JP4480728B2 - Ｍｅｍｓマイクの製造方法 - Google Patents

Ｍｅｍｓマイクの製造方法 Download PDF

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Publication number
JP4480728B2
JP4480728B2 JP2007001227A JP2007001227A JP4480728B2 JP 4480728 B2 JP4480728 B2 JP 4480728B2 JP 2007001227 A JP2007001227 A JP 2007001227A JP 2007001227 A JP2007001227 A JP 2007001227A JP 4480728 B2 JP4480728 B2 JP 4480728B2
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Japan
Prior art keywords
film
manufacturing
semiconductor wafer
mems microphone
chip
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JP2007001227A
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English (en)
Japanese (ja)
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JP2008012654A5 (enExample
JP2008012654A (ja
Inventor
勝喜 内海
隆博 隈川
正美 松浦
芳宏 松島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2007001227A priority Critical patent/JP4480728B2/ja
Priority to US11/798,676 priority patent/US20070287215A1/en
Priority to CN2011100600350A priority patent/CN102161471A/zh
Priority to CN2007101064301A priority patent/CN101086956B/zh
Publication of JP2008012654A publication Critical patent/JP2008012654A/ja
Publication of JP2008012654A5 publication Critical patent/JP2008012654A5/ja
Priority to US12/578,040 priority patent/US7838323B2/en
Application granted granted Critical
Publication of JP4480728B2 publication Critical patent/JP4480728B2/ja
Priority to US12/913,340 priority patent/US20110039365A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Dicing (AREA)
JP2007001227A 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法 Active JP4480728B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007001227A JP4480728B2 (ja) 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法
US11/798,676 US20070287215A1 (en) 2006-06-09 2007-05-16 Method for fabricating semiconductor device
CN2011100600350A CN102161471A (zh) 2006-06-09 2007-05-29 半导体装置的制造方法
CN2007101064301A CN101086956B (zh) 2006-06-09 2007-05-29 半导体装置的制造方法
US12/578,040 US7838323B2 (en) 2006-06-09 2009-10-13 Method for fabricating semiconductor device
US12/913,340 US20110039365A1 (en) 2006-06-09 2010-10-27 Method for fabricating semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006160927 2006-06-09
JP2007001227A JP4480728B2 (ja) 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009162884A Division JP2009226582A (ja) 2006-06-09 2009-07-09 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008012654A JP2008012654A (ja) 2008-01-24
JP2008012654A5 JP2008012654A5 (enExample) 2009-07-02
JP4480728B2 true JP4480728B2 (ja) 2010-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007001227A Active JP4480728B2 (ja) 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法

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US (3) US20070287215A1 (enExample)
JP (1) JP4480728B2 (enExample)
CN (1) CN102161471A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498272B (zh) * 2012-10-09 2015-09-01 Univ Feng Chia Microelectromechanical system device and manufacturing method thereof

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US20100022046A1 (en) 2010-01-28
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