JP4555835B2 - 多孔性担体を用いたダイのカプセル化 - Google Patents

多孔性担体を用いたダイのカプセル化 Download PDF

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Publication number
JP4555835B2
JP4555835B2 JP2006553132A JP2006553132A JP4555835B2 JP 4555835 B2 JP4555835 B2 JP 4555835B2 JP 2006553132 A JP2006553132 A JP 2006553132A JP 2006553132 A JP2006553132 A JP 2006553132A JP 4555835 B2 JP4555835 B2 JP 4555835B2
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Prior art keywords
carrier
porous carrier
porous
adhesive
die
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Expired - Fee Related
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JP2006553132A
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Japanese (ja)
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JP2007522675A (ja
JP2007522675A5 (enExample
Inventor
アール． フェイ、オーエン
エス． アムリーン、クレイグ
アール． リッシュ、ケビン
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NXP USA Inc
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NXP USA Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2006553132A 2004-02-09 2005-01-12 多孔性担体を用いたダイのカプセル化 Expired - Fee Related JP4555835B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/774,977 US7015075B2 (en) 2004-02-09 2004-02-09 Die encapsulation using a porous carrier
PCT/US2005/001529 WO2005076794A2 (en) 2004-02-09 2005-01-12 Die encapsulation using a porous carrier

Publications (3)

Publication Number Publication Date
JP2007522675A JP2007522675A (ja) 2007-08-09
JP2007522675A5 JP2007522675A5 (enExample) 2008-02-28
JP4555835B2 true JP4555835B2 (ja) 2010-10-06

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JP2006553132A Expired - Fee Related JP4555835B2 (ja) 2004-02-09 2005-01-12 多孔性担体を用いたダイのカプセル化

Country Status (6)

Country Link
US (1) US7015075B2 (enExample)
EP (1) EP1721332A2 (enExample)
JP (1) JP4555835B2 (enExample)
CN (1) CN1918702B (enExample)
TW (1) TWI389221B (enExample)
WO (1) WO2005076794A2 (enExample)

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Also Published As

Publication number Publication date
CN1918702B (zh) 2010-05-26
JP2007522675A (ja) 2007-08-09
EP1721332A2 (en) 2006-11-15
US7015075B2 (en) 2006-03-21
US20050176180A1 (en) 2005-08-11
WO2005076794A3 (en) 2006-01-19
TWI389221B (zh) 2013-03-11
WO2005076794A2 (en) 2005-08-25
TW200531189A (en) 2005-09-16
CN1918702A (zh) 2007-02-21

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