JP7407163B2 - 搬送システム、搬送方法および搬送装置 - Google Patents
搬送システム、搬送方法および搬送装置 Download PDFInfo
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- JP7407163B2 JP7407163B2 JP2021190771A JP2021190771A JP7407163B2 JP 7407163 B2 JP7407163 B2 JP 7407163B2 JP 2021190771 A JP2021190771 A JP 2021190771A JP 2021190771 A JP2021190771 A JP 2021190771A JP 7407163 B2 JP7407163 B2 JP 7407163B2
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
5 搬送装置
10 ロボット
10A 第1ロボット
10B 第2ロボット
10C 第3ロボット
10E 第4ロボット
11 第1アーム
12 第2アーム
13 ハンド
15 昇降機構
16 スライダ
17 ダブルフォークハンド
20 コントローラ
21 制御部
21a 取得部
21b 動作制御部
22 記憶部
22a 教示情報
100 搬送室
100f 床
100sw 側壁
101 連通口
110 移動式バッファ
111 保持モジュール
111a 支持部
111b 屈曲部
111b1 突出部
111b2 支柱部
111b3 折返し部
111c1、111c2 保持部
111s リフト式保持モジュール
112 駆動モジュール(移動子)
112r 凹部
115 連結モジュール
120 軌道
120a 固定子
120b ガイド
120r 凸部
121 直線軌道
122 曲線軌道(湾曲部)
AL リフト軸
AH1 第1回転軸
AH2 第2回転軸
AH3 第3回転軸
AV 昇降軸
B ベース部
CW 基板中心
F フランジ
J ジョイント
LL ロードロック室
ML 移動経路
P 台座
PC 処理室
S 基板検出センサ
W 基板
Claims (20)
- 減圧雰囲気にて基板に対する処理を行う複数の処理室が側壁に設けられ、減圧雰囲気にて前記基板を搬送する搬送室
を備え、
前記搬送室は、
前記搬送室内に固定され、前記基板を搬送する複数のロボットと、
前記基板を保持し、前記側壁と前記ロボットとの間を前記側壁に沿う水平向きに移動する移動式バッファと
を備え、
前記ロボットは、
当該ロボットといずれかの前記処理室との間に移動した前記移動式バッファと連携することによって当該移動式バッファと当該処理室との間で前記基板の受け渡しを行うこと
を特徴とする搬送システム。 - 前記搬送室は、
減圧雰囲気と大気圧雰囲気との間で内圧を変動させるロードロック室が側壁に設けられ、
複数の前記ロボットのうち少なくとも1つは、
前記移動式バッファと、前記処理室または前記ロードロック室との間で前記基板の受け渡しを行うこと
を特徴とする請求項1に記載の搬送システム。 - 前記移動式バッファは、
前記ロボットからみて前記側壁の正面に停止可能であること
を特徴とする請求項1または2に記載の搬送システム。 - 前記搬送室は、
前記搬送室内に固定される軌道
を備え、
前記移動式バッファは、
前記基板を保持する保持モジュールと、
リニアモータにおける移動子に対応する駆動モジュールと
を備え、
前記駆動モジュールは、
前記軌道に含まれる固定子によって非接触駆動されること
を特徴とする請求項1、2または3に記載の搬送システム。 - 前記保持モジュールは、
上下2段で前記基板を保持する保持部
を備えることを特徴とする請求項4に記載の搬送システム。 - 前記側壁は、
上面視で直線状であり、水平向きに並んだ複数の前記処理室がそれぞれ設けられ、
複数の前記ロボットは、
前記処理室の並び向きに沿って設けられ、
前記軌道は、
前記ロボットよりも前記側壁に近い位置に固定され、前記並び向きに沿う直線軌道であること
を特徴とする請求項4または5に記載の搬送システム。 - 前記直線軌道は、
両端のうち少なくとも一端に前記側壁から遠ざかる向きに湾曲した湾曲部
を備えることを特徴とする請求項6に記載の搬送システム。 - 前記搬送室は、
上面視で矩形状であり、矩形の長辺に対応する前記側壁である第1側壁および第2側壁
を備え、
前記第1側壁と前記ロボットとの間に設けられる前記直線軌道である第1直線軌道と、
前記第2側壁と前記ロボットとの間に設けられる前記直線軌道である第2直線軌道と
を備えることを特徴とする請求項6または7に記載の搬送システム。 - 前記搬送室は、
前記第1直線軌道および前記第2直線軌道の一端同士をつなぐ第1曲線軌道
を備えることを特徴とする請求項8に記載の搬送システム。 - 前記搬送室は、
前記第1直線軌道および前記第2直線軌道の他端同士をつなぐ第2曲線軌道
を備えることを特徴とする請求項9に記載の搬送システム。 - 前記移動式バッファは、
1つの前記軌道に対して複数設けられ、それぞれ独立して移動可能であること
を特徴とする請求項4~10のいずれか一つに記載の搬送システム。 - 前記移動式バッファは、
1つの前記軌道に対して複数設けられ、お互いに連結されること
を特徴とする請求項4~10のいずれか一つに記載の搬送システム。 - 前記移動式バッファは、
2つの前記保持モジュールと、
1つの前記駆動モジュールと
を備え、
前記保持モジュールは、
前記駆動モジュールにおける水平向きの両端にそれぞれ連結されること
を特徴とする請求項4~10のいずれか一つに記載の搬送システム。 - 複数の前記ロボットは、
鉛直向きに1自由度で水平向きに2自由度の3自由度のロボットである第1ロボット
を含み、
前記第1ロボットは、
前記処理室の正面に配置されること
を特徴とする請求項1~13のいずれか一つに記載の搬送システム。 - 前記ロボットは、
前記基板を保持するフォーク部を背中合わせに2つ結合したハンド
を備えることを特徴とする請求項14に記載の搬送システム。 - 複数の前記ロボットは、
鉛直向きに1自由度で水平向きに3自由度以上の4自由度以上のロボットである第2ロボット
を含み、
前記第2ロボットは、
前記ロードロック室および前記処理室、または、前記側壁において隣り合う複数の前記処理室にアクセスすること
を特徴とする請求項2に記載の搬送システム。 - 複数の前記ロボットは、
水平向きに2自由度のアームを双腕とし、鉛直向きに1自由度の第3ロボット
を含み、
前記第3ロボットは、
複数の前記ロボットのうち前記ロードロック室に最も近い位置に配置されること
を特徴とする請求項2または16に記載の搬送システム。 - 複数の前記ロボットは、
水平向きに2自由度の2自由度のロボットである第4ロボット
を含み、
前記移動式バッファは、
前記基板を昇降させるリフタ
を備えることを特徴とする請求項1~13のいずれか一つに記載の搬送システム。 - 減圧雰囲気にて基板に対する処理を行う複数の処理室が側壁に設けられ、減圧雰囲気にて前記基板を搬送する搬送室
を用い、
前記搬送室は、
前記搬送室内に固定され、前記基板を搬送する複数のロボットと、
前記基板を保持し、前記側壁と前記ロボットとの間を前記側壁に沿う水平向きに移動する移動式バッファと
を備えており、
前記ロボットは、
当該ロボットといずれかの前記処理室との間に移動した前記移動式バッファと連携することによって当該移動式バッファと当該処理室との間で前記基板の受け渡しを行うこと
を特徴とする搬送方法。 - 減圧雰囲気にて基板に対する処理を行う複数の処理室が側壁に設けられており減圧雰囲気にて前記基板を搬送する搬送室内に固定され、前記基板を搬送する複数のロボットと、
前記基板を保持し、前記搬送室内における前記側壁と前記ロボットとの間を前記側壁に沿う水平向きに移動する移動式バッファと、
前記ロボットといずれかの前記処理室との間に移動した前記移動式バッファとを連携させることによって当該移動式バッファと当該処理室との間で当該ロボットに前記基板の受け渡しを行わせるコントローラと
を備えることを特徴とする搬送装置。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010014269A1 (en) | 1997-08-11 | 2001-08-16 | Robert Hartlage | High throughput wafer transfer mechanism |
JP2003197709A (ja) | 2001-12-25 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
JP2003282669A (ja) | 2002-03-26 | 2003-10-03 | Hitachi High-Technologies Corp | 基板の搬送方法及びその装置 |
JP2008510317A (ja) | 2004-08-17 | 2008-04-03 | マットソン テクノロジイ インコーポレイテッド | 高度な低コスト・高スループット処理プラットフォーム |
WO2019161169A1 (en) | 2018-02-15 | 2019-08-22 | Lam Research Corporation | Moving substrate transfer chamber |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0419081A (ja) * | 1990-05-15 | 1992-01-23 | Seiko Instr Inc | 真空内搬送ロボット |
US8112177B2 (en) * | 2005-07-15 | 2012-02-07 | Kabushiki Kaisha Yaskawa Denki | Wafer position teaching method and teaching tool |
ATE525742T1 (de) * | 2005-10-19 | 2011-10-15 | Nikon Corp | Artikellade-/-entladeverfahren und artikellade-/- entladeeinrichtung, belichtungsverfahren und belichtungsvorrichtung und verfahren zur bauelementeherstellung |
JP4660434B2 (ja) | 2006-07-21 | 2011-03-30 | 株式会社安川電機 | 搬送機構およびそれを備えた処理装置 |
KR100830575B1 (ko) | 2006-09-26 | 2008-05-21 | 삼성전자주식회사 | 플래시 메모리 장치 및 그것의 멀티-블록 소거 방법 |
US20080145191A1 (en) * | 2006-11-15 | 2008-06-19 | Sokudo Co., Ltd. | Actively chilled substrate transport module |
CN102046338B (zh) * | 2008-05-27 | 2014-05-07 | 日商乐华股份有限公司 | 输送装置、位置示教方法以及传感器夹具 |
JP6006643B2 (ja) * | 2011-01-20 | 2016-10-12 | 東京エレクトロン株式会社 | 真空処理装置 |
TWI629743B (zh) * | 2012-02-10 | 2018-07-11 | 布魯克斯自動機械公司 | 基材處理設備 |
JP5885528B2 (ja) * | 2012-02-14 | 2016-03-15 | 株式会社安川電機 | 搬送装置 |
US9293317B2 (en) * | 2012-09-12 | 2016-03-22 | Lam Research Corporation | Method and system related to semiconductor processing equipment |
US9558974B2 (en) * | 2012-09-27 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing station and method for processing semiconductor wafer |
US20140234057A1 (en) * | 2013-02-15 | 2014-08-21 | Jacob Newman | Apparatus And Methods For Moving Wafers |
JP2014216519A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社ディスコ | 加工装置及びウエーハの輸送方法 |
JP2015178161A (ja) * | 2014-03-19 | 2015-10-08 | 株式会社安川電機 | 搬送ロボットおよび搬送システム |
TWI676227B (zh) * | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | 半導體工藝設備 |
US9929034B2 (en) * | 2015-09-03 | 2018-03-27 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer device |
US10014196B2 (en) * | 2015-10-20 | 2018-07-03 | Lam Research Corporation | Wafer transport assembly with integrated buffers |
JP6637362B2 (ja) * | 2016-03-31 | 2020-01-29 | 芝浦メカトロニクス株式会社 | 基板搬送装置、基板処理装置及び基板処理方法 |
JP7246147B2 (ja) * | 2017-09-29 | 2023-03-27 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
KR102164067B1 (ko) * | 2017-09-29 | 2020-10-12 | 시바우라 메카트로닉스 가부시끼가이샤 | 기판 처리 장치 및 기판 처리 방법 |
US11192239B2 (en) * | 2018-10-05 | 2021-12-07 | Brooks Automation, Inc. | Substrate processing apparatus |
-
2020
- 2020-02-05 KR KR1020207035999A patent/KR102483600B1/ko active IP Right Grant
- 2020-02-05 CN CN202080003588.XA patent/CN113508456A/zh active Pending
- 2020-02-05 JP JP2020555077A patent/JP6985531B1/ja active Active
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-
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- 2021-11-25 JP JP2021190771A patent/JP7407163B2/ja active Active
-
2022
- 2022-06-15 US US17/840,697 patent/US11804391B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010014269A1 (en) | 1997-08-11 | 2001-08-16 | Robert Hartlage | High throughput wafer transfer mechanism |
JP2003197709A (ja) | 2001-12-25 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
JP2003282669A (ja) | 2002-03-26 | 2003-10-03 | Hitachi High-Technologies Corp | 基板の搬送方法及びその装置 |
JP2008510317A (ja) | 2004-08-17 | 2008-04-03 | マットソン テクノロジイ インコーポレイテッド | 高度な低コスト・高スループット処理プラットフォーム |
WO2019161169A1 (en) | 2018-02-15 | 2019-08-22 | Lam Research Corporation | Moving substrate transfer chamber |
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