TW200734472A - Flexible metal clad laminate and method for manufacturing the same - Google Patents

Flexible metal clad laminate and method for manufacturing the same

Info

Publication number
TW200734472A
TW200734472A TW096102402A TW96102402A TW200734472A TW 200734472 A TW200734472 A TW 200734472A TW 096102402 A TW096102402 A TW 096102402A TW 96102402 A TW96102402 A TW 96102402A TW 200734472 A TW200734472 A TW 200734472A
Authority
TW
Taiwan
Prior art keywords
seed layer
clad laminate
manufacturing
flexible metal
metal
Prior art date
Application number
TW096102402A
Other languages
Chinese (zh)
Other versions
TWI369407B (en
Inventor
Sang-Hyun Jun
Joong-Kyu An
pan-seok Kim
Kyung-Kak Kim
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200734472A publication Critical patent/TW200734472A/en
Application granted granted Critical
Publication of TWI369407B publication Critical patent/TWI369407B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/246—Vapour deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive

Landscapes

  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

A method for manufacturing a flexible metal clad laminate includes the steps of (a) preparing a polymer film required for making a flexible metal clad laminate; (b) coating nickel-chrome alloy having a nickel-chrome ratio of 80:20 to 95:5 on one surface of the polymer film; (c) forming a metal seed layer on an exposed surface of a tie coating layer formed in the step (b); and (d) forming a metal conductive layer on the metal seed layer. In addition, the metal seed layer may have a first seed layer formed on the tie coating layer by means of sputtering and a second seed layer formed on the first seed layer by means of evaporation.
TW096102402A 2006-02-02 2007-01-23 Flexible metal clad laminate and method for manufacturing the same TWI369407B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060010192A KR100727716B1 (en) 2006-02-02 2006-02-02 Flexible metal clad laminate and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200734472A true TW200734472A (en) 2007-09-16
TWI369407B TWI369407B (en) 2012-08-01

Family

ID=38359231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102402A TWI369407B (en) 2006-02-02 2007-01-23 Flexible metal clad laminate and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP2007223312A (en)
KR (1) KR100727716B1 (en)
CN (1) CN100559918C (en)
TW (1) TWI369407B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008284869A (en) * 2007-05-15 2008-11-27 Ls Cable Ltd Flexible metal laminated plate having high visible ray transmittance
KR20090067744A (en) 2007-12-21 2009-06-25 엘지전자 주식회사 Flexible film
KR100896439B1 (en) * 2007-12-26 2009-05-14 엘지전자 주식회사 Flexible film
KR100947608B1 (en) 2007-12-28 2010-03-15 엘지전자 주식회사 Flexible Film
KR20090093133A (en) * 2008-02-28 2009-09-02 엘에스엠트론 주식회사 Dimensionally stable flexible metal clad laminate and method for manufacturing the same
WO2010074056A1 (en) * 2008-12-26 2010-07-01 日鉱金属株式会社 Flexible laminate and flexible electronic circuit substrate formed using the same
CN102469700B (en) * 2010-11-12 2014-07-09 北大方正集团有限公司 Method for manufacturing circuit board and circuit board
KR102003880B1 (en) * 2012-12-06 2019-07-26 도레이케미칼 주식회사 Flexible cupper laminated film and Preparing method of the same
KR102492818B1 (en) * 2015-10-12 2023-01-30 에스케이넥실리스 주식회사 Flexible Copper Clad Laminate and Method for Manufacturing The Same
KR101810524B1 (en) 2016-05-16 2017-12-19 도레이첨단소재 주식회사 Manufacturing method of flexible cupper clad laminated film for semi-additive containing ultrathin polyimide film and its flexible cupper clad laminated film for semi-additive

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682101B2 (en) * 1989-01-24 1997-11-26 凸版印刷株式会社 Transparent barrier composite film with retort resistance
JPH0983134A (en) * 1995-09-07 1997-03-28 Gunze Ltd Flexible printed circuit board
JPH1065316A (en) 1996-08-23 1998-03-06 Sumitomo Metal Mining Co Ltd Manufacturing method of double-layer flexible board
JPH11111466A (en) * 1997-10-06 1999-04-23 Tdk Corp Electrode of organic el element
US6268070B1 (en) * 1999-03-12 2001-07-31 Gould Electronics Inc. Laminate for multi-layer printed circuit
JP2002252257A (en) * 2000-12-18 2002-09-06 Mitsui Mining & Smelting Co Ltd Semiconductor carrier film and its manufacturing method
JP2003094589A (en) * 2001-09-27 2003-04-03 Hitachi Metals Ltd Method and apparatus for manufacturing laminate material
JP2003332702A (en) * 2002-05-09 2003-11-21 Toyo Metallizing Co Ltd Flexible printed circuit board
JP2004031588A (en) * 2002-06-25 2004-01-29 Toyo Metallizing Co Ltd Flexible printed wiring board
JP2004303863A (en) * 2003-03-31 2004-10-28 Toyo Metallizing Co Ltd Flexible printed-wiring board
JP4257583B2 (en) * 2003-08-27 2009-04-22 東洋紡績株式会社 Metallized polyimide film and method for producing the same
JP2005219259A (en) 2004-02-04 2005-08-18 Mitsubishi Shindoh Co Ltd Metallized polyimide film
JP2005262707A (en) * 2004-03-19 2005-09-29 Toray Ind Inc Copper-clad laminated film and material for flexible circuit board
KR20060081118A (en) * 2005-01-07 2006-07-12 윈텍 주식회사 Soft thin laminated substrate

Also Published As

Publication number Publication date
CN101014231A (en) 2007-08-08
TWI369407B (en) 2012-08-01
KR100727716B1 (en) 2007-06-13
JP2007223312A (en) 2007-09-06
CN100559918C (en) 2009-11-11

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