TWI310209B - - Google Patents
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- Publication number
- TWI310209B TWI310209B TW092106284A TW92106284A TWI310209B TW I310209 B TWI310209 B TW I310209B TW 092106284 A TW092106284 A TW 092106284A TW 92106284 A TW92106284 A TW 92106284A TW I310209 B TWI310209 B TW I310209B
- Authority
- TW
- Taiwan
- Prior art keywords
- control
- temperature
- exposure
- aforementioned
- fluid
- Prior art date
Links
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002082044 | 2002-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200305927A TW200305927A (en) | 2003-11-01 |
| TWI310209B true TWI310209B (https=) | 2009-05-21 |
Family
ID=28449136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092106284A TW200305927A (en) | 2002-03-22 | 2003-03-21 | Exposure apparatus, exposure method and manufacturing method of device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7116396B2 (https=) |
| JP (1) | JP4505668B2 (https=) |
| AU (1) | AU2003227194A1 (https=) |
| TW (1) | TW200305927A (https=) |
| WO (1) | WO2003081648A1 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI220451B (en) * | 2003-10-14 | 2004-08-21 | Ind Tech Res Inst | Positioning measurement platform of optoelectronic device |
| US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
| JP4418699B2 (ja) * | 2004-03-24 | 2010-02-17 | キヤノン株式会社 | 露光装置 |
| JP2006211812A (ja) * | 2005-01-27 | 2006-08-10 | Canon Inc | 位置決め装置、露光装置、並びにデバイス製造方法 |
| JP2006295146A (ja) * | 2005-03-18 | 2006-10-26 | Canon Inc | 位置決め装置、露光装置及びデバイス製造方法 |
| US20100163221A1 (en) * | 2005-11-30 | 2010-07-01 | Koninklijke Philips Electronics, N.V. | Local control of heat flow to more accurately regulate machine temperatures |
| KR20080071552A (ko) | 2005-12-06 | 2008-08-04 | 가부시키가이샤 니콘 | 노광 방법, 노광 장치 및 디바이스 제조 방법 |
| JP5020662B2 (ja) * | 2006-05-26 | 2012-09-05 | キヤノン株式会社 | ステージ装置、露光装置、及びデバイス製造方法 |
| JP2008015862A (ja) * | 2006-07-07 | 2008-01-24 | Ihi Marine United Inc | 異常検知装置及び異常検知プログラム |
| US7916267B2 (en) * | 2006-08-29 | 2011-03-29 | Asml Netherlands B.V. | Lithographic apparatus, and motor cooling device |
| TWI308648B (en) * | 2006-09-26 | 2009-04-11 | Ind Tech Res Inst | Piezoelectric optical lens |
| JP4884180B2 (ja) * | 2006-11-21 | 2012-02-29 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US7986473B2 (en) * | 2006-12-04 | 2011-07-26 | Quality Vision International, Inc. | System and method for focal length stabilization using active temperature control |
| US7898204B2 (en) * | 2007-01-05 | 2011-03-01 | Active Precision, Inc. | High-speed substrate manipulator |
| JP4435201B2 (ja) * | 2007-04-20 | 2010-03-17 | キヤノン株式会社 | 温調システムの調整方法 |
| JP5641709B2 (ja) * | 2009-04-23 | 2014-12-17 | キヤノン株式会社 | デバイス製造装置およびデバイス製造方法 |
| JP5573145B2 (ja) * | 2009-12-16 | 2014-08-20 | ソニー株式会社 | 画像処理システム、画像処理装置、画像処理方法及びプログラム |
| US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US9778579B2 (en) * | 2011-11-10 | 2017-10-03 | Nikon Corporation | System and method for controlling a temperature of a reaction assembly |
| JP6034231B2 (ja) * | 2012-07-25 | 2016-11-30 | 株式会社Kelk | 半導体製造装置用温度調整装置、半導体製造におけるｐｉｄ定数演算方法、及び半導体製造装置用温度調整装置の運転方法 |
| US10775285B1 (en) | 2016-03-11 | 2020-09-15 | Montana Intruments Corporation | Instrumental analysis systems and methods |
| US11125663B1 (en) | 2016-03-11 | 2021-09-21 | Montana Instruments Corporation | Cryogenic systems and methods |
| US12253205B1 (en) | 2018-09-28 | 2025-03-18 | Montana Instruments Corporation | Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods |
| US20200109764A1 (en) | 2018-10-09 | 2020-04-09 | Montana Instruments Corporation | Cryocooler Assemblies and Methods |
| KR102587632B1 (ko) * | 2018-12-18 | 2023-10-11 | 삼성전자주식회사 | 플라즈마 처리 장치에서의 기판 지지부의 온도 제어 방법 및 온도 제어 장치 |
| JP7202176B2 (ja) * | 2018-12-21 | 2023-01-11 | キヤノン株式会社 | 搬送装置、基板処理装置、および物品製造方法 |
| JP7227834B2 (ja) * | 2019-04-16 | 2023-02-22 | キヤノン株式会社 | 基板処理装置及び物品の製造方法 |
| TWI700960B (zh) * | 2019-05-29 | 2020-08-01 | 財團法人國家實驗研究院 | 光源調控方法、光源系統以及電腦程式產品 |
| CN114270273A (zh) * | 2019-07-30 | 2022-04-01 | Asml荷兰有限公司 | 确定标记测量序列的方法、平台设备和光刻设备 |
| WO2022028710A1 (en) * | 2020-08-07 | 2022-02-10 | Carl Zeiss Smt Gmbh | Optical system and method of operating an optical system |
| US11956924B1 (en) | 2020-08-10 | 2024-04-09 | Montana Instruments Corporation | Quantum processing circuitry cooling systems and methods |
| JP7249989B2 (ja) * | 2020-12-16 | 2023-03-31 | 日本電子株式会社 | 荷電粒子線装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4916340A (en) * | 1988-01-22 | 1990-04-10 | Canon Kabushiki Kaisha | Movement guiding mechanism |
| JP2510874B2 (ja) * | 1988-01-29 | 1996-06-26 | キヤノン株式会社 | 精密移動テ―ブル |
| JP2743182B2 (ja) * | 1988-09-09 | 1998-04-22 | キヤノン株式会社 | 露光装置 |
| JPH032912A (ja) * | 1989-05-30 | 1991-01-09 | Tokyo Erekutoron Kyushu Kk | 温度制御方法 |
| US5959732A (en) * | 1996-04-10 | 1999-09-28 | Nikon Corporation | Stage apparatus and a stage control method |
| JPH1097977A (ja) * | 1996-09-25 | 1998-04-14 | Canon Inc | 露光装置及びデバイス生産方法 |
| JPH11307430A (ja) * | 1998-04-23 | 1999-11-05 | Canon Inc | 露光装置およびデバイス製造方法ならびに駆動装置 |
| JP2001007015A (ja) * | 1999-06-25 | 2001-01-12 | Canon Inc | ステージ装置 |
| JP3870002B2 (ja) * | 2000-04-07 | 2007-01-17 | キヤノン株式会社 | 露光装置 |
-
2003
- 2003-03-21 TW TW092106284A patent/TW200305927A/zh not_active IP Right Cessation
- 2003-03-24 AU AU2003227194A patent/AU2003227194A1/en not_active Abandoned
- 2003-03-24 JP JP2003579269A patent/JP4505668B2/ja not_active Expired - Fee Related
- 2003-03-24 WO PCT/JP2003/003539 patent/WO2003081648A1/ja not_active Ceased
-
2004
- 2004-09-21 US US10/944,783 patent/US7116396B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003081648A1 (en) | 2003-10-02 |
| JPWO2003081648A1 (ja) | 2005-07-28 |
| JP4505668B2 (ja) | 2010-07-21 |
| US20050140959A1 (en) | 2005-06-30 |
| TW200305927A (en) | 2003-11-01 |
| US7116396B2 (en) | 2006-10-03 |
| AU2003227194A1 (en) | 2003-10-08 |
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