WO2006108476A3 - Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten - Google Patents
Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten Download PDFInfo
- Publication number
- WO2006108476A3 WO2006108476A3 PCT/EP2006/002183 EP2006002183W WO2006108476A3 WO 2006108476 A3 WO2006108476 A3 WO 2006108476A3 EP 2006002183 W EP2006002183 W EP 2006002183W WO 2006108476 A3 WO2006108476 A3 WO 2006108476A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrolyte
- several
- depositing tin
- alloy layers
- bismuth alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008505749A JP5278675B2 (ja) | 2005-04-12 | 2006-03-09 | スズ−ビスマス合金層沈着(析出)のための電解液及び方法 |
TW095113052A TWI328052B (en) | 2005-04-12 | 2006-04-12 | Electrolyte and method for depositing tin-bismuth alloy layers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510016819 DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
DE102005016819.1 | 2005-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006108476A2 WO2006108476A2 (de) | 2006-10-19 |
WO2006108476A3 true WO2006108476A3 (de) | 2007-05-31 |
Family
ID=36527525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/002183 WO2006108476A2 (de) | 2005-04-12 | 2006-03-09 | Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5278675B2 (de) |
KR (1) | KR20070120592A (de) |
DE (1) | DE102005016819B4 (de) |
TW (1) | TWI328052B (de) |
WO (1) | WO2006108476A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010106072A2 (de) * | 2009-03-18 | 2010-09-23 | Basf Se | Elektrolyt und oberflächenaktive additive für die galvanische abscheidung glatter, dichter aluminium-schichten aus ionischen flüssigkeiten |
KR20120095470A (ko) | 2009-12-15 | 2012-08-28 | 바스프 에스이 | 전기화학 전지 및 배터리용 전해액 중의 첨가제로서의 티아졸 화합물 |
CN112701351B (zh) * | 2020-12-29 | 2022-08-19 | 中国科学院宁波材料技术与工程研究所 | 一种非水性电解液及其制备方法以及一种锂离子电池 |
CN113293409B (zh) * | 2021-05-28 | 2022-06-24 | 中南大学 | 一种电解制备致密平整铋金属的方法 |
CN115029745A (zh) * | 2022-07-08 | 2022-09-09 | 云南锡业集团(控股)有限责任公司研发中心 | 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030132122A1 (en) * | 2002-01-17 | 2003-07-17 | Lucent Technologies Inc | Electroplating solution for high speed plating of tin-bismuth solder |
WO2004065663A1 (ja) * | 2003-01-24 | 2004-08-05 | Ishihara Chemical Co., Ltd. | スズ含有メッキ浴 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0781196B2 (ja) * | 1986-07-04 | 1995-08-30 | 株式会社大和化成研究所 | 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴 |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
KR960008155B1 (ko) * | 1988-10-14 | 1996-06-20 | 엠 앤드 티 케미칼즈, 아이엔씨. | 주석-비스무트 합금의 전기도금법 |
JP3274232B2 (ja) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | 錫−ビスマス合金めっき浴及びそれを使用するめっき方法 |
JPH1025595A (ja) * | 1996-07-12 | 1998-01-27 | Ishihara Chem Co Ltd | スズ及びスズ合金めっき浴 |
JP3292055B2 (ja) * | 1996-09-03 | 2002-06-17 | 上村工業株式会社 | 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法 |
JP2000100850A (ja) * | 1998-09-24 | 2000-04-07 | Ebara Udylite Kk | 低融点金属バンプの形成方法 |
JP4077119B2 (ja) * | 1999-06-30 | 2008-04-16 | エヌ・イーケムキャット株式会社 | 錫−ビスマス合金電気めっき浴およびめっき方法 |
JP2001040497A (ja) * | 1999-07-27 | 2001-02-13 | Ne Chemcat Corp | 錫−ビスマス合金めっき皮膜で被覆された電子部品 |
US6706418B2 (en) * | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
JP4441725B2 (ja) * | 2003-11-04 | 2010-03-31 | 石原薬品株式会社 | 電気スズ合金メッキ方法 |
JP4524483B2 (ja) * | 2004-04-28 | 2010-08-18 | 石原薬品株式会社 | スズ又はスズ合金メッキ方法 |
JP4389083B2 (ja) * | 2004-08-10 | 2009-12-24 | 石原薬品株式会社 | 鉛フリーのスズ−ビスマス系合金電気メッキ浴 |
JP4605359B2 (ja) * | 2004-10-20 | 2011-01-05 | 石原薬品株式会社 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
JP4273266B2 (ja) * | 2005-03-23 | 2009-06-03 | 石原薬品株式会社 | 溶解電流抑制式のスズ合金電気メッキ方法 |
-
2005
- 2005-04-12 DE DE200510016819 patent/DE102005016819B4/de active Active
-
2006
- 2006-03-09 KR KR1020077026116A patent/KR20070120592A/ko not_active Application Discontinuation
- 2006-03-09 WO PCT/EP2006/002183 patent/WO2006108476A2/de not_active Application Discontinuation
- 2006-03-09 JP JP2008505749A patent/JP5278675B2/ja active Active
- 2006-04-12 TW TW095113052A patent/TWI328052B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030132122A1 (en) * | 2002-01-17 | 2003-07-17 | Lucent Technologies Inc | Electroplating solution for high speed plating of tin-bismuth solder |
WO2004065663A1 (ja) * | 2003-01-24 | 2004-08-05 | Ishihara Chemical Co., Ltd. | スズ含有メッキ浴 |
EP1591563A1 (de) * | 2003-01-24 | 2005-11-02 | Ishihara Chemical Co., Ltd. | Zinnhaltiges metallabscheidungsbad |
Also Published As
Publication number | Publication date |
---|---|
WO2006108476A2 (de) | 2006-10-19 |
DE102005016819A1 (de) | 2006-10-19 |
JP5278675B2 (ja) | 2013-09-04 |
TW200643231A (en) | 2006-12-16 |
DE102005016819B4 (de) | 2009-10-01 |
TWI328052B (en) | 2010-08-01 |
KR20070120592A (ko) | 2007-12-24 |
JP2008536011A (ja) | 2008-09-04 |
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