JP4477065B2 - 無線タグ装着可能な外部包装体 - Google Patents
無線タグ装着可能な外部包装体 Download PDFInfo
- Publication number
- JP4477065B2 JP4477065B2 JP2007528582A JP2007528582A JP4477065B2 JP 4477065 B2 JP4477065 B2 JP 4477065B2 JP 2007528582 A JP2007528582 A JP 2007528582A JP 2007528582 A JP2007528582 A JP 2007528582A JP 4477065 B2 JP4477065 B2 JP 4477065B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- conductive
- external
- conductive layer
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
- G06K17/0022—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisious for transferring data to distant stations, e.g. from a sensing device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2203/00—Decoration means, markings, information elements, contents indicators
- B65D2203/10—Transponders
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Wrappers (AREA)
- Laminated Bodies (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Packages (AREA)
Description
第1には、製品上及び/又は外部包装内に直接配置されるタグ。
第2には、外部包装近傍にあるタグ。
外部包装体による遮蔽は、外部包装体内及び/又は外部包装体上直接の従来タグの場合に、また、外部包装体の外側であるがその近傍にあるタグの場合に、電磁波が、例えば、金属によって反射される結果として通常発生する妨害を意味する。本明細書において、用語「周囲の」又は「近くの」は、「タグの典型的な読み取り範囲の領域」を意味し、例えば、一般的に13.56MHzで約70cmまで、及びUHF(超高周波、〜850から950MHz)の場合、約2mまでとすることができ、GHz範囲の場合、さらに広くなり得る(数メートル)。
導電性層中の構造体は、誘起される導電性層中の電流(例えば、エディ電流の結果として)の遮蔽及び/又は反射が低減され、又は防止されるように、遮蔽及び/又は反射効果を変化させる。したがって、その結果、電磁線は外部包装体を透過し、及び/又は特に誘導性の、容量性の、近接場又は遠隔場結合を行うことが可能である。したがって、RFIDタグの伝送出力の領域にさえ及ぶ、外部包装体の周囲の電気的出力及び/又は情報の伝送が可能である。
図2に構造体2の位置及びその寸法を見ることができる。構造体2の幅4は、この構造体2の幅4によって導電性が遮断される限り自由に選択することができる。同じことが構造体2の深さ3にも適用される(深さは導電性層全体を含み、確実さのために支持体材料中に至ることができる)。構造体2の長さ5だけは、少なくともコイルの半分の値であるように、電子部品及び/又は無線タグ(図示されない)のコイルに関係する。
図示した構造体9は一例であり、本発明に基づいて、例えば、図5に示す形状を含んでおり、構造体は全ての可能な形状を取ることができる。
Claims (16)
- 電子部品(11、12)を有する製品のための外部包装体(1)であって、
少なくとも1つの支持体(13)及び前記支持体に結合された導電性層(14)を含み、前記外部包装体が支持体として紙又はポリマーフィルムを含み、
前記導電性層は導電性領域を有し、前記導電性層は、前記電気遮蔽を低減するために、或いは、電磁放射が前記導電性領域を貫通するように前記外部包装体の周囲の前記導電性領域により呈するように配置された構造体(2、7)及び/又はコーティングを有し、前記外部包装体を経由して情報を送達又は受容する電子部品及び/又はその電力供給が前記外部包装体を経由して供給される電子部品の使用が悪影響を受けないように、或いは、部品がまだ動作可能である程度しか影響を受けないように、前記導電性層(14)の導電性領域を少なくとも2つの領域に分割する構造体(2)とし、前記構造体(2)又は前記構造体(2)の部分は、コンデンサ、導電性線、ダイオード又はこれらの部分を構成することを特徴とする外部包装体(1)。 - 前記構造体(2)が前記電子部品のコイル(11)の中心に対向して配置されることを特徴とする請求項1に記載の外部包装体(1)。
- 電子部品(11、12)を有する製品のための外部包装体(1)であって、
少なくとも1つの支持体(13)及び前記支持体に結合された導電性層(14)を含み、前記外部包装体が支持体として紙又はポリマーフィルムを含み、
前記導電性層は導電性領域を有し、前記導電性層は、前記電気遮蔽を低減するために、或いは、電磁放射が前記導電性領域を貫通するように前記外部包装体の周囲の前記導電性領域により呈するように配置された構造体(2、7)及び/又はコーティングを有し、前記外部包装体を経由して情報を送達又は受容する電子部品及び/又はその電力供給が前記外部包装体を経由して供給される電子部品の使用が悪影響を受けないように、或いは、部品がまだ動作可能である程度しか影響を受けないように、前記導電性層(14)の導電性領域を少なくとも2つの領域に分割する構造体(2)とし、前記電子部品のコイル(11)の中心に対向して配置されることを特徴とする外部包装体(1)。 - 前記構造体(2)及び/又は構造体の部分が、コンデンサ、導電性線、ダイオード又はその部分などの電子部品を形成することを特徴とする請求項3に記載の外部包装体(1)。
- 前記構造体(2)が前記導電性層(14)の導電性領域中の単純な窪みであることを特徴とする請求項1乃至4のいずれか1項に記載の外部包装体(1)。
- 前記構造体(2)が少なくとも2つの平行な窪み(7)及び/又は少なくとも2つの平行でない窪み(7)の形で加えられることを特徴とする請求項1乃至5のいずれか1項に記載の外部包装体(1)。
- 前記遮蔽を低減するためのコーティングが、前記外部包装体を完成させるさらに他の層を有する最大厚さ1μmの金属層を含むことを特徴とする請求項1乃至6のいずれか1項に記載の外部包装体(1)。
- 前記構造体(2)が、少なくとも部分的にその技術的効果だけではなく、像、保安特徴、文字、様々な視覚特徴及び/又はロゴの再現など、視覚効果も与えることを特徴とする請求項1乃至7のいずれか1項に記載の外部包装体(1)。
- 前記構造体(2)が前記導電性層(14)の導電性領域を1回又は複数回遮断することを特徴とする請求項1乃至8のいずれか1項に記載の外部包装体(1)。
- 前記遮断が前記電子部品の少なくともコイル(11)の上部領域を2つの半片に分割することを特徴とする請求項9に記載の外部包装体(1)。
- 前記外部包装体の表面が像を示すことを特徴とする請求項1乃至10のいずれか1項に記載の外部包装体(1)。
- 前記支持体が50μm以下の厚さを有することを特徴とする請求項1乃至11のいずれか1項に記載の外部包装体。
- 前記導電性層が50μm以下の厚さを有することを特徴とする請求項1乃至12のいずれか1項に記載の外部包装体。
- 前記構造体の幅が500μmまでであることを特徴とする請求項1乃至13のいずれか1項に記載の外部包装体。
- 前記構造体が外部包装体の半分を超えて展延することを特徴とする請求項1乃至14のいずれか1項に記載の外部包装体。
- 請求項1乃至15のいずれか1項に記載の外部包装体を、紙巻タバコ用、食品包装及び/又は薬包装用、ラジオ、携帯ラジオの場合、遠隔制御及び/又はマイクロウェーブオーブンに使用することを特徴とする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004040831A DE102004040831A1 (de) | 2004-08-23 | 2004-08-23 | Funketikettfähige Umverpackung |
PCT/DE2005/001468 WO2006021193A1 (de) | 2004-08-23 | 2005-08-19 | Funketikettfähige umverpackung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008510663A JP2008510663A (ja) | 2008-04-10 |
JP4477065B2 true JP4477065B2 (ja) | 2010-06-09 |
Family
ID=35431273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007528582A Expired - Fee Related JP4477065B2 (ja) | 2004-08-23 | 2005-08-19 | 無線タグ装着可能な外部包装体 |
Country Status (11)
Country | Link |
---|---|
US (1) | US7847695B2 (ja) |
EP (1) | EP1782339B1 (ja) |
JP (1) | JP4477065B2 (ja) |
KR (1) | KR100902438B1 (ja) |
CN (1) | CN101052975A (ja) |
AU (1) | AU2005276841A1 (ja) |
CA (1) | CA2577901A1 (ja) |
DE (1) | DE102004040831A1 (ja) |
MX (1) | MX2007002020A (ja) |
TW (1) | TW200608303A (ja) |
WO (1) | WO2006021193A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006256694A (ja) * | 2005-02-16 | 2006-09-28 | Dainippon Printing Co Ltd | 無線icタグ付き包装体 |
JP2018532612A (ja) * | 2015-09-30 | 2018-11-08 | 凸版印刷株式会社 | 金属加飾製品 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005018410C5 (de) * | 2005-04-20 | 2016-03-24 | Karl Knauer Kg | Verpackung mit hochglänzender, metallisch wirkender Oberfläche |
WO2007000578A2 (en) | 2005-06-25 | 2007-01-04 | Omni-Id Limited | Electromagnetic radiation decoupler |
DE102006025485B4 (de) | 2006-05-30 | 2008-03-20 | Polylc Gmbh & Co. Kg | Antennenanordnung sowie deren Verwendung |
DE202006020909U1 (de) * | 2006-10-31 | 2010-10-28 | Kern, Peter | Transponderanordnung zum Betrieb von Transpondern |
DE102006061298A1 (de) * | 2006-12-22 | 2008-06-26 | Conti Temic Microelectronic Gmbh | Antenne eines RFID-Lesegeräts für induktive Datenkommunikation |
EP2928021B1 (en) * | 2007-07-04 | 2017-11-22 | Murata Manufacturing Co., Ltd. | Printed wiring substrate |
EP2026253A1 (de) * | 2007-08-09 | 2009-02-18 | Alcan Technology & Management AG | Warenverpackung mit Deckfolie |
TW200908897A (en) * | 2007-08-22 | 2009-03-01 | Amos Technologies Inc | Anti-counterfeit packing with radio frequency identification and the method thereof |
EP2071496A1 (de) * | 2007-12-13 | 2009-06-17 | Mondi AG | Verfahren zur Herstellung einer flexiblen Verpackung mit RFID Transponder |
EP2237701A1 (en) | 2008-01-28 | 2010-10-13 | Paolo Stefanelli | Container for fluid products, in particular perfumes, deodorants, creams and similar |
EP2237195B1 (en) | 2009-04-03 | 2012-07-25 | 3M Innovative Properties Company | A material for packaging electronic components |
JP5593834B2 (ja) * | 2010-05-24 | 2014-09-24 | Tdk株式会社 | 近接型アンテナ及び無線通信機器 |
EP2390203B1 (en) * | 2010-05-31 | 2013-01-16 | Nxp B.V. | Food package with integrated RFID-tag and sensor |
CN103221207B (zh) * | 2010-11-29 | 2019-07-05 | 利乐拉瓦尔集团及财务有限公司 | 包括可磁化部分的包装材料 |
CN103237735B (zh) * | 2010-12-03 | 2015-04-22 | 目立康株式会社 | 包装商品及包装商品的制造方法 |
CA2775546A1 (en) * | 2012-04-25 | 2013-10-25 | Intelligent Devices Inc. | A disposable content use monitoring package with indicator and method of making same |
CN103413167A (zh) * | 2013-08-11 | 2013-11-27 | 章伟 | 一种具有防伪功能的烟草frid标签 |
CN103569510A (zh) * | 2013-11-20 | 2014-02-12 | 李拓彬 | 具有rfid标签的鞋及其实现方法 |
FR3021438B1 (fr) * | 2014-05-21 | 2016-06-24 | Inside Secure | Etiquette anti-contrefacon double mode |
CN104573766B (zh) * | 2014-12-26 | 2018-03-09 | 杭州奥讯科技有限公司 | 一种用于烟包生成系统的读写装置及方法 |
JP6848237B2 (ja) * | 2016-07-14 | 2021-03-24 | 凸版印刷株式会社 | 包装箱および包装体 |
EP3490896A1 (en) | 2016-07-27 | 2019-06-05 | Philip Morris Products S.a.s. | Modified container of consumer articles comprising an element of discernible thickness |
WO2018161102A1 (de) * | 2017-03-09 | 2018-09-13 | Seibersdorf Labor Gmbh | Deaktivierbares abschirmelement |
AT519728A1 (de) * | 2017-03-09 | 2018-09-15 | Seibersdorf Labor Gmbh | Deaktivierbares Abschirmelement |
US11487981B2 (en) | 2017-10-04 | 2022-11-01 | Toray Industries, Inc. | Packing material, method for producing packing material, reading device, stored-article management system, disconnection detection device, unsealing detection label, and unsealing detection system |
SE541540C2 (en) * | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
Family Cites Families (204)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB723598A (en) | 1951-09-07 | 1955-02-09 | Philips Nv | Improvements in or relating to methods of producing electrically conductive mouldings from plastics |
US3512052A (en) * | 1968-01-11 | 1970-05-12 | Gen Motors Corp | Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric |
DE2102735B2 (de) | 1971-01-21 | 1979-05-10 | Transformatoren Union Ag, 7000 Stuttgart | Einrichtung zur Regelung des Mengendurchsatzes von Mühlen und Brechern |
US3769096A (en) * | 1971-03-12 | 1973-10-30 | Bell Telephone Labor Inc | Pyroelectric devices |
JPS543594B2 (ja) * | 1973-10-12 | 1979-02-24 | ||
DE2407110C3 (de) | 1974-02-14 | 1981-04-23 | Siemens AG, 1000 Berlin und 8000 München | Sensor zum Nachweis einer in einem Gas oder einer Flüssigkeit einthaltenen Substanz |
JPS54101176A (en) * | 1978-01-26 | 1979-08-09 | Shinetsu Polymer Co | Contact member for push switch |
US4442019A (en) * | 1978-05-26 | 1984-04-10 | Marks Alvin M | Electroordered dipole suspension |
US4246298A (en) * | 1979-03-14 | 1981-01-20 | American Can Company | Rapid curing of epoxy resin coating compositions by combination of photoinitiation and controlled heat application |
JPS5641938U (ja) | 1979-09-10 | 1981-04-17 | ||
US4340057A (en) * | 1980-12-24 | 1982-07-20 | S. C. Johnson & Son, Inc. | Radiation induced graft polymerization |
EP0108650A3 (en) | 1982-11-09 | 1986-02-12 | Zytrex Corporation | Programmable mos transistor |
DE3321071A1 (de) | 1983-06-10 | 1984-12-13 | Basf Ag | Druckschalter |
DE3338597A1 (de) | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US4554229A (en) * | 1984-04-06 | 1985-11-19 | At&T Technologies, Inc. | Multilayer hybrid integrated circuit |
JPS6265472A (ja) | 1985-09-18 | 1987-03-24 | Toshiba Corp | Mis型半導体素子 |
DE3768112D1 (de) * | 1986-03-03 | 1991-04-04 | Toshiba Kawasaki Kk | Strahlungsdetektor. |
EP0268370B1 (en) | 1986-10-13 | 1995-06-28 | Canon Kabushiki Kaisha | Switching device |
GB2215307B (en) * | 1988-03-04 | 1991-10-09 | Unisys Corp | Electronic component transportation container |
KR900702481A (ko) | 1988-06-21 | 1990-12-07 | 원본미기재 | 휴대용 전자 토큰 제조방법 |
US5364735A (en) * | 1988-07-01 | 1994-11-15 | Sony Corporation | Multiple layer optical record medium with protective layers and method for producing same |
US4937119A (en) * | 1988-12-15 | 1990-06-26 | Hoechst Celanese Corp. | Textured organic optical data storage media and methods of preparation |
US5892244A (en) * | 1989-01-10 | 1999-04-06 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor |
US6331356B1 (en) * | 1989-05-26 | 2001-12-18 | International Business Machines Corporation | Patterns of electrically conducting polymers and their application as electrodes or electrical contacts |
EP0418504B1 (en) | 1989-07-25 | 1995-04-05 | Matsushita Electric Industrial Co., Ltd. | Organic semiconductor memory device having a MISFET structure and its control method |
FI84862C (fi) | 1989-08-11 | 1992-01-27 | Vaisala Oy | Kapacitiv fuktighetsgivarkonstruktion och foerfarande foer framstaellning daerav. |
US5206525A (en) | 1989-12-27 | 1993-04-27 | Nippon Petrochemicals Co., Ltd. | Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials |
FI91573C (sv) | 1990-01-04 | 1994-07-11 | Neste Oy | Sätt att framställa elektroniska och elektro-optiska komponenter och kretsar |
JP2969184B2 (ja) | 1990-04-09 | 1999-11-02 | カシオ計算機株式会社 | 薄膜トランジスタメモリ |
FR2664430B1 (fr) * | 1990-07-04 | 1992-09-18 | Centre Nat Rech Scient | Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques. |
DE4103675C2 (de) | 1991-02-07 | 1993-10-21 | Telefunken Microelectron | Schaltung zur Spannungsüberhöhung von Wechselspannungs-Eingangssignalen |
FR2673041A1 (fr) * | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
EP0501456A3 (en) | 1991-02-26 | 1992-09-09 | Sony Corporation | Video game computer provided with an optical disc drive |
US5408109A (en) * | 1991-02-27 | 1995-04-18 | The Regents Of The University Of California | Visible light emitting diodes fabricated from soluble semiconducting polymers |
US5332315A (en) | 1991-04-27 | 1994-07-26 | Gec Avery Limited | Apparatus and sensor unit for monitoring changes in a physical quantity with time |
JP3224829B2 (ja) | 1991-08-15 | 2001-11-05 | 株式会社東芝 | 有機電界効果型素子 |
JPH0580530A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Ltd | 薄膜パターン製造方法 |
US5173835A (en) | 1991-10-15 | 1992-12-22 | Motorola, Inc. | Voltage variable capacitor |
DE59105477D1 (de) * | 1991-10-30 | 1995-06-14 | Fraunhofer Ges Forschung | Belichtungsvorrichtung. |
JP2709223B2 (ja) * | 1992-01-30 | 1998-02-04 | 三菱電機株式会社 | 非接触形携帯記憶装置 |
EP0603939B1 (en) | 1992-12-21 | 1999-06-16 | Koninklijke Philips Electronics N.V. | N-type conductive polymer and method of preparing such a polymer |
DE4243832A1 (de) | 1992-12-23 | 1994-06-30 | Daimler Benz Ag | Tastsensoranordnung |
JP3457348B2 (ja) * | 1993-01-15 | 2003-10-14 | 株式会社東芝 | 半導体装置の製造方法 |
FR2701117B1 (fr) * | 1993-02-04 | 1995-03-10 | Asulab Sa | Système de mesures électrochimiques à capteur multizones, et son application au dosage du glucose. |
EP0615256B1 (en) | 1993-03-09 | 1998-09-23 | Koninklijke Philips Electronics N.V. | Method of manufacturing a pattern of an electrically conductive polymer on a substrate surface and method of metallizing such a pattern |
GB2297540B (en) * | 1993-03-12 | 1997-01-29 | Gore & Ass | Tamper respondent enclosure |
US5567550A (en) * | 1993-03-25 | 1996-10-22 | Texas Instruments Incorporated | Method of making a mask for making integrated circuits |
DE4312766C2 (de) | 1993-04-20 | 1997-02-27 | Telefunken Microelectron | Schaltung zur Spannungsüberhöhung |
JPH0722669A (ja) * | 1993-07-01 | 1995-01-24 | Mitsubishi Electric Corp | 可塑性機能素子 |
EP0722563A4 (en) | 1993-08-24 | 1998-03-04 | Metrika Lab Inc | NEW ELECTRONIC DISPOSABLE ANALYSIS DEVICE |
JP3460863B2 (ja) * | 1993-09-17 | 2003-10-27 | 三菱電機株式会社 | 半導体装置の製造方法 |
FR2710413B1 (fr) * | 1993-09-21 | 1995-11-03 | Asulab Sa | Dispositif de mesure pour capteurs amovibles. |
US5556706A (en) * | 1993-10-06 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | Conductive layered product and method of manufacturing the same |
DE4401089A1 (de) | 1994-01-15 | 1995-07-20 | Cubit Electronics Gmbh | Schutzhülle für kontaktlose Chipkarten |
IL111151A (en) | 1994-10-03 | 1998-09-24 | News Datacom Ltd | Secure access systems |
GB9404775D0 (en) * | 1994-03-11 | 1994-04-27 | Payne P P Ltd | Improvements in or relating to article tagging |
DE69531477T2 (de) * | 1994-05-16 | 2004-07-15 | Koninklijke Philips Electronics N.V. | Halbleiteranordnung aus halbleitendem, organischem material |
IL110318A (en) | 1994-05-23 | 1998-12-27 | Al Coat Ltd | Solutions containing polyaniline for making transparent electrodes for liquid crystal devices |
US5684884A (en) | 1994-05-31 | 1997-11-04 | Hitachi Metals, Ltd. | Piezoelectric loudspeaker and a method for manufacturing the same |
JP3246189B2 (ja) * | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | 半導体表示装置 |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5574291A (en) | 1994-12-09 | 1996-11-12 | Lucent Technologies Inc. | Article comprising a thin film transistor with low conductivity organic layer |
US5630986A (en) * | 1995-01-13 | 1997-05-20 | Bayer Corporation | Dispensing instrument for fluid monitoring sensors |
DE19506907A1 (de) | 1995-02-28 | 1996-09-05 | Telefunken Microelectron | Schaltungsanordnung zur Variation eines Eingangssignals mit bestimmter Eingangsspannung und bestimmtem Eingangsstrom |
JP3068430B2 (ja) * | 1995-04-25 | 2000-07-24 | 富山日本電気株式会社 | 固体電解コンデンサ及びその製造方法 |
JPH0933645A (ja) | 1995-07-21 | 1997-02-07 | Oki Electric Ind Co Ltd | トランスポンダの電源回路 |
US5652645A (en) * | 1995-07-24 | 1997-07-29 | Anvik Corporation | High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates |
US5625199A (en) | 1996-01-16 | 1997-04-29 | Lucent Technologies Inc. | Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors |
US6326640B1 (en) | 1996-01-29 | 2001-12-04 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
GB2310493B (en) * | 1996-02-26 | 2000-08-02 | Unilever Plc | Determination of the characteristics of fluid |
JP3080579B2 (ja) * | 1996-03-06 | 2000-08-28 | 富士機工電子株式会社 | エアリア・グリッド・アレイ・パッケージの製造方法 |
DE19610284A1 (de) | 1996-03-15 | 1997-08-07 | Siemens Ag | Antennenspule |
DE19629656A1 (de) * | 1996-07-23 | 1998-01-29 | Boehringer Mannheim Gmbh | Diagnostischer Testträger mit mehrschichtigem Testfeld und Verfahren zur Bestimmung von Analyt mit dessen Hilfe |
US5693956A (en) | 1996-07-29 | 1997-12-02 | Motorola | Inverted oleds on hard plastic substrate |
US6344662B1 (en) * | 1997-03-25 | 2002-02-05 | International Business Machines Corporation | Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages |
US5946551A (en) * | 1997-03-25 | 1999-08-31 | Dimitrakopoulos; Christos Dimitrios | Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric |
KR100248392B1 (ko) * | 1997-05-15 | 2000-09-01 | 정선종 | 유기물전계효과트랜지스터와결합된유기물능동구동전기발광소자및그소자의제작방법 |
WO1999010939A2 (en) * | 1997-08-22 | 1999-03-04 | Koninklijke Philips Electronics N.V. | A method of manufacturing a field-effect transistor substantially consisting of organic materials |
AU764920B2 (en) * | 1997-09-11 | 2003-09-04 | Precision Dynamics Corporation | Radio frequency identification tag on flexible substrate |
EP1296280A1 (en) | 1997-09-11 | 2003-03-26 | Precision Dynamics Corporation | Rf-id tag with integrated circuit consisting of organic materials |
US6251513B1 (en) * | 1997-11-08 | 2001-06-26 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
JPH11142810A (ja) | 1997-11-12 | 1999-05-28 | Nintendo Co Ltd | 携帯型情報処理装置 |
JP2001510670A (ja) * | 1997-12-05 | 2001-07-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 識別トランスポンダ |
US5997817A (en) | 1997-12-05 | 1999-12-07 | Roche Diagnostics Corporation | Electrochemical biosensor test strip |
US5998805A (en) | 1997-12-11 | 1999-12-07 | Motorola, Inc. | Active matrix OED array with improved OED cathode |
JP4066520B2 (ja) * | 1997-12-18 | 2008-03-26 | 株式会社デンソー | 非接触icカードリーダライタ |
US6249227B1 (en) * | 1998-01-05 | 2001-06-19 | Intermec Ip Corp. | RFID integrated in electronic assets |
US6083104A (en) * | 1998-01-16 | 2000-07-04 | Silverlit Toys (U.S.A.), Inc. | Programmable toy with an independent game cartridge |
CA2319430C (en) * | 1998-01-28 | 2004-05-11 | Thin Film Electronics Asa | A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6045977A (en) * | 1998-02-19 | 2000-04-04 | Lucent Technologies Inc. | Process for patterning conductive polyaniline films |
JPH11249494A (ja) | 1998-03-03 | 1999-09-17 | Canon Inc | ドラムフランジ、円筒部材、プロセスカートリッジ、電子写真画像形成装置 |
DE19816860A1 (de) | 1998-03-06 | 1999-11-18 | Deutsche Telekom Ag | Chipkarte, insbesondere Guthabenkarte |
US6033202A (en) | 1998-03-27 | 2000-03-07 | Lucent Technologies Inc. | Mold for non - photolithographic fabrication of microstructures |
EP1105772B1 (en) * | 1998-04-10 | 2004-06-23 | E-Ink Corporation | Electronic displays using organic-based field effect transistors |
GB9808061D0 (en) * | 1998-04-16 | 1998-06-17 | Cambridge Display Tech Ltd | Polymer devices |
GB9808806D0 (en) | 1998-04-24 | 1998-06-24 | Cambridge Display Tech Ltd | Selective deposition of polymer films |
TW410478B (en) * | 1998-05-29 | 2000-11-01 | Lucent Technologies Inc | Thin-film transistor monolithically integrated with an organic light-emitting diode |
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US5967048A (en) * | 1998-06-12 | 1999-10-19 | Howard A. Fromson | Method and apparatus for the multiple imaging of a continuous web |
KR100282393B1 (ko) | 1998-06-17 | 2001-02-15 | 구자홍 | 유기이엘(el)디스플레이소자제조방법 |
DE19836174C2 (de) | 1998-08-10 | 2000-10-12 | Illig Maschinenbau Adolf | Heizung zum Erwärmen von thermoplastischen Kunststoffplatten und Verfahren zum Einstellen der Temperatur dieser Heizung |
US6215130B1 (en) * | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
EP2325622B1 (en) | 1998-08-26 | 2014-03-12 | Sensors for Medicine and Science, Inc. | Optical-based sensing device |
JP4493741B2 (ja) | 1998-09-04 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
DE19851703A1 (de) | 1998-10-30 | 2000-05-04 | Inst Halbleiterphysik Gmbh | Verfahren zur Herstellung von elektronischen Strukturen |
US6384804B1 (en) * | 1998-11-25 | 2002-05-07 | Lucent Techonologies Inc. | Display comprising organic smart pixels |
US6506438B2 (en) * | 1998-12-15 | 2003-01-14 | E Ink Corporation | Method for printing of transistor arrays on plastic substrates |
US6321571B1 (en) | 1998-12-21 | 2001-11-27 | Corning Incorporated | Method of making glass structures for flat panel displays |
DE60003281T2 (de) * | 1999-01-15 | 2004-05-06 | 3M Innovative Properties Co., Saint Paul | Thermisches Übertragungsverfahren. |
US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
GB2347013A (en) * | 1999-02-16 | 2000-08-23 | Sharp Kk | Charge-transport structures |
KR100441413B1 (ko) * | 1999-02-22 | 2004-07-27 | 신닛뽄세이테쯔 카부시키카이샤 | 도금 밀착성 및 프레스 성형성이 우수한 고강도 용융 아연도금 강판과 고강도 합금화 용융 아연 도금 강판 및 그제조방법 |
US6300141B1 (en) * | 1999-03-02 | 2001-10-09 | Helix Biopharma Corporation | Card-based biosensor device |
US6180956B1 (en) | 1999-03-03 | 2001-01-30 | International Business Machine Corp. | Thin film transistors with organic-inorganic hybrid materials as semiconducting channels |
US6207472B1 (en) * | 1999-03-09 | 2001-03-27 | International Business Machines Corporation | Low temperature thin film transistor fabrication |
WO2000059267A1 (fr) | 1999-03-29 | 2000-10-05 | Seiko Epson Corporation | Composition, procede de preparation d'un film, et element fonctionnel et son procede de preparation |
JP4042327B2 (ja) | 1999-03-30 | 2008-02-06 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
US6498114B1 (en) | 1999-04-09 | 2002-12-24 | E Ink Corporation | Method for forming a patterned semiconductor film |
US6072716A (en) * | 1999-04-14 | 2000-06-06 | Massachusetts Institute Of Technology | Memory structures and methods of making same |
FR2793089B3 (fr) | 1999-04-28 | 2001-06-08 | Rene Liger | Transpondeur a antenne integree |
DE19919448A1 (de) | 1999-04-29 | 2000-11-02 | Miele & Cie | Kühlgerät und Verfahren zur Verkeimungsindikation |
DE19921024C2 (de) | 1999-05-06 | 2001-03-08 | Wolfgang Eichelmann | Videospielanlage |
US6383664B2 (en) * | 1999-05-11 | 2002-05-07 | The Dow Chemical Company | Electroluminescent or photocell device having protective packaging |
EP1052594A1 (de) | 1999-05-14 | 2000-11-15 | Sokymat S.A. | Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung |
AU2363900A (en) | 1999-05-17 | 2000-12-05 | Goodyear Tire And Rubber Company, The | Programmable modulation index for transponder |
TW556357B (en) | 1999-06-28 | 2003-10-01 | Semiconductor Energy Lab | Method of manufacturing an electro-optical device |
US6366017B1 (en) * | 1999-07-14 | 2002-04-02 | Agilent Technologies, Inc/ | Organic light emitting diodes with distributed bragg reflector |
JP2001085272A (ja) | 1999-07-14 | 2001-03-30 | Matsushita Electric Ind Co Ltd | 可変容量コンデンサ |
DE19933757A1 (de) | 1999-07-19 | 2001-01-25 | Giesecke & Devrient Gmbh | Chipkarte mit integrierter Batterie |
DE19935527A1 (de) | 1999-07-28 | 2001-02-08 | Giesecke & Devrient Gmbh | Aktive Folie für Chipkarten mit Display |
DE19937262A1 (de) | 1999-08-06 | 2001-03-01 | Siemens Ag | Anordnung mit Transistor-Funktion |
US6593690B1 (en) * | 1999-09-03 | 2003-07-15 | 3M Innovative Properties Company | Large area organic electronic devices having conducting polymer buffer layers and methods of making same |
EP1085320A1 (en) * | 1999-09-13 | 2001-03-21 | Interuniversitair Micro-Elektronica Centrum Vzw | A device for detecting an analyte in a sample based on organic materials |
US6517995B1 (en) * | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
KR100477146B1 (ko) | 1999-09-28 | 2005-03-17 | 스미도모쥬기가이고교 가부시키가이샤 | 레이저천공 가공방법 및 가공장치 |
US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
WO2001027998A1 (en) * | 1999-10-11 | 2001-04-19 | Koninklijke Philips Electronics N.V. | Integrated circuit |
JP3894688B2 (ja) | 1999-10-13 | 2007-03-22 | ローム株式会社 | 通信装置 |
US6335539B1 (en) | 1999-11-05 | 2002-01-01 | International Business Machines Corporation | Method for improving performance of organic semiconductors in bottom electrode structure |
US6284562B1 (en) | 1999-11-17 | 2001-09-04 | Agere Systems Guardian Corp. | Thin film transistors |
EP1103916A1 (de) | 1999-11-24 | 2001-05-30 | Infineon Technologies AG | Chipkarte |
US6621098B1 (en) * | 1999-11-29 | 2003-09-16 | The Penn State Research Foundation | Thin-film transistor and methods of manufacturing and incorporating a semiconducting organic material |
US6136702A (en) | 1999-11-29 | 2000-10-24 | Lucent Technologies Inc. | Thin film transistors |
US6197663B1 (en) * | 1999-12-07 | 2001-03-06 | Lucent Technologies Inc. | Process for fabricating integrated circuit devices having thin film transistors |
JP5073141B2 (ja) | 1999-12-21 | 2012-11-14 | プラスティック ロジック リミテッド | 内部接続の形成方法 |
BR0016670A (pt) * | 1999-12-21 | 2003-06-24 | Plastic Logic Ltd | Métodos para formar um circuito integrado e para definir um circuito eletrônico, e, dispositivo eletrônico |
US7002451B2 (en) | 2000-01-11 | 2006-02-21 | Freeman Jeffrey R | Package location system |
JP2002162652A (ja) * | 2000-01-31 | 2002-06-07 | Fujitsu Ltd | シート状表示装置、樹脂球状体、及びマイクロカプセル |
US6706159B2 (en) * | 2000-03-02 | 2004-03-16 | Diabetes Diagnostics | Combined lancet and electrochemical analyte-testing apparatus |
TW497120B (en) * | 2000-03-06 | 2002-08-01 | Toshiba Corp | Transistor, semiconductor device and manufacturing method of semiconductor device |
JP3614747B2 (ja) * | 2000-03-07 | 2005-01-26 | Necエレクトロニクス株式会社 | 昇圧回路、それを搭載したicカード及びそれを搭載した電子機器 |
DE10012204A1 (de) | 2000-03-13 | 2001-09-20 | Siemens Ag | Einrichtung zum Kennzeichnen von Stückgut |
EP1134694A1 (de) | 2000-03-16 | 2001-09-19 | Infineon Technologies AG | Dokument mit integrierter elektronischer Schaltung |
ES2351549T3 (es) * | 2000-03-21 | 2011-02-07 | Mikoh Corporation | Una etiqueta de identificación por radiofrecuencia con indicación de manipulación indebida. |
ES2252212T3 (es) | 2000-03-28 | 2006-05-16 | Diabetes Diagnostics, Inc. | Procedimiento de fabricacion en continuo de sensor electroquimico desechable. |
US6329226B1 (en) | 2000-06-01 | 2001-12-11 | Agere Systems Guardian Corp. | Method for fabricating a thin-film transistor |
DE10032260B4 (de) | 2000-07-03 | 2004-04-29 | Texas Instruments Deutschland Gmbh | Schaltungsanordnung zur Verdoppelung der Spannung einer Batterie |
DE10033112C2 (de) * | 2000-07-07 | 2002-11-14 | Siemens Ag | Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung |
US6483473B1 (en) | 2000-07-18 | 2002-11-19 | Marconi Communications Inc. | Wireless communication device and method |
AU2001269519A1 (en) | 2000-07-19 | 2002-01-30 | Hanex Co., Ltd. | Rfid tag housing structure, rfid tag installation structure and rfid tag communication method |
US6373387B1 (en) * | 2000-08-08 | 2002-04-16 | Honeywell International Inc. | Integrated hybrid electronic article surveillance marker |
JP2004506985A (ja) * | 2000-08-18 | 2004-03-04 | シーメンス アクチエンゲゼルシヤフト | 封入された有機電子構成素子、その製造方法および使用 |
DE10120687A1 (de) | 2001-04-27 | 2002-10-31 | Siemens Ag | Verkapseltes organisch-elektronisches Bauteil, Verfahren zu seiner Herstellung und seine Verwendung |
JP2002068324A (ja) * | 2000-08-30 | 2002-03-08 | Nippon Sanso Corp | 断熱容器 |
DE10043204A1 (de) | 2000-09-01 | 2002-04-04 | Siemens Ag | Organischer Feld-Effekt-Transistor, Verfahren zur Strukturierung eines OFETs und integrierte Schaltung |
DE10044842A1 (de) * | 2000-09-11 | 2002-04-04 | Siemens Ag | Organischer Gleichrichter, Schaltung, RFID-Tag und Verwendung eines organischen Gleichrichters |
DE10045192A1 (de) * | 2000-09-13 | 2002-04-04 | Siemens Ag | Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers |
DE10047171A1 (de) | 2000-09-22 | 2002-04-18 | Siemens Ag | Elektrode und/oder Leiterbahn für organische Bauelemente und Herstellungverfahren dazu |
KR20020036916A (ko) * | 2000-11-11 | 2002-05-17 | 주승기 | 실리콘 박막의 결정화 방법 및 이에 의해 제조된 반도체소자 |
DE10058559A1 (de) * | 2000-11-24 | 2002-05-29 | Interactiva Biotechnologie Gmb | System zur Abwicklung eines Warentransfers und Warenvorrats-Behälter |
KR100390522B1 (ko) * | 2000-12-01 | 2003-07-07 | 피티플러스(주) | 결정질 실리콘 활성층을 포함하는 박막트랜지스터 제조 방법 |
DE10061297C2 (de) | 2000-12-08 | 2003-05-28 | Siemens Ag | Verfahren zur Sturkturierung eines OFETs |
JP2002183695A (ja) | 2000-12-18 | 2002-06-28 | Hanex Co Ltd | Rfidタグ構造体及びその取付構造 |
GB2371910A (en) * | 2001-01-31 | 2002-08-07 | Seiko Epson Corp | Display devices |
DE10105914C1 (de) | 2001-02-09 | 2002-10-10 | Siemens Ag | Organischer Feldeffekt-Transistor mit fotostrukturiertem Gate-Dielektrikum und ein Verfahren zu dessen Erzeugung |
EP1237207B1 (en) | 2001-03-02 | 2012-01-04 | FUJIFILM Corporation | Method for producing organic thin film device |
DE10117663B4 (de) | 2001-04-09 | 2004-09-02 | Samsung SDI Co., Ltd., Suwon | Verfahren zur Herstellung von Matrixanordnungen auf Basis verschiedenartiger organischer leitfähiger Materialien |
DE10120686A1 (de) | 2001-04-27 | 2002-11-07 | Siemens Ag | Verfahren zur Erzeugung dünner homogener Schichten mit Hilfe der Siebdrucktechnik, Vorrichtung zur Durchführung des Verfahren und ihre Verwendung |
DE10121126A1 (de) * | 2001-04-30 | 2002-11-07 | Intec Holding Gmbh | Identifikationsträger und Verfahren zu dessen Herstellung |
US6781868B2 (en) | 2001-05-07 | 2004-08-24 | Advanced Micro Devices, Inc. | Molecular memory device |
US20020170897A1 (en) | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
AU2002310593A1 (en) | 2001-05-23 | 2002-12-03 | Plastic Logic Limited | Laser parrering of devices |
US6870180B2 (en) | 2001-06-08 | 2005-03-22 | Lucent Technologies Inc. | Organic polarizable gate transistor apparatus and method |
DE20111825U1 (de) | 2001-07-20 | 2002-01-17 | Lammering Thomas | Printmedium |
DE10141440A1 (de) | 2001-08-23 | 2003-03-13 | Daimler Chrysler Ag | Tripodegelenk |
JP2003089259A (ja) * | 2001-09-18 | 2003-03-25 | Hitachi Ltd | パターン形成方法およびパターン形成装置 |
US7351660B2 (en) * | 2001-09-28 | 2008-04-01 | Hrl Laboratories, Llc | Process for producing high performance interconnects |
DE10150194B4 (de) | 2001-10-12 | 2013-08-22 | Morpho Cards Gmbh | Chipkarte |
US6679036B2 (en) * | 2001-10-15 | 2004-01-20 | Shunchi Crankshaft Co., Ltd. | Drive gear shaft structure of a self-moving type mower |
DE10151440C1 (de) | 2001-10-18 | 2003-02-06 | Siemens Ag | Organisches Elektronikbauteil, Verfahren zu seiner Herstellung und seine Verwendung |
DE10151404A1 (de) | 2001-10-18 | 2003-05-15 | Ivoclar Vivadent Ag | Behältnis |
US6834251B1 (en) * | 2001-12-06 | 2004-12-21 | Richard Fletcher | Methods and devices for identifying, sensing and tracking objects over a surface |
DE10163267A1 (de) | 2001-12-21 | 2003-07-03 | Giesecke & Devrient Gmbh | Blattgut mit einem elektrischen Schaltkreis sowie Vorrichtung und Verfahren zur Bearbeitung des Blattguts |
DE10209400A1 (de) | 2002-03-04 | 2003-10-02 | Infineon Technologies Ag | Transponderschaltung mit einer Gleichrichterschaltung sowie Verfahren zur Herstellung einer Transponderschaltung mit einer Gleichrichterschaltung |
DE10219905B4 (de) | 2002-05-03 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Optoelektronisches Bauelement mit organischen funktionellen Schichten und zwei Trägern sowie Verfahren zur Herstellung eines solchen optoelektronischen Bauelements |
DE10229168A1 (de) | 2002-06-28 | 2004-01-29 | Infineon Technologies Ag | Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht |
US6812509B2 (en) * | 2002-06-28 | 2004-11-02 | Palo Alto Research Center Inc. | Organic ferroelectric memory cells |
AT502890B1 (de) | 2002-10-15 | 2011-04-15 | Atomic Austria Gmbh | Elektronisches überwachungssystem zur kontrolle bzw. erfassung einer aus mehreren sportartikeln bestehenden sportartikelkombination |
US6870183B2 (en) * | 2002-11-04 | 2005-03-22 | Advanced Micro Devices, Inc. | Stacked organic memory devices and methods of operating and fabricating |
CN1726604A (zh) | 2002-11-05 | 2006-01-25 | 波尔伊克两合公司 | 具有高分辨率结构的有机电子元件及其制造方法 |
US7442954B2 (en) | 2002-11-19 | 2008-10-28 | Polyic Gmbh & Co. Kg | Organic electronic component comprising a patterned, semi-conducting functional layer and a method for producing said component |
EP1563554B1 (de) | 2002-11-19 | 2012-01-04 | PolyIC GmbH & Co. KG | Organisches elektronisches bauelement mit gleichem organischem material für zumindest zwei funktionsschichten |
ITBO20020741A1 (it) | 2002-11-25 | 2004-05-26 | Gd Spa | Confezione di articoli da fumo con elemento marcatore antitaccheggio. |
-
2004
- 2004-08-23 DE DE102004040831A patent/DE102004040831A1/de not_active Ceased
-
2005
- 2005-08-19 WO PCT/DE2005/001468 patent/WO2006021193A1/de active Application Filing
- 2005-08-19 US US11/574,139 patent/US7847695B2/en not_active Expired - Fee Related
- 2005-08-19 MX MX2007002020A patent/MX2007002020A/es unknown
- 2005-08-19 AU AU2005276841A patent/AU2005276841A1/en not_active Abandoned
- 2005-08-19 CA CA002577901A patent/CA2577901A1/en not_active Abandoned
- 2005-08-19 CN CNA2005800345561A patent/CN101052975A/zh active Pending
- 2005-08-19 EP EP05783471A patent/EP1782339B1/de not_active Not-in-force
- 2005-08-19 KR KR1020077004331A patent/KR100902438B1/ko not_active IP Right Cessation
- 2005-08-19 JP JP2007528582A patent/JP4477065B2/ja not_active Expired - Fee Related
- 2005-08-23 TW TW094128667A patent/TW200608303A/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006256694A (ja) * | 2005-02-16 | 2006-09-28 | Dainippon Printing Co Ltd | 無線icタグ付き包装体 |
JP2018532612A (ja) * | 2015-09-30 | 2018-11-08 | 凸版印刷株式会社 | 金属加飾製品 |
Also Published As
Publication number | Publication date |
---|---|
KR20070056072A (ko) | 2007-05-31 |
TW200608303A (en) | 2006-03-01 |
CN101052975A (zh) | 2007-10-10 |
MX2007002020A (es) | 2007-04-26 |
DE102004040831A1 (de) | 2006-03-09 |
US20080061986A1 (en) | 2008-03-13 |
TWI317506B (ja) | 2009-11-21 |
US7847695B2 (en) | 2010-12-07 |
KR100902438B1 (ko) | 2009-06-11 |
WO2006021193A1 (de) | 2006-03-02 |
AU2005276841A1 (en) | 2006-03-02 |
EP1782339A1 (de) | 2007-05-09 |
JP2008510663A (ja) | 2008-04-10 |
EP1782339B1 (de) | 2012-10-10 |
CA2577901A1 (en) | 2006-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4477065B2 (ja) | 無線タグ装着可能な外部包装体 | |
US8098208B2 (en) | Antenna configuration and use thereof | |
EP2824610B1 (en) | RFID tag including environmentally sensitive materials | |
CN100399627C (zh) | 射频识别用天线 | |
JP2007537552A (ja) | 無線周波数アンテナおよび識別タグ、ならびに無線周波数アンテナおよび無線周波数タグの製造方法 | |
US6680702B2 (en) | Radio frequency resonant tags with conducting patterns connected via a dielectric film | |
CN102982365A (zh) | 应答器标签和应答器标签的制造方法 | |
Koski et al. | Inkjet-printed passive UHF RFID tags: review and performance evaluation | |
US10435215B2 (en) | Metal decorative product | |
US10026035B2 (en) | RFID tag including a coating | |
EP3556682B1 (en) | Cap seal | |
CN115087987A (zh) | 耐金属探测器的射频识别标签 | |
Koski et al. | Performance of inkjet-printed narrow-line passive UHF RFID tags on different objects | |
EP2482237A1 (de) | Körper in Form einer Verpackung oder eines Formteils mit einer RFID-Antenne | |
CN113454652A (zh) | 应答器标签和用于应答器标签的制造方法 | |
WO2023156920A1 (en) | Low visual impact coil antennas in logos | |
JP2005176390A (ja) | トランスポンダ用アンテナ | |
CN1972012A (zh) | 射频识别用天线 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20080314 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080314 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20080314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090317 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090617 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090624 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090713 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090721 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090817 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090824 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090917 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100114 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100216 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100310 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130319 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140319 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |