OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 description 1
- HYKDWGUFDOYDGV-UHFFFAOYSA-N 4-anilinobenzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1NC1=CC=CC=C1 HYKDWGUFDOYDGV-UHFFFAOYSA-N 0.000 description 1
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- YEGPVWSPNYPPIK-UHFFFAOYSA-N 4-hydroxybutane-1-sulfonic acid Chemical compound OCCCCS(O)(=O)=O YEGPVWSPNYPPIK-UHFFFAOYSA-N 0.000 description 1
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 1
- 229910000897 Babbitt (metal) Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- ZEIOYEGJYKEUEE-UHFFFAOYSA-K C(CC)S(=O)(=O)[O-].[Bi+3].C(CC)S(=O)(=O)[O-].C(CC)S(=O)(=O)[O-] Chemical compound C(CC)S(=O)(=O)[O-].[Bi+3].C(CC)S(=O)(=O)[O-].C(CC)S(=O)(=O)[O-] ZEIOYEGJYKEUEE-UHFFFAOYSA-K 0.000 description 1
- 0 C*(C)NC(*)=O Chemical compound C*(C)NC(*)=O 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OYNWMOIEWHZFAG-UHFFFAOYSA-K OC(CS(=O)(=O)[O-])CC.[Bi+3].OC(CS(=O)(=O)[O-])CC.OC(CS(=O)(=O)[O-])CC Chemical compound OC(CS(=O)(=O)[O-])CC.[Bi+3].OC(CS(=O)(=O)[O-])CC.OC(CS(=O)(=O)[O-])CC OYNWMOIEWHZFAG-UHFFFAOYSA-K 0.000 description 1
- KFSCNPKCDPHLQH-UHFFFAOYSA-K OCCS(=O)(=O)[O-].[Bi+3].OCCS(=O)(=O)[O-].OCCS(=O)(=O)[O-] Chemical compound OCCS(=O)(=O)[O-].[Bi+3].OCCS(=O)(=O)[O-].OCCS(=O)(=O)[O-] KFSCNPKCDPHLQH-UHFFFAOYSA-K 0.000 description 1
- MXSWEQRTLLXAIR-UHFFFAOYSA-K OCS(=O)(=O)[O-].[Bi+3].OCS(=O)(=O)[O-].OCS(=O)(=O)[O-] Chemical compound OCS(=O)(=O)[O-].[Bi+3].OCS(=O)(=O)[O-].OCS(=O)(=O)[O-] MXSWEQRTLLXAIR-UHFFFAOYSA-K 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- ORLVAAOOUVJDIE-UHFFFAOYSA-K bismuth ethanesulfonate Chemical compound C(C)S(=O)(=O)[O-].[Bi+3].C(C)S(=O)(=O)[O-].C(C)S(=O)(=O)[O-] ORLVAAOOUVJDIE-UHFFFAOYSA-K 0.000 description 1
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical compound [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 description 1
- MNMKEULGSNUTIA-UHFFFAOYSA-K bismuth;methanesulfonate Chemical compound [Bi+3].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O MNMKEULGSNUTIA-UHFFFAOYSA-K 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- BRXCDHOLJPJLLT-UHFFFAOYSA-N butane-2-sulfonic acid Chemical compound CCC(C)S(O)(=O)=O BRXCDHOLJPJLLT-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- FYAQQULBLMNGAH-UHFFFAOYSA-N hexane-1-sulfonic acid Chemical compound CCCCCCS(O)(=O)=O FYAQQULBLMNGAH-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- RJQRCOMHVBLQIH-UHFFFAOYSA-N pentane-1-sulfonic acid Chemical compound CCCCCS(O)(=O)=O RJQRCOMHVBLQIH-UHFFFAOYSA-N 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229960000502 poloxamer Drugs 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/10—Bearings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Automation & Control Theory (AREA)
Description
%CE=[Mexp/Mth]×100
Mth=(ItM)/zF、
式中、Iは印加された電流であり、tは析出時間であり、zはめっきされる元素の価数であり、Mはめっきされる元素のモル質量であり、Fはファラデー定数である。
Mexp=(mf−mi)、
式中、mfはめっき後の基材の質量であり、miはめっき前の基材の質量である。
水性ビスマス電気めっき浴を下の表に示すように調製した。
可溶性ビスマス陽極を有する従来の真鍮ハルセル内に、ビスマス電気めっき浴を設置した。電流を2Aに設定した。40℃の温度で3分間、直流電気めっきを行った。図1は、真鍮ハルセルパネル上にめっきされたビスマスの写真である。図1の底部にあるスケールバーは、セルに沿ったその特定の位置の電流密度に対応する数を有する。スケール上の数字は、左から右に、10、8、6、4、3、2.5、2、1.5、1、0.8、0.6、0.4、0.2、及び0.1ASDを示す。めっきされたビスマスは、1〜12ASDの電流密度範囲にわたって均一な艶消しの外観を有していた。
可溶性ビスマス陽極を有する別の真鍮ハルセル内に、実施例1のビスマス電気めっき浴を設置した。電流は5Aであり、めっき時間は1分間であり、めっき浴の温度は40℃であった。ビスマス析出物の外観は、1ASD〜25ASDの電流密度範囲で均一な艶消しであった。めっき速度は、ハルセルに沿って種々の電流密度でビスマス析出物の厚さを測定することにより決定した。Helmut Fischer AGのFISCHERSCOPE(登録商標)X−RayモデルXDV−SD蛍光分析計を使用して、XRFにより厚さを測定した。ハルセルに沿った種々の電流密度でのめっき速度を、表2に示すように記録し、図2に示すようにグラフにプロットした。
実施例1のビスマス電気めっき浴の%CEを、浴寿命100Ah/Lまでの電気めっきにわたって決定した。%CEは、前述のように以下の等式を使用して決定した。
%CE=[Mexp/Mth]×100
ファラデーの法則:Mth=(It M)/(zF)
Mexp=(mf−mi)
a)1リットルのビスマス浴を円筒形のガラスセルに導入した。
b)2つの可溶性ビスマス陽極をガラスセル内で向かい合わせに配置し、陽極を整流器に接続した。
c)小さなクランプ上に約5cm〜7.5cmの真鍮パネルを固定し、整流器の陰極に接続した。
d)4ASDに相当する3Aの一定の直流電流を20分間システムに印加し、セルからパネルを取り外し、DI水ですすぎ、乾燥させた。
e)等式Ah=電流(A)×めっき時間(h)を用いて合計アンペア時間を算出した。
f)各ステップで、Ahをめっき浴の体積で除すことによりAh/Lを決定した。
上記方法を4ASD〜12ASDの電流密度で繰り返した。各電流密度での平均%CEのグラフを図4に示すようにプロットした。%CEは、100Ah/Lの浴老化度にわたって約95%に近く、安定したビスマス電気めっき浴を示す。
水性ビスマス電気めっき浴を下の表に示すように調製した。
可溶性ビスマス陽極を有する従来の真鍮ハルセル内に、表3のビスマス電気めっき浴を設置した。電流を1分間で5Aに設定し、セル温度を25℃に維持した。この温度は、表3の配合を電気めっきするための最適温度に相当する。各電流密度でのビスマス析出物の厚さを、Helmut Fischer AGによって供給された蛍光分析計FISCHERSCOPE(登録商標)X−Ray model XDV−SDを使用してXRFにより測定した。ハルセルに沿った種々の電流密度でのめっき速度を、表4に示すように記録し、図5に示すようにグラフにプロットした。
最大11Ah/Lの浴老化度までビスマスめっきが行われたこと以外は、実施例4に記載される手順に従って、実施例6のビスマス電気めっき浴の%CE対浴老化度を決定した。表3の浴配合の効率が悪いため、より高い浴老化度での%CEは得られなかった。浴は、より高い浴老化度では不安定であり、可溶性ビスマス陽極からのビスマスイオン濃度が、めっき動作を維持するためには周期的な希釈が必要なレベルまでビスマスイオン濃度を増加させた。結果を表5に示す。
Claims (10)
- 前記1つ以上のポリオキシエチレンアリールエーテルは、0.5g/L〜12g/Lの量である、請求項1に記載のビスマス電気めっき浴。
- 前記1つ以上のビスマスイオン源は、アルカンスルホン酸ビスマス塩、アルカノールスルホン酸ビスマス塩、硫酸ビスマス、硝酸ビスマス、及び塩化ビスマスから選択される、請求項1または2に記載のビスマス電気めっき浴。
- 前記1つ以上の酸は、有機酸及び無機酸から選択される、請求項1〜3のいずれか1項に記載のビスマス電気めっき浴。
- 前記ビスマス電気めっき浴は、1つ以上のアミンオキシドをさらに含む、請求項1〜4のいずれか1項に記載のビスマス電気めっき浴。
- 前記ビスマス電気めっき浴は、1つ以上の消泡剤をさらに含む、請求項1〜5のいずれか1項に記載のビスマス電気めっき浴。
- 前記ビスマス電気めっき浴は、錯化剤及びキレート剤を含まない、請求項1〜6のいずれか1項に記載のビスマス電気めっき浴。
- a) 基材を提供することと、
b) 1つ以上のビスマスイオン源、1つ以上の酸、及び1つ以上のポリオキシエチレンアリールエーテルを含むビスマス電気めっき浴であって、
前記1つ以上のポリオキシエチレンアリールエーテルは、式
c) 前記基材を前記ビスマス電気めっき浴と接触させることと、
d) 前記ビスマス電気めっき浴及び基材に電流を印加することと、
e) 前記基材上にビスマスを電気めっきすることと、を含む、ビスマス金属を電気めっきする方法。 - 電気めっき中の電流密度は、0.5ASD〜25ASDである、請求項8に記載の方法。
- 前記基材は、軸受である、請求項8または9に記載の方法。
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