JP4505668B2 - 露光装置及び露光方法並びにデバイス製造方法 - Google Patents

露光装置及び露光方法並びにデバイス製造方法 Download PDF

Info

Publication number
JP4505668B2
JP4505668B2 JP2003579269A JP2003579269A JP4505668B2 JP 4505668 B2 JP4505668 B2 JP 4505668B2 JP 2003579269 A JP2003579269 A JP 2003579269A JP 2003579269 A JP2003579269 A JP 2003579269A JP 4505668 B2 JP4505668 B2 JP 4505668B2
Authority
JP
Japan
Prior art keywords
temperature
control
reticle
exposure
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003579269A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2003081648A1 (ja
Inventor
寿彦 辻
隆昭 木村
良智 長橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2003081648A1 publication Critical patent/JPWO2003081648A1/ja
Application granted granted Critical
Publication of JP4505668B2 publication Critical patent/JP4505668B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Control Of Temperature (AREA)
JP2003579269A 2002-03-22 2003-03-24 露光装置及び露光方法並びにデバイス製造方法 Expired - Fee Related JP4505668B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002082044 2002-03-22
JP2002082044 2002-03-22
PCT/JP2003/003539 WO2003081648A1 (en) 2002-03-22 2003-03-24 Exposure device, exposure method, and device manufacturing method

Publications (2)

Publication Number Publication Date
JPWO2003081648A1 JPWO2003081648A1 (ja) 2005-07-28
JP4505668B2 true JP4505668B2 (ja) 2010-07-21

Family

ID=28449136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003579269A Expired - Fee Related JP4505668B2 (ja) 2002-03-22 2003-03-24 露光装置及び露光方法並びにデバイス製造方法

Country Status (5)

Country Link
US (1) US7116396B2 (https=)
JP (1) JP4505668B2 (https=)
AU (1) AU2003227194A1 (https=)
TW (1) TW200305927A (https=)
WO (1) WO2003081648A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020177076A (ja) * 2019-04-16 2020-10-29 キヤノン株式会社 基板処理装置及び物品の製造方法

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI220451B (en) * 2003-10-14 2004-08-21 Ind Tech Res Inst Positioning measurement platform of optoelectronic device
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
JP4418699B2 (ja) * 2004-03-24 2010-02-17 キヤノン株式会社 露光装置
JP2006211812A (ja) * 2005-01-27 2006-08-10 Canon Inc 位置決め装置、露光装置、並びにデバイス製造方法
JP2006295146A (ja) * 2005-03-18 2006-10-26 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
US20100163221A1 (en) * 2005-11-30 2010-07-01 Koninklijke Philips Electronics, N.V. Local control of heat flow to more accurately regulate machine temperatures
KR20080071552A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
JP5020662B2 (ja) * 2006-05-26 2012-09-05 キヤノン株式会社 ステージ装置、露光装置、及びデバイス製造方法
JP2008015862A (ja) * 2006-07-07 2008-01-24 Ihi Marine United Inc 異常検知装置及び異常検知プログラム
US7916267B2 (en) * 2006-08-29 2011-03-29 Asml Netherlands B.V. Lithographic apparatus, and motor cooling device
TWI308648B (en) * 2006-09-26 2009-04-11 Ind Tech Res Inst Piezoelectric optical lens
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
US7986473B2 (en) * 2006-12-04 2011-07-26 Quality Vision International, Inc. System and method for focal length stabilization using active temperature control
US7898204B2 (en) * 2007-01-05 2011-03-01 Active Precision, Inc. High-speed substrate manipulator
JP4435201B2 (ja) * 2007-04-20 2010-03-17 キヤノン株式会社 温調システムの調整方法
JP5641709B2 (ja) * 2009-04-23 2014-12-17 キヤノン株式会社 デバイス製造装置およびデバイス製造方法
JP5573145B2 (ja) * 2009-12-16 2014-08-20 ソニー株式会社 画像処理システム、画像処理装置、画像処理方法及びプログラム
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US9778579B2 (en) * 2011-11-10 2017-10-03 Nikon Corporation System and method for controlling a temperature of a reaction assembly
JP6034231B2 (ja) * 2012-07-25 2016-11-30 株式会社Kelk 半導体製造装置用温度調整装置、半導体製造におけるｐｉｄ定数演算方法、及び半導体製造装置用温度調整装置の運転方法
US10775285B1 (en) 2016-03-11 2020-09-15 Montana Intruments Corporation Instrumental analysis systems and methods
US11125663B1 (en) 2016-03-11 2021-09-21 Montana Instruments Corporation Cryogenic systems and methods
US12253205B1 (en) 2018-09-28 2025-03-18 Montana Instruments Corporation Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods
US20200109764A1 (en) 2018-10-09 2020-04-09 Montana Instruments Corporation Cryocooler Assemblies and Methods
KR102587632B1 (ko) * 2018-12-18 2023-10-11 삼성전자주식회사 플라즈마 처리 장치에서의 기판 지지부의 온도 제어 방법 및 온도 제어 장치
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
TWI700960B (zh) * 2019-05-29 2020-08-01 財團法人國家實驗研究院 光源調控方法、光源系統以及電腦程式產品
CN114270273A (zh) * 2019-07-30 2022-04-01 Asml荷兰有限公司 确定标记测量序列的方法、平台设备和光刻设备
WO2022028710A1 (en) * 2020-08-07 2022-02-10 Carl Zeiss Smt Gmbh Optical system and method of operating an optical system
US11956924B1 (en) 2020-08-10 2024-04-09 Montana Instruments Corporation Quantum processing circuitry cooling systems and methods
JP7249989B2 (ja) * 2020-12-16 2023-03-31 日本電子株式会社 荷電粒子線装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01195389A (ja) * 1988-01-29 1989-08-07 Canon Inc 精密移動テーブル
JPH0273618A (ja) * 1988-09-09 1990-03-13 Canon Inc 露光装置
JPH032912A (ja) * 1989-05-30 1991-01-09 Tokyo Erekutoron Kyushu Kk 温度制御方法
JPH1097977A (ja) * 1996-09-25 1998-04-14 Canon Inc 露光装置及びデバイス生産方法
JPH11307430A (ja) * 1998-04-23 1999-11-05 Canon Inc 露光装置およびデバイス製造方法ならびに駆動装置
JP2001007015A (ja) * 1999-06-25 2001-01-12 Canon Inc ステージ装置
JP2001290543A (ja) * 2000-04-07 2001-10-19 Canon Inc 温度調節装置、温度調節装置を備える露光装置および半導体デバイス製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916340A (en) * 1988-01-22 1990-04-10 Canon Kabushiki Kaisha Movement guiding mechanism
US5959732A (en) * 1996-04-10 1999-09-28 Nikon Corporation Stage apparatus and a stage control method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01195389A (ja) * 1988-01-29 1989-08-07 Canon Inc 精密移動テーブル
JPH0273618A (ja) * 1988-09-09 1990-03-13 Canon Inc 露光装置
JPH032912A (ja) * 1989-05-30 1991-01-09 Tokyo Erekutoron Kyushu Kk 温度制御方法
JPH1097977A (ja) * 1996-09-25 1998-04-14 Canon Inc 露光装置及びデバイス生産方法
JPH11307430A (ja) * 1998-04-23 1999-11-05 Canon Inc 露光装置およびデバイス製造方法ならびに駆動装置
JP2001007015A (ja) * 1999-06-25 2001-01-12 Canon Inc ステージ装置
JP2001290543A (ja) * 2000-04-07 2001-10-19 Canon Inc 温度調節装置、温度調節装置を備える露光装置および半導体デバイス製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020177076A (ja) * 2019-04-16 2020-10-29 キヤノン株式会社 基板処理装置及び物品の製造方法
JP7227834B2 (ja) 2019-04-16 2023-02-22 キヤノン株式会社 基板処理装置及び物品の製造方法
TWI833910B (zh) * 2019-04-16 2024-03-01 日商佳能股份有限公司 基板處理裝置及物品之製造方法

Also Published As

Publication number Publication date
WO2003081648A1 (en) 2003-10-02
JPWO2003081648A1 (ja) 2005-07-28
US20050140959A1 (en) 2005-06-30
TW200305927A (en) 2003-11-01
US7116396B2 (en) 2006-10-03
AU2003227194A1 (en) 2003-10-08
TWI310209B (https=) 2009-05-21

Similar Documents

Publication Publication Date Title
JP4505668B2 (ja) 露光装置及び露光方法並びにデバイス製造方法
JP4205054B2 (ja) 露光システム及びデバイス製造方法
US20060007415A1 (en) Exposure system and device production process
KR101619280B1 (ko) 투영 시스템 및 리소그래피 장치
JP4452160B2 (ja) リソグラフィ装置およびデバイス製造方法
US20020080339A1 (en) Stage apparatus, vibration control method and exposure apparatus
JP2014057105A (ja) 露光装置、露光方法及びデバイス製造方法
JP5182557B2 (ja) パターン形成方法及びパターン形成装置、並びにデバイス製造方法
JPWO2003079418A1 (ja) 露光装置及びデバイス製造方法
JP5455166B2 (ja) 露光方法及び露光装置、並びにデバイス製造方法
JP2004193425A (ja) 移動制御方法及び装置、露光装置、並びにデバイス製造方法
JP2010080855A (ja) 露光装置、露光方法及びデバイスの製造方法
JP2005276932A (ja) 露光装置及びデバイス製造方法
JPWO2004075268A1 (ja) 移動方法、露光方法及び露光装置、並びにデバイス製造方法
JP2005064229A (ja) 電磁アクチュエータ冷却装置、ステージ装置、並びに露光装置
JP2005136004A (ja) 露光装置、およびデバイス製造方法
US20080079953A1 (en) Alignment apparatus, exposure apparatus, and device manufacturing method using exposure apparatus
JP2002343706A (ja) ステージ装置及びステージの駆動方法、露光装置及び露光方法、並びにデバイス及びその製造方法
WO2019029908A1 (en) VIBRATION ISOLATION SYSTEM AND LITHOGRAPHIC APPARATUS
JP2010200452A (ja) モータ装置及びステージ装置並びに露光装置
JP2012033922A (ja) 露光装置及びデバイス製造方法
JP2010141196A (ja) 温調装置、温調方法、ステージ装置及び露光装置
JP2009049168A (ja) 温度調整構造及びステージ装置並びに露光装置
JP2004235461A (ja) 露光システム
JP2006066687A (ja) 温調方法、ステージ装置、露光装置、及びデバイスの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060308

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090630

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090825

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100330

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100412

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130514

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140514

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees