CN101899691B - 一种在微波高频电路板上电镀锡铈铋合金的方法 - Google Patents
一种在微波高频电路板上电镀锡铈铋合金的方法 Download PDFInfo
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- CN101899691B CN101899691B CN2010102292557A CN201010229255A CN101899691B CN 101899691 B CN101899691 B CN 101899691B CN 2010102292557 A CN2010102292557 A CN 2010102292557A CN 201010229255 A CN201010229255 A CN 201010229255A CN 101899691 B CN101899691 B CN 101899691B
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- eleetrotinplate
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CN2010102292557A CN101899691B (zh) | 2010-07-16 | 2010-07-16 | 一种在微波高频电路板上电镀锡铈铋合金的方法 |
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CN101899691B true CN101899691B (zh) | 2012-05-23 |
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CN104047041B (zh) * | 2013-03-15 | 2017-04-26 | 深圳市九和咏精密电路有限公司 | 一种印刷电路板制备方法 |
CN105263271A (zh) * | 2015-11-09 | 2016-01-20 | 四川普瑞森电子有限公司 | 高频板线路亮边控制方法 |
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CN1044503A (zh) * | 1989-01-28 | 1990-08-08 | 刘建辉 | 铜质带材电镀锡铈合金生产工艺及其流水线 |
JP2005163152A (ja) * | 2003-12-05 | 2005-06-23 | Renesas Technology Corp | 電気メッキ方法及び半導体装置の製造方法 |
JP4605359B2 (ja) * | 2004-10-20 | 2011-01-05 | 石原薬品株式会社 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
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Application publication date: 20101201 Assignee: TAIZHOU BOTAI ELECTRONICS CO., LTD. Assignor: Shi Jilian Contract record no.: 2014320000488 Denomination of invention: Method for electroplating stannum-cerium-bismuth alloy on microwave high-frequency circuit board Granted publication date: 20120523 License type: Exclusive License Record date: 20140610 |
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Owner name: TAIZHOU BOTAI ELECTRONIC CO., LTD. Free format text: FORMER OWNER: SHI JILIAN Effective date: 20150326 |
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Effective date of registration: 20150326 Address after: 225300, Ma 10 road, Yongan Town, Taizhou port, Jiangsu, China Patentee after: TAIZHOU BOTAI ELECTRONICS CO., LTD. Address before: 225326 No. 1 Industrial Park, Yongan Town, high port area, Jiangsu, Taizhou Patentee before: Shi Jilian |