KR20070120592A - 전해질 및 주석-비스무트 합금층의 도금 방법 - Google Patents

전해질 및 주석-비스무트 합금층의 도금 방법 Download PDF

Info

Publication number
KR20070120592A
KR20070120592A KR1020077026116A KR20077026116A KR20070120592A KR 20070120592 A KR20070120592 A KR 20070120592A KR 1020077026116 A KR1020077026116 A KR 1020077026116A KR 20077026116 A KR20077026116 A KR 20077026116A KR 20070120592 A KR20070120592 A KR 20070120592A
Authority
KR
South Korea
Prior art keywords
electrolyte
tin
thiadiazole
bismuth
coating
Prior art date
Application number
KR1020077026116A
Other languages
English (en)
Korean (ko)
Inventor
만프레드 요르단
Original Assignee
독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게 filed Critical 독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게
Publication of KR20070120592A publication Critical patent/KR20070120592A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020077026116A 2005-04-12 2006-03-09 전해질 및 주석-비스무트 합금층의 도금 방법 KR20070120592A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510016819 DE102005016819B4 (de) 2005-04-12 2005-04-12 Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
DE102005016819.1 2005-04-12

Publications (1)

Publication Number Publication Date
KR20070120592A true KR20070120592A (ko) 2007-12-24

Family

ID=36527525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077026116A KR20070120592A (ko) 2005-04-12 2006-03-09 전해질 및 주석-비스무트 합금층의 도금 방법

Country Status (5)

Country Link
JP (1) JP5278675B2 (de)
KR (1) KR20070120592A (de)
DE (1) DE102005016819B4 (de)
TW (1) TWI328052B (de)
WO (1) WO2006108476A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010106072A2 (de) * 2009-03-18 2010-09-23 Basf Se Elektrolyt und oberflächenaktive additive für die galvanische abscheidung glatter, dichter aluminium-schichten aus ionischen flüssigkeiten
KR20120095470A (ko) 2009-12-15 2012-08-28 바스프 에스이 전기화학 전지 및 배터리용 전해액 중의 첨가제로서의 티아졸 화합물
CN112701351B (zh) * 2020-12-29 2022-08-19 中国科学院宁波材料技术与工程研究所 一种非水性电解液及其制备方法以及一种锂离子电池
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法
CN115029745A (zh) * 2022-07-08 2022-09-09 云南锡业集团（控股）有限责任公司研发中心 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
KR960008155B1 (ko) * 1988-10-14 1996-06-20 엠 앤드 티 케미칼즈, 아이엔씨. 주석-비스무트 합금의 전기도금법
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JPH1025595A (ja) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd スズ及びスズ合金めっき浴
JP3292055B2 (ja) * 1996-09-03 2002-06-17 上村工業株式会社 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
JP2000100850A (ja) * 1998-09-24 2000-04-07 Ebara Udylite Kk 低融点金属バンプの形成方法
JP4077119B2 (ja) * 1999-06-30 2008-04-16 エヌ・イーケムキャット株式会社 錫−ビスマス合金電気めっき浴およびめっき方法
JP2001040497A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−ビスマス合金めっき皮膜で被覆された電子部品
US6706418B2 (en) * 2000-07-01 2004-03-16 Shipley Company L.L.C. Metal alloy compositions and plating methods related thereto
US6726827B2 (en) * 2002-01-17 2004-04-27 Lucent Technologies Inc. Electroplating solution for high speed plating of tin-bismuth solder
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
JP4524483B2 (ja) * 2004-04-28 2010-08-18 石原薬品株式会社 スズ又はスズ合金メッキ方法
JP4389083B2 (ja) * 2004-08-10 2009-12-24 石原薬品株式会社 鉛フリーのスズ−ビスマス系合金電気メッキ浴
JP4605359B2 (ja) * 2004-10-20 2011-01-05 石原薬品株式会社 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴
JP4273266B2 (ja) * 2005-03-23 2009-06-03 石原薬品株式会社 溶解電流抑制式のスズ合金電気メッキ方法

Also Published As

Publication number Publication date
WO2006108476A2 (de) 2006-10-19
DE102005016819A1 (de) 2006-10-19
JP5278675B2 (ja) 2013-09-04
TW200643231A (en) 2006-12-16
DE102005016819B4 (de) 2009-10-01
TWI328052B (en) 2010-08-01
WO2006108476A3 (de) 2007-05-31
JP2008536011A (ja) 2008-09-04

Similar Documents

Publication Publication Date Title
Goh et al. Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
CA2275214C (en) Process to electrolytically deposit copper layers
KR101992844B1 (ko) 고온 내성의 은 코팅된 기판
JP6111241B2 (ja) 銅の電解析出用水性酸浴、当該浴の使用、当該浴中のルテニウムイオンの使用、および、当該浴を用いた加工対象物上への銅の電解析出方法
CN1190523C (zh) 用于电镀锡－银合金镀层的电解液和方法
US7179362B2 (en) Electrolyte and method for depositing tin-copper alloy layers
CN101243210A (zh) 具有最小化锡晶须生长性能或特性的锡电沉积物
JP2005517814A (ja) 有機酸錯化剤を含む電気めっき溶液
JP4588185B2 (ja) アルカンスルホン酸塩電解質から銅の電気めっき
KR20110039460A (ko) 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물
KR20070120592A (ko) 전해질 및 주석-비스무트 합금층의 도금 방법
KR102174876B1 (ko) 주석 합금 도금액
KR20070086724A (ko) 중성에 가까운 ｐＨ를 갖는 주석 전기도금용액
KR20010042102A (ko) 니켈-텅스텐 합금용 연성제
JP2008536011A5 (de)
US6458264B1 (en) Sn-Cu alloy plating bath
JP2000328286A (ja) 錫−銀系合金電気めっき浴
US7122108B2 (en) Tin-silver electrolyte
JP3920983B2 (ja) 銀又は銀合金酸性電気めっき浴
JP2983548B2 (ja) スズービスマス合金の電気めっき法
US6726827B2 (en) Electroplating solution for high speed plating of tin-bismuth solder
US20070037005A1 (en) Tin-silver electrolyte
CZ20011633A3 (cs) Vodný roztok pro elektrolytické pokovování slitinami cínu a zinku
JP2002339095A (ja) スズ−ビスマス−銅合金の析出方法
JPH10204676A (ja) 錫−銀合金電気めっき浴及び錫−銀合金電気めっき方法

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination