JP4515133B2 - 搬送装置及びその制御方法並びに真空処理装置 - Google Patents

搬送装置及びその制御方法並びに真空処理装置 Download PDF

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Publication number
JP4515133B2
JP4515133B2 JP2004109683A JP2004109683A JP4515133B2 JP 4515133 B2 JP4515133 B2 JP 4515133B2 JP 2004109683 A JP2004109683 A JP 2004109683A JP 2004109683 A JP2004109683 A JP 2004109683A JP 4515133 B2 JP4515133 B2 JP 4515133B2
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JP
Japan
Prior art keywords
drive
arm
arms
transport
link mechanism
Prior art date
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Expired - Lifetime
Application number
JP2004109683A
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English (en)
Japanese (ja)
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JP2005294662A (ja
JP2005294662A5 (enExample
Inventor
展史 南
健二 吾郷
崇文 川口
土志夫 小池
純平 湯山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2004109683A priority Critical patent/JP4515133B2/ja
Priority to KR1020050026885A priority patent/KR101143287B1/ko
Priority to US11/095,649 priority patent/US7572093B2/en
Priority to TW094110563A priority patent/TW200536689A/zh
Priority to CNB200510062636XA priority patent/CN100463783C/zh
Publication of JP2005294662A publication Critical patent/JP2005294662A/ja
Publication of JP2005294662A5 publication Critical patent/JP2005294662A5/ja
Application granted granted Critical
Publication of JP4515133B2 publication Critical patent/JP4515133B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2004109683A 2004-04-02 2004-04-02 搬送装置及びその制御方法並びに真空処理装置 Expired - Lifetime JP4515133B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004109683A JP4515133B2 (ja) 2004-04-02 2004-04-02 搬送装置及びその制御方法並びに真空処理装置
KR1020050026885A KR101143287B1 (ko) 2004-04-02 2005-03-31 반송장치 및 그 제어방법 그리고 진공처리장치
US11/095,649 US7572093B2 (en) 2004-04-02 2005-04-01 Transport apparatus, control method for the same, and vacuum processing system
TW094110563A TW200536689A (en) 2004-04-02 2005-04-01 Carrying device, method of controlling the same, and vacuum processing device
CNB200510062636XA CN100463783C (zh) 2004-04-02 2005-04-01 移送装置及其控制方法以及真空处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004109683A JP4515133B2 (ja) 2004-04-02 2004-04-02 搬送装置及びその制御方法並びに真空処理装置

Publications (3)

Publication Number Publication Date
JP2005294662A JP2005294662A (ja) 2005-10-20
JP2005294662A5 JP2005294662A5 (enExample) 2007-04-05
JP4515133B2 true JP4515133B2 (ja) 2010-07-28

Family

ID=35049108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004109683A Expired - Lifetime JP4515133B2 (ja) 2004-04-02 2004-04-02 搬送装置及びその制御方法並びに真空処理装置

Country Status (5)

Country Link
US (1) US7572093B2 (enExample)
JP (1) JP4515133B2 (enExample)
KR (1) KR101143287B1 (enExample)
CN (1) CN100463783C (enExample)
TW (1) TW200536689A (enExample)

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US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
KR101191074B1 (ko) * 2007-05-15 2012-10-15 가부시키가이샤 알박 반송 장치 및 이것을 사용한 진공 처리 장치
CN103862463B (zh) * 2007-05-31 2017-08-15 应用材料公司 延伸双scara机械手连接装置的伸出距离的方法及设备
WO2009096373A1 (ja) * 2008-01-31 2009-08-06 Canon Anelva Corporation 真空搬送装置
JP5150608B2 (ja) * 2009-11-20 2013-02-20 株式会社アルバック 搬送装置及び真空装置
JP5395271B2 (ja) 2010-08-17 2014-01-22 キヤノンアネルバ株式会社 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法
ITBO20120015A1 (it) * 2012-01-16 2013-07-17 Marchesini Group Spa Apparato per introdurre articoli all'interno di astucci
JP6349947B2 (ja) * 2013-11-19 2018-07-04 株式会社ジェイテクト 搬送装置
CN103904008B (zh) * 2014-03-20 2016-08-17 上海华力微电子有限公司 一种半导体设备的机械臂的动态传感器结构
CN106298583B (zh) * 2015-05-27 2019-12-03 中微半导体设备(上海)股份有限公司 处理腔、处理腔和真空锁组合以及基片处理系统
CN105598971A (zh) * 2016-02-03 2016-05-25 先驱智能机械（深圳）有限公司 机械手臂的控制系统
CN105500385A (zh) * 2016-02-03 2016-04-20 先驱智能机械（深圳）有限公司 机械手臂的控制方法
CN114709124A (zh) * 2017-06-14 2022-07-05 株式会社爱发科 真空处理装置
JP7506971B2 (ja) * 2019-07-23 2024-06-27 川崎重工業株式会社 ブレード間隔調整装置
CN211208421U (zh) * 2020-03-05 2020-08-07 福建北电新材料科技有限公司 一种可拆卸蚀刻多片碳化硅蚀刻工装治具
CN112234008B (zh) * 2020-09-03 2023-05-30 北京晶亦精微科技股份有限公司 用于晶圆的夹取及传输机构、cmp抛光设备
CN117124339A (zh) * 2023-09-05 2023-11-28 上海广川科技有限公司 一种基于磁流体的紧凑型同心两轴真空机器人传动结构

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3204115A (en) * 1961-07-31 1965-08-31 Rca Corp Four-terminal solid state superconductive device with control current flowing transverse to controlled output current
JPH0773833B2 (ja) * 1992-04-23 1995-08-09 アプライド マテリアルズ インコーポレイテッド ロボット・アセンブリ
WO1994023911A1 (en) * 1993-04-16 1994-10-27 Brooks Automation, Inc. Articulated arm transfer device
US5647724A (en) * 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
JP3204115B2 (ja) * 1996-01-25 2001-09-04 ダイキン工業株式会社 ワーク搬送ロボット
US5954840A (en) * 1996-06-13 1999-09-21 Genmark Automation Universally tiltable Z axis drive arm
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
JPH11198070A (ja) * 1998-01-12 1999-07-27 Shin Meiwa Ind Co Ltd 搬送装置
KR20010052275A (ko) * 1998-04-29 2001-06-25 에프씨아이스-헤르토겐보시 비.브이. 2개의 평행한 링크 기구를 포함하는 장치
JP2000042952A (ja) * 1998-07-27 2000-02-15 Hitachi Ltd 搬送装置及び搬送方法
US6464448B1 (en) * 1998-09-01 2002-10-15 Brooks Automation, Inc. Substrate transport apparatus
US20010033788A1 (en) * 1998-09-03 2001-10-25 Pietrantonio Antonio F. Dual multitran robot arm
JP3926501B2 (ja) * 1998-11-13 2007-06-06 ナブテスコ株式会社 ロボットアーム及びその駆動装置
JP2001118905A (ja) * 1999-10-20 2001-04-27 Hitachi Ltd 搬送方法及び搬送装置
JP4227298B2 (ja) * 1999-12-02 2009-02-18 ローツェ株式会社 搬送用ロボット
JP4489999B2 (ja) 2000-10-24 2010-06-23 株式会社アルバック 搬送装置及び真空処理装置
US6840732B2 (en) * 2000-10-24 2005-01-11 Ulvac, Inc. Transport apparatus and vacuum processing system using the same
CN2461719Y (zh) * 2000-12-19 2001-11-28 沈宗麟 多连杆式机械手
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置

Also Published As

Publication number Publication date
CN100463783C (zh) 2009-02-25
KR101143287B1 (ko) 2012-05-08
TWI339611B (enExample) 2011-04-01
CN1676285A (zh) 2005-10-05
US20050232744A1 (en) 2005-10-20
KR20060045058A (ko) 2006-05-16
JP2005294662A (ja) 2005-10-20
TW200536689A (en) 2005-11-16
US7572093B2 (en) 2009-08-11

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