JP4554398B2 - 弾性表面波デバイス及び弾性表面波デバイスの製造方法 - Google Patents

弾性表面波デバイス及び弾性表面波デバイスの製造方法 Download PDF

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Publication number
JP4554398B2
JP4554398B2 JP2005058616A JP2005058616A JP4554398B2 JP 4554398 B2 JP4554398 B2 JP 4554398B2 JP 2005058616 A JP2005058616 A JP 2005058616A JP 2005058616 A JP2005058616 A JP 2005058616A JP 4554398 B2 JP4554398 B2 JP 4554398B2
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JP
Japan
Prior art keywords
acoustic wave
surface acoustic
element piece
package
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005058616A
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English (en)
Japanese (ja)
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JP2006245994A (ja
JP2006245994A5 (enExample
Inventor
祐一 竹林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2005058616A priority Critical patent/JP4554398B2/ja
Priority to US11/354,182 priority patent/US7436105B2/en
Publication of JP2006245994A publication Critical patent/JP2006245994A/ja
Priority to US11/878,539 priority patent/US8191228B2/en
Publication of JP2006245994A5 publication Critical patent/JP2006245994A5/ja
Application granted granted Critical
Publication of JP4554398B2 publication Critical patent/JP4554398B2/ja
Priority to US13/452,334 priority patent/US8513862B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2005058616A 2005-03-03 2005-03-03 弾性表面波デバイス及び弾性表面波デバイスの製造方法 Expired - Fee Related JP4554398B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005058616A JP4554398B2 (ja) 2005-03-03 2005-03-03 弾性表面波デバイス及び弾性表面波デバイスの製造方法
US11/354,182 US7436105B2 (en) 2005-03-03 2006-02-15 Package structure for surface acoustic wave device, and surface acoustic wave device
US11/878,539 US8191228B2 (en) 2005-03-03 2007-07-25 Package structure for surface acoustic wave device, and surface acoustic wave device
US13/452,334 US8513862B2 (en) 2005-03-03 2012-04-20 Surface acoustic wave device with reduced size and thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005058616A JP4554398B2 (ja) 2005-03-03 2005-03-03 弾性表面波デバイス及び弾性表面波デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2006245994A JP2006245994A (ja) 2006-09-14
JP2006245994A5 JP2006245994A5 (enExample) 2007-08-30
JP4554398B2 true JP4554398B2 (ja) 2010-09-29

Family

ID=37009193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005058616A Expired - Fee Related JP4554398B2 (ja) 2005-03-03 2005-03-03 弾性表面波デバイス及び弾性表面波デバイスの製造方法

Country Status (2)

Country Link
US (3) US7436105B2 (enExample)
JP (1) JP4554398B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554398B2 (ja) * 2005-03-03 2010-09-29 セイコーエプソン株式会社 弾性表面波デバイス及び弾性表面波デバイスの製造方法
JP2009232150A (ja) * 2008-03-24 2009-10-08 Epson Toyocom Corp 圧電デバイスおよび圧電デバイスの製造方法
TWI420810B (zh) 2010-12-17 2013-12-21 Ind Tech Res Inst 石英振盪器及其製造方法
JP6354939B2 (ja) 2014-04-18 2018-07-11 セイコーエプソン株式会社 半導体集積回路、発振器、電子機器及び移動体
JP1565481S (enExample) * 2016-05-25 2016-12-19
USD857020S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471259A (en) * 1982-08-26 1984-09-11 Motorola Inc. Crystal package for a high-G environment
US5250870A (en) * 1992-03-25 1993-10-05 Motorola, Inc. Ultra-thin surface mount crystal package
JPH05291864A (ja) * 1992-04-10 1993-11-05 Matsushita Electric Ind Co Ltd 弾性表面波素子実装回路とその製造方法
JP2863426B2 (ja) * 1993-11-24 1999-03-03 シャープ株式会社 半導体装置の実装構造及びその実装方法
JPH0983248A (ja) * 1995-09-12 1997-03-28 Takaya Watanabe 表面実装型水晶発振器
JP3257372B2 (ja) * 1995-10-03 2002-02-18 松下電器産業株式会社 発振器
JPH09148375A (ja) * 1995-11-24 1997-06-06 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
EP0810725A3 (en) * 1996-05-29 1999-10-27 Santech Company, Limited Wafer and surface acoustic wave device
JP2974622B2 (ja) * 1996-09-20 1999-11-10 松下電器産業株式会社 発振器
JPH10150273A (ja) * 1996-11-20 1998-06-02 Kokusai Electric Co Ltd 弾性表面波素子チップを有する高密度実装基板
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
JP3876552B2 (ja) * 1998-10-01 2007-01-31 セイコーエプソン株式会社 Ｓａｗ発振器
JP2000323927A (ja) * 1999-05-13 2000-11-24 Toyo Commun Equip Co Ltd 圧電発振器
JP2001102870A (ja) * 1999-09-30 2001-04-13 Meidensha Corp 水晶発振器
US6456168B1 (en) * 2000-12-29 2002-09-24 Cts Corporation Temperature compensated crystal oscillator assembled on crystal base
JP2002231839A (ja) * 2001-02-01 2002-08-16 Matsushita Electric Ind Co Ltd 電子部品の製造方法およびこれに用いる製造装置
JP3444420B2 (ja) * 2001-03-26 2003-09-08 セイコーエプソン株式会社 弾性表面波装置及びその製造方法
JP2002290184A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 弾性表面波装置及びその製造方法
JP3937840B2 (ja) * 2002-01-10 2007-06-27 株式会社日立製作所 高周波モジュール
JP2003218667A (ja) * 2002-01-28 2003-07-31 Matsushita Electric Ind Co Ltd 電子部品
JP2004343398A (ja) * 2003-05-15 2004-12-02 Toyo Commun Equip Co Ltd 圧電発振器
JP2004364041A (ja) * 2003-06-05 2004-12-24 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
JP4244865B2 (ja) * 2004-06-03 2009-03-25 セイコーエプソン株式会社 圧電発振器および電子機器
JP2006013681A (ja) * 2004-06-23 2006-01-12 Seiko Epson Corp 圧電発振器および圧電発振器用パッケージ
US7157836B2 (en) * 2004-10-19 2007-01-02 Seiko Epson Corporation Piezoelectric device
JP4554398B2 (ja) * 2005-03-03 2010-09-29 セイコーエプソン株式会社 弾性表面波デバイス及び弾性表面波デバイスの製造方法
JP4151711B2 (ja) * 2006-05-24 2008-09-17 エプソントヨコム株式会社 圧電デバイス
JP2010232806A (ja) * 2009-03-26 2010-10-14 Seiko Epson Corp 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法
US8155366B2 (en) * 2009-05-15 2012-04-10 Mwm Acoustics, Llc Transducer package with interior support frame

Also Published As

Publication number Publication date
US20060207915A1 (en) 2006-09-21
US8191228B2 (en) 2012-06-05
US8513862B2 (en) 2013-08-20
JP2006245994A (ja) 2006-09-14
US20120206871A1 (en) 2012-08-16
US7436105B2 (en) 2008-10-14
US20080016665A1 (en) 2008-01-24

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