AU2003227194A1 - Exposure device, exposure method, and device manufacturing method - Google Patents

Exposure device, exposure method, and device manufacturing method

Info

Publication number
AU2003227194A1
AU2003227194A1 AU2003227194A AU2003227194A AU2003227194A1 AU 2003227194 A1 AU2003227194 A1 AU 2003227194A1 AU 2003227194 A AU2003227194 A AU 2003227194A AU 2003227194 A AU2003227194 A AU 2003227194A AU 2003227194 A1 AU2003227194 A1 AU 2003227194A1
Authority
AU
Australia
Prior art keywords
exposure
device manufacturing
manufacturing
exposure device
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003227194A
Other languages
English (en)
Inventor
Takaaki Kimura
Yoshitomo Nagahashi
Toshihiko Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2003227194A1 publication Critical patent/AU2003227194A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Control Of Temperature (AREA)
AU2003227194A 2002-03-22 2003-03-24 Exposure device, exposure method, and device manufacturing method Abandoned AU2003227194A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-82044 2002-03-22
JP2002082044 2002-03-22
PCT/JP2003/003539 WO2003081648A1 (en) 2002-03-22 2003-03-24 Exposure device, exposure method, and device manufacturing method

Publications (1)

Publication Number Publication Date
AU2003227194A1 true AU2003227194A1 (en) 2003-10-08

Family

ID=28449136

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003227194A Abandoned AU2003227194A1 (en) 2002-03-22 2003-03-24 Exposure device, exposure method, and device manufacturing method

Country Status (5)

Country Link
US (1) US7116396B2 (https=)
JP (1) JP4505668B2 (https=)
AU (1) AU2003227194A1 (https=)
TW (1) TW200305927A (https=)
WO (1) WO2003081648A1 (https=)

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TWI220451B (en) * 2003-10-14 2004-08-21 Ind Tech Res Inst Positioning measurement platform of optoelectronic device
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
JP4418699B2 (ja) * 2004-03-24 2010-02-17 キヤノン株式会社 露光装置
JP2006211812A (ja) * 2005-01-27 2006-08-10 Canon Inc 位置決め装置、露光装置、並びにデバイス製造方法
JP2006295146A (ja) * 2005-03-18 2006-10-26 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
US20100163221A1 (en) * 2005-11-30 2010-07-01 Koninklijke Philips Electronics, N.V. Local control of heat flow to more accurately regulate machine temperatures
KR20080071552A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
JP5020662B2 (ja) * 2006-05-26 2012-09-05 キヤノン株式会社 ステージ装置、露光装置、及びデバイス製造方法
JP2008015862A (ja) * 2006-07-07 2008-01-24 Ihi Marine United Inc 異常検知装置及び異常検知プログラム
US7916267B2 (en) * 2006-08-29 2011-03-29 Asml Netherlands B.V. Lithographic apparatus, and motor cooling device
TWI308648B (en) * 2006-09-26 2009-04-11 Ind Tech Res Inst Piezoelectric optical lens
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
US7986473B2 (en) * 2006-12-04 2011-07-26 Quality Vision International, Inc. System and method for focal length stabilization using active temperature control
US7898204B2 (en) * 2007-01-05 2011-03-01 Active Precision, Inc. High-speed substrate manipulator
JP4435201B2 (ja) * 2007-04-20 2010-03-17 キヤノン株式会社 温調システムの調整方法
JP5641709B2 (ja) * 2009-04-23 2014-12-17 キヤノン株式会社 デバイス製造装置およびデバイス製造方法
JP5573145B2 (ja) * 2009-12-16 2014-08-20 ソニー株式会社 画像処理システム、画像処理装置、画像処理方法及びプログラム
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US9778579B2 (en) * 2011-11-10 2017-10-03 Nikon Corporation System and method for controlling a temperature of a reaction assembly
JP6034231B2 (ja) * 2012-07-25 2016-11-30 株式会社Kelk 半導体製造装置用温度調整装置、半導体製造におけるｐｉｄ定数演算方法、及び半導体製造装置用温度調整装置の運転方法
US10775285B1 (en) 2016-03-11 2020-09-15 Montana Intruments Corporation Instrumental analysis systems and methods
US11125663B1 (en) 2016-03-11 2021-09-21 Montana Instruments Corporation Cryogenic systems and methods
US12253205B1 (en) 2018-09-28 2025-03-18 Montana Instruments Corporation Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods
US20200109764A1 (en) 2018-10-09 2020-04-09 Montana Instruments Corporation Cryocooler Assemblies and Methods
KR102587632B1 (ko) * 2018-12-18 2023-10-11 삼성전자주식회사 플라즈마 처리 장치에서의 기판 지지부의 온도 제어 방법 및 온도 제어 장치
JP7202176B2 (ja) * 2018-12-21 2023-01-11 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
JP7227834B2 (ja) * 2019-04-16 2023-02-22 キヤノン株式会社 基板処理装置及び物品の製造方法
TWI700960B (zh) * 2019-05-29 2020-08-01 財團法人國家實驗研究院 光源調控方法、光源系統以及電腦程式產品
CN114270273A (zh) * 2019-07-30 2022-04-01 Asml荷兰有限公司 确定标记测量序列的方法、平台设备和光刻设备
WO2022028710A1 (en) * 2020-08-07 2022-02-10 Carl Zeiss Smt Gmbh Optical system and method of operating an optical system
US11956924B1 (en) 2020-08-10 2024-04-09 Montana Instruments Corporation Quantum processing circuitry cooling systems and methods
JP7249989B2 (ja) * 2020-12-16 2023-03-31 日本電子株式会社 荷電粒子線装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916340A (en) * 1988-01-22 1990-04-10 Canon Kabushiki Kaisha Movement guiding mechanism
JP2510874B2 (ja) * 1988-01-29 1996-06-26 キヤノン株式会社 精密移動テ―ブル
JP2743182B2 (ja) * 1988-09-09 1998-04-22 キヤノン株式会社 露光装置
JPH032912A (ja) * 1989-05-30 1991-01-09 Tokyo Erekutoron Kyushu Kk 温度制御方法
US5959732A (en) * 1996-04-10 1999-09-28 Nikon Corporation Stage apparatus and a stage control method
JPH1097977A (ja) * 1996-09-25 1998-04-14 Canon Inc 露光装置及びデバイス生産方法
JPH11307430A (ja) * 1998-04-23 1999-11-05 Canon Inc 露光装置およびデバイス製造方法ならびに駆動装置
JP2001007015A (ja) * 1999-06-25 2001-01-12 Canon Inc ステージ装置
JP3870002B2 (ja) * 2000-04-07 2007-01-17 キヤノン株式会社 露光装置

Also Published As

Publication number Publication date
WO2003081648A1 (en) 2003-10-02
JPWO2003081648A1 (ja) 2005-07-28
JP4505668B2 (ja) 2010-07-21
US20050140959A1 (en) 2005-06-30
TW200305927A (en) 2003-11-01
US7116396B2 (en) 2006-10-03
TWI310209B (https=) 2009-05-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase