TWI248478B - Plating bath and method for depositing a metal layer on a substrate - Google Patents

Plating bath and method for depositing a metal layer on a substrate Download PDF

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Publication number
TWI248478B
TWI248478B TW090129372A TW90129372A TWI248478B TW I248478 B TWI248478 B TW I248478B TW 090129372 A TW090129372 A TW 090129372A TW 90129372 A TW90129372 A TW 90129372A TW I248478 B TWI248478 B TW I248478B
Authority
TW
Taiwan
Prior art keywords
acid
plating bath
copper
group
alkyl
Prior art date
Application number
TW090129372A
Other languages
English (en)
Chinese (zh)
Inventor
Andrew J Cobley
Mark J Kapeckas
Erik Reddington
Wade Sonnenberg
Leon R Barstad
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Application granted granted Critical
Publication of TWI248478B publication Critical patent/TWI248478B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW090129372A 2001-10-02 2001-11-28 Plating bath and method for depositing a metal layer on a substrate TWI248478B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/970,171 US6911068B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate

Publications (1)

Publication Number Publication Date
TWI248478B true TWI248478B (en) 2006-02-01

Family

ID=25516528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129372A TWI248478B (en) 2001-10-02 2001-11-28 Plating bath and method for depositing a metal layer on a substrate

Country Status (5)

Country Link
US (2) US6911068B2 (https=)
EP (1) EP1300488B1 (https=)
JP (2) JP4559696B2 (https=)
KR (1) KR20030028694A (https=)
TW (1) TWI248478B (https=)

Cited By (2)

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CN103290438A (zh) * 2013-06-25 2013-09-11 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
CN111188070A (zh) * 2020-01-22 2020-05-22 惠州中京电子科技有限公司 一种ic封装板电镀镍银金的制作方法

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US9045839B2 (en) * 2008-06-10 2015-06-02 General Electric Company Methods and systems for in-situ electroplating of electrodes
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US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
EP2537962A1 (en) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Method for copper plating
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
KR102301625B1 (ko) * 2014-04-25 2021-09-10 가부시끼가이샤 제이씨유 동의 고속 충전 방법
KR101662759B1 (ko) * 2015-01-09 2016-10-10 건국대학교 글로컬산학협력단 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터
US20160355939A1 (en) * 2015-06-05 2016-12-08 Lam Research Corporation Polarization stabilizer additive for electroplating
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US20190256994A1 (en) * 2016-02-16 2019-08-22 Lumishield Technologies Incorporated Electrochemical Deposition of Elements in Aqueous Media
KR102277675B1 (ko) * 2018-11-07 2021-07-14 서울대학교산학협력단 브롬 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법
JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
CN109666926A (zh) * 2019-01-28 2019-04-23 安徽大地熊新材料股份有限公司 一种简单的粉体表面化学镀的方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
CN114134530A (zh) * 2022-01-19 2022-03-04 辽宁大学 Cu-P-100催化剂的制备方法及其在二氧化碳电催化还原中的应用
CN115449862B (zh) * 2022-10-11 2025-09-16 广东利尔化学有限公司 一种印刷电路板电镀铜液用光亮剂及其制备方法
CN115652378B (zh) * 2022-10-25 2025-06-24 常州大学 一种用于二次电铸镍网的含有偶氮类添加剂的电铸镍溶液
CN115928161B (zh) * 2022-12-29 2024-08-27 华为技术有限公司 电镀金镀液及其应用、金凸块及其制备方法、电子部件和电子设备

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103290438A (zh) * 2013-06-25 2013-09-11 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
CN103290438B (zh) * 2013-06-25 2015-12-02 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
CN111188070A (zh) * 2020-01-22 2020-05-22 惠州中京电子科技有限公司 一种ic封装板电镀镍银金的制作方法

Also Published As

Publication number Publication date
JP2009167531A (ja) 2009-07-30
JP4559696B2 (ja) 2010-10-13
US20050139118A1 (en) 2005-06-30
JP5380113B2 (ja) 2014-01-08
US20040206631A1 (en) 2004-10-21
EP1300488A2 (en) 2003-04-09
EP1300488B1 (en) 2017-09-27
KR20030028694A (ko) 2003-04-10
EP1300488A3 (en) 2005-03-02
US6911068B2 (en) 2005-06-28
JP2003147572A (ja) 2003-05-21

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