CN100463783C - 移送装置及其控制方法以及真空处理装置 - Google Patents

移送装置及其控制方法以及真空处理装置 Download PDF

Info

Publication number
CN100463783C
CN100463783C CNB200510062636XA CN200510062636A CN100463783C CN 100463783 C CN100463783 C CN 100463783C CN B200510062636X A CNB200510062636X A CN B200510062636XA CN 200510062636 A CN200510062636 A CN 200510062636A CN 100463783 C CN100463783 C CN 100463783C
Authority
CN
China
Prior art keywords
aforementioned
arm
linkage
actuating arm
driving shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200510062636XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1676285A (zh
Inventor
南展史
吾乡健二
川口崇文
小池土志夫
汤山纯平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN1676285A publication Critical patent/CN1676285A/zh
Application granted granted Critical
Publication of CN100463783C publication Critical patent/CN100463783C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CNB200510062636XA 2004-04-02 2005-04-01 移送装置及其控制方法以及真空处理装置 Expired - Fee Related CN100463783C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP109683/2004 2004-04-02
JP2004109683A JP4515133B2 (ja) 2004-04-02 2004-04-02 搬送装置及びその制御方法並びに真空処理装置
JP109683/04 2004-04-02

Publications (2)

Publication Number Publication Date
CN1676285A CN1676285A (zh) 2005-10-05
CN100463783C true CN100463783C (zh) 2009-02-25

Family

ID=35049108

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200510062636XA Expired - Fee Related CN100463783C (zh) 2004-04-02 2005-04-01 移送装置及其控制方法以及真空处理装置

Country Status (5)

Country Link
US (1) US7572093B2 (enExample)
JP (1) JP4515133B2 (enExample)
KR (1) KR101143287B1 (enExample)
CN (1) CN100463783C (enExample)
TW (1) TW200536689A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
KR101191074B1 (ko) * 2007-05-15 2012-10-15 가부시키가이샤 알박 반송 장치 및 이것을 사용한 진공 처리 장치
CN103862463B (zh) * 2007-05-31 2017-08-15 应用材料公司 延伸双scara机械手连接装置的伸出距离的方法及设备
WO2009096373A1 (ja) * 2008-01-31 2009-08-06 Canon Anelva Corporation 真空搬送装置
JP5150608B2 (ja) * 2009-11-20 2013-02-20 株式会社アルバック 搬送装置及び真空装置
JP5395271B2 (ja) 2010-08-17 2014-01-22 キヤノンアネルバ株式会社 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法
ITBO20120015A1 (it) * 2012-01-16 2013-07-17 Marchesini Group Spa Apparato per introdurre articoli all'interno di astucci
JP6349947B2 (ja) * 2013-11-19 2018-07-04 株式会社ジェイテクト 搬送装置
CN103904008B (zh) * 2014-03-20 2016-08-17 上海华力微电子有限公司 一种半导体设备的机械臂的动态传感器结构
CN106298583B (zh) * 2015-05-27 2019-12-03 中微半导体设备(上海)股份有限公司 处理腔、处理腔和真空锁组合以及基片处理系统
CN105598971A (zh) * 2016-02-03 2016-05-25 先驱智能机械（深圳）有限公司 机械手臂的控制系统
CN105500385A (zh) * 2016-02-03 2016-04-20 先驱智能机械（深圳）有限公司 机械手臂的控制方法
CN114709124A (zh) * 2017-06-14 2022-07-05 株式会社爱发科 真空处理装置
JP7506971B2 (ja) * 2019-07-23 2024-06-27 川崎重工業株式会社 ブレード間隔調整装置
CN211208421U (zh) * 2020-03-05 2020-08-07 福建北电新材料科技有限公司 一种可拆卸蚀刻多片碳化硅蚀刻工装治具
CN112234008B (zh) * 2020-09-03 2023-05-30 北京晶亦精微科技股份有限公司 用于晶圆的夹取及传输机构、cmp抛光设备
CN117124339A (zh) * 2023-09-05 2023-11-28 上海广川科技有限公司 一种基于磁流体的紧凑型同心两轴真空机器人传动结构

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
US5899658A (en) * 1993-04-16 1999-05-04 Brooks Automation Inc. Articulated arm transfer device
US5954840A (en) * 1996-06-13 1999-09-21 Genmark Automation Universally tiltable Z axis drive arm
CN1292743A (zh) * 1998-04-29 2001-04-25 Fci赫托根博斯有限公司 包括两平行连杆机构的装置
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
US20010033788A1 (en) * 1998-09-03 2001-10-25 Pietrantonio Antonio F. Dual multitran robot arm
CN2461719Y (zh) * 2000-12-19 2001-11-28 沈宗麟 多连杆式机械手
US6464448B1 (en) * 1998-09-01 2002-10-15 Brooks Automation, Inc. Substrate transport apparatus
CN1437240A (zh) * 2002-01-28 2003-08-20 三星电子株式会社 对中机构、对中装置、半导体制造装置及对中方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3204115A (en) * 1961-07-31 1965-08-31 Rca Corp Four-terminal solid state superconductive device with control current flowing transverse to controlled output current
JPH0773833B2 (ja) * 1992-04-23 1995-08-09 アプライド マテリアルズ インコーポレイテッド ロボット・アセンブリ
US5647724A (en) * 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders
JP3204115B2 (ja) * 1996-01-25 2001-09-04 ダイキン工業株式会社 ワーク搬送ロボット
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
JPH11198070A (ja) * 1998-01-12 1999-07-27 Shin Meiwa Ind Co Ltd 搬送装置
JP2000042952A (ja) * 1998-07-27 2000-02-15 Hitachi Ltd 搬送装置及び搬送方法
JP3926501B2 (ja) * 1998-11-13 2007-06-06 ナブテスコ株式会社 ロボットアーム及びその駆動装置
JP2001118905A (ja) * 1999-10-20 2001-04-27 Hitachi Ltd 搬送方法及び搬送装置
JP4227298B2 (ja) * 1999-12-02 2009-02-18 ローツェ株式会社 搬送用ロボット
JP4489999B2 (ja) 2000-10-24 2010-06-23 株式会社アルバック 搬送装置及び真空処理装置
US6840732B2 (en) * 2000-10-24 2005-01-11 Ulvac, Inc. Transport apparatus and vacuum processing system using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5899658A (en) * 1993-04-16 1999-05-04 Brooks Automation Inc. Articulated arm transfer device
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
US5954840A (en) * 1996-06-13 1999-09-21 Genmark Automation Universally tiltable Z axis drive arm
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
CN1292743A (zh) * 1998-04-29 2001-04-25 Fci赫托根博斯有限公司 包括两平行连杆机构的装置
US6464448B1 (en) * 1998-09-01 2002-10-15 Brooks Automation, Inc. Substrate transport apparatus
US20010033788A1 (en) * 1998-09-03 2001-10-25 Pietrantonio Antonio F. Dual multitran robot arm
CN2461719Y (zh) * 2000-12-19 2001-11-28 沈宗麟 多连杆式机械手
CN1437240A (zh) * 2002-01-28 2003-08-20 三星电子株式会社 对中机构、对中装置、半导体制造装置及对中方法

Also Published As

Publication number Publication date
KR101143287B1 (ko) 2012-05-08
JP4515133B2 (ja) 2010-07-28
TWI339611B (enExample) 2011-04-01
CN1676285A (zh) 2005-10-05
US20050232744A1 (en) 2005-10-20
KR20060045058A (ko) 2006-05-16
JP2005294662A (ja) 2005-10-20
TW200536689A (en) 2005-11-16
US7572093B2 (en) 2009-08-11

Similar Documents

Publication Publication Date Title
CN100463783C (zh) 移送装置及其控制方法以及真空处理装置
CN100584546C (zh) 移送装置及其控制方法以及真空处理装置
JP4930949B2 (ja) 基板搬送装置
US20200030968A1 (en) Robot Having Arm with Unequal Link Lengths
JP4750231B2 (ja) ワークピース処理システム
US20030223853A1 (en) Dual arm substrate transport apparatus
KR101191074B1 (ko) 반송 장치 및 이것을 사용한 진공 처리 장치
KR100521608B1 (ko) 핸들링용로봇
KR100351570B1 (ko) 천정반송장치 및 천정반송차
JP7079604B2 (ja) 不等リンク長を有するアームを有するロボット
WO2000007780A1 (en) Robot having multiple degrees of freedom
JP2008135630A (ja) 基板搬送装置
KR101044586B1 (ko) 기판 반송 방법
WO2010041562A1 (ja) 基板搬送ロボットおよびシステム
TW201145430A (en) Conveyance arm and conveyance robot with same
US20080121064A1 (en) Robot with belt-drive system
KR0135265B1 (ko) 콘베이어의 용기공급장치
KR20100008688A (ko) 기판반송로봇
KR0119135Y1 (ko) 웨이퍼 반송 시스템의 피벗 암 장치
US11735466B2 (en) Asymmetric dual end effector robot arm
JP2004323165A (ja) 基板搬送装置
CN106926246B (zh) 一种真空环境中使用的机械臂
JP5474328B2 (ja) 基板搬送ロボット
JP2002222845A (ja) 基板搬送用ロボット
JP5309324B2 (ja) 基板搬送システム

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090225

Termination date: 20210401

CF01 Termination of patent right due to non-payment of annual fee