KR20030028694A - 기판상에 금속층을 침착시키기 위한 도금조 및 방법 - Google Patents

기판상에 금속층을 침착시키기 위한 도금조 및 방법 Download PDF

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Publication number
KR20030028694A
KR20030028694A KR1020010079154A KR20010079154A KR20030028694A KR 20030028694 A KR20030028694 A KR 20030028694A KR 1020010079154 A KR1020010079154 A KR 1020010079154A KR 20010079154 A KR20010079154 A KR 20010079154A KR 20030028694 A KR20030028694 A KR 20030028694A
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KR
South Korea
Prior art keywords
acid
alkyl
membered
branched
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020010079154A
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English (en)
Korean (ko)
Inventor
코블리앤드류제이.
카펙커스마크제이.
레딩턴에릭
소넨버그웨이드
바스태드레온알.
버클리토마스
Original Assignee
쉬플리 캄파니, 엘.엘.씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쉬플리 캄파니, 엘.엘.씨. filed Critical 쉬플리 캄파니, 엘.엘.씨.
Publication of KR20030028694A publication Critical patent/KR20030028694A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020010079154A 2001-10-02 2001-12-14 기판상에 금속층을 침착시키기 위한 도금조 및 방법 Withdrawn KR20030028694A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970,171 US6911068B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate
US09/970,171 2001-10-02

Publications (1)

Publication Number Publication Date
KR20030028694A true KR20030028694A (ko) 2003-04-10

Family

ID=25516528

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010079154A Withdrawn KR20030028694A (ko) 2001-10-02 2001-12-14 기판상에 금속층을 침착시키기 위한 도금조 및 방법

Country Status (5)

Country Link
US (2) US6911068B2 (https=)
EP (1) EP1300488B1 (https=)
JP (2) JP4559696B2 (https=)
KR (1) KR20030028694A (https=)
TW (1) TWI248478B (https=)

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* Cited by examiner, † Cited by third party
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KR20090111788A (ko) * 2008-04-22 2009-10-27 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 인듐 전기도금 조성물 내에 인듐 이온을 보충하는 방법
KR20160086209A (ko) * 2015-01-09 2016-07-19 건국대학교 글로컬산학협력단 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터

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US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
US20070175358A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution
ES2669050T3 (es) * 2006-03-31 2018-05-23 Atotech Deutschland Gmbh Depósito de cromo cristalino
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US7858146B2 (en) 2007-06-29 2010-12-28 Rohm And Haas Electronic Materials Llc Method of electrolessly depositing metal on the walls of through-holes
BRPI0817924B1 (pt) 2007-10-02 2019-02-12 Atotech Deutschland Gmbh Depósito de liga de cromo funcional cristalino eletrodepositado, banho de eletrodeposição para eletrodepositar um depósito de liga de cromo funcional cristalinonanogranular, e processo para eletrodepositar um depósito de liga de cromo cristalino funcional nanogranular em um substrato
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US9045839B2 (en) * 2008-06-10 2015-06-02 General Electric Company Methods and systems for in-situ electroplating of electrodes
US9657400B2 (en) * 2008-06-10 2017-05-23 General Electric Company Electrolyzer assembly method and system
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US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
EP2537962A1 (en) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Method for copper plating
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KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
CN103290438B (zh) * 2013-06-25 2015-12-02 深圳市创智成功科技有限公司 用于晶圆级封装的电镀铜溶液及电镀方法
KR102301625B1 (ko) * 2014-04-25 2021-09-10 가부시끼가이샤 제이씨유 동의 고속 충전 방법
US20160355939A1 (en) * 2015-06-05 2016-12-08 Lam Research Corporation Polarization stabilizer additive for electroplating
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US20190256994A1 (en) * 2016-02-16 2019-08-22 Lumishield Technologies Incorporated Electrochemical Deposition of Elements in Aqueous Media
KR102277675B1 (ko) * 2018-11-07 2021-07-14 서울대학교산학협력단 브롬 이온을 포함한 구리 전해도금용 전해질 용액 및 이를 이용한 구리 전해도금 방법
JP7107190B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板の製造方法
CN109666926A (zh) * 2019-01-28 2019-04-23 安徽大地熊新材料股份有限公司 一种简单的粉体表面化学镀的方法
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
US11434577B2 (en) * 2019-10-17 2022-09-06 Rohm And Haas Electronic Materials Llc Acid aqueous binary silver-bismuth alloy electroplating compositions and methods
CN111188070A (zh) * 2020-01-22 2020-05-22 惠州中京电子科技有限公司 一种ic封装板电镀镍银金的制作方法
CN114134530A (zh) * 2022-01-19 2022-03-04 辽宁大学 Cu-P-100催化剂的制备方法及其在二氧化碳电催化还原中的应用
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090111788A (ko) * 2008-04-22 2009-10-27 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 인듐 전기도금 조성물 내에 인듐 이온을 보충하는 방법
KR20160086209A (ko) * 2015-01-09 2016-07-19 건국대학교 글로컬산학협력단 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터

Also Published As

Publication number Publication date
TWI248478B (en) 2006-02-01
JP2009167531A (ja) 2009-07-30
JP4559696B2 (ja) 2010-10-13
US20050139118A1 (en) 2005-06-30
JP5380113B2 (ja) 2014-01-08
US20040206631A1 (en) 2004-10-21
EP1300488A2 (en) 2003-04-09
EP1300488B1 (en) 2017-09-27
EP1300488A3 (en) 2005-03-02
US6911068B2 (en) 2005-06-28
JP2003147572A (ja) 2003-05-21

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20011214

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid