CN102161471A - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN102161471A
CN102161471A CN2011100600350A CN201110060035A CN102161471A CN 102161471 A CN102161471 A CN 102161471A CN 2011100600350 A CN2011100600350 A CN 2011100600350A CN 201110060035 A CN201110060035 A CN 201110060035A CN 102161471 A CN102161471 A CN 102161471A
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CN
China
Prior art keywords
film
chip
semiconductor wafer
semiconductor device
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100600350A
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English (en)
Chinese (zh)
Inventor
内海胜喜
隈川隆博
松浦正美
松岛芳宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN102161471A publication Critical patent/CN102161471A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dicing (AREA)
  • Micromachines (AREA)
CN2011100600350A 2006-06-09 2007-05-29 半导体装置的制造方法 Pending CN102161471A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-160927 2006-06-09
JP2006160927 2006-06-09
JP2007-001227 2007-01-09
JP2007001227A JP4480728B2 (ja) 2006-06-09 2007-01-09 Ｍｅｍｓマイクの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2007101064301A Division CN101086956B (zh) 2006-06-09 2007-05-29 半导体装置的制造方法

Publications (1)

Publication Number Publication Date
CN102161471A true CN102161471A (zh) 2011-08-24

Family

ID=38822452

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100600350A Pending CN102161471A (zh) 2006-06-09 2007-05-29 半导体装置的制造方法

Country Status (3)

Country Link
US (3) US20070287215A1 (enExample)
JP (1) JP4480728B2 (enExample)
CN (1) CN102161471A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109987573A (zh) * 2019-04-02 2019-07-09 武汉耐普登科技有限公司 半导体结构及其制造方法

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CN109987573A (zh) * 2019-04-02 2019-07-09 武汉耐普登科技有限公司 半导体结构及其制造方法
CN109987573B (zh) * 2019-04-02 2021-12-14 无锡韦感半导体有限公司 半导体结构及其制造方法

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