JP4559696B2 - 基体上に金属層を堆積させるためのメッキ浴および方法 - Google Patents

基体上に金属層を堆積させるためのメッキ浴および方法 Download PDF

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Publication number
JP4559696B2
JP4559696B2 JP2002289422A JP2002289422A JP4559696B2 JP 4559696 B2 JP4559696 B2 JP 4559696B2 JP 2002289422 A JP2002289422 A JP 2002289422A JP 2002289422 A JP2002289422 A JP 2002289422A JP 4559696 B2 JP4559696 B2 JP 4559696B2
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JP
Japan
Prior art keywords
acid
plating bath
copper
metal
salt
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002289422A
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English (en)
Japanese (ja)
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JP2003147572A5 (https=
JP2003147572A (ja
Inventor
アンドリュー・ジェイ・コブリー
マーク・ジェイ・カペッカス
エリック・レディントン
ウェイド・ソンネンバーグ
レオン・アール・バースタッド
トーマス・バックリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
DuPont Electronic Materials International LLC
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Publication of JP2003147572A5 publication Critical patent/JP2003147572A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2002289422A 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法 Expired - Fee Related JP4559696B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970171 2001-10-02
US09/970,171 US6911068B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009050496A Division JP5380113B2 (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法

Publications (3)

Publication Number Publication Date
JP2003147572A JP2003147572A (ja) 2003-05-21
JP2003147572A5 JP2003147572A5 (https=) 2006-07-13
JP4559696B2 true JP4559696B2 (ja) 2010-10-13

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ID=25516528

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002289422A Expired - Fee Related JP4559696B2 (ja) 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法
JP2009050496A Expired - Fee Related JP5380113B2 (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法

Family Applications After (1)

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JP2009050496A Expired - Fee Related JP5380113B2 (ja) 2001-10-02 2009-03-04 基体上に金属層を堆積させるためのメッキ浴および方法

Country Status (5)

Country Link
US (2) US6911068B2 (https=)
EP (1) EP1300488B1 (https=)
JP (2) JP4559696B2 (https=)
KR (1) KR20030028694A (https=)
TW (1) TWI248478B (https=)

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EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
CN103290438B (zh) * 2013-06-25 2015-12-02 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
KR102301625B1 (ko) * 2014-04-25 2021-09-10 가부시끼가이샤 제이씨유 동의 고속 충전 방법
KR101662759B1 (ko) * 2015-01-09 2016-10-10 건국대학교 글로컬산학협력단 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터
US20160355939A1 (en) * 2015-06-05 2016-12-08 Lam Research Corporation Polarization stabilizer additive for electroplating
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US20190256994A1 (en) * 2016-02-16 2019-08-22 Lumishield Technologies Incorporated Electrochemical Deposition of Elements in Aqueous Media
KR102277675B1 (ko) * 2018-11-07 2021-07-14 서울대학교산학협력단 브롬 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법
JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
CN109666926A (zh) * 2019-01-28 2019-04-23 安徽大地熊新材料股份有限公司 一种简单的粉体表面化学镀的方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
CN111188070A (zh) * 2020-01-22 2020-05-22 惠州中京电子科技有限公司 一种ic封装板电镀镍银金的制作方法
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Also Published As

Publication number Publication date
TWI248478B (en) 2006-02-01
JP2009167531A (ja) 2009-07-30
US20050139118A1 (en) 2005-06-30
JP5380113B2 (ja) 2014-01-08
US20040206631A1 (en) 2004-10-21
EP1300488A2 (en) 2003-04-09
EP1300488B1 (en) 2017-09-27
KR20030028694A (ko) 2003-04-10
EP1300488A3 (en) 2005-03-02
US6911068B2 (en) 2005-06-28
JP2003147572A (ja) 2003-05-21

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