JP4452691B2 - シート切断装置及び切断方法 - Google Patents

シート切断装置及び切断方法 Download PDF

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Publication number
JP4452691B2
JP4452691B2 JP2006015783A JP2006015783A JP4452691B2 JP 4452691 B2 JP4452691 B2 JP 4452691B2 JP 2006015783 A JP2006015783 A JP 2006015783A JP 2006015783 A JP2006015783 A JP 2006015783A JP 4452691 B2 JP4452691 B2 JP 4452691B2
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JP
Japan
Prior art keywords
cutter blade
cutting
sheet
angle
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006015783A
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English (en)
Japanese (ja)
Other versions
JP2007062004A (ja
JP2007062004A5 (OSRAM
Inventor
英明 野中
幹 中田
芳昭 杉下
賢治 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006015783A priority Critical patent/JP4452691B2/ja
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to PCT/JP2006/314484 priority patent/WO2007015379A1/ja
Priority to CN2006800286430A priority patent/CN101237973B/zh
Priority to US11/996,060 priority patent/US20090126542A1/en
Priority to DE200611002063 priority patent/DE112006002063T5/de
Priority to KR1020087002927A priority patent/KR101213966B1/ko
Priority to TW095127322A priority patent/TW200720037A/zh
Publication of JP2007062004A publication Critical patent/JP2007062004A/ja
Publication of JP2007062004A5 publication Critical patent/JP2007062004A5/ja
Priority to US12/636,576 priority patent/US8186254B2/en
Application granted granted Critical
Publication of JP4452691B2 publication Critical patent/JP4452691B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B25J11/0055—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/153—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with inclined cutting member
    • B26D1/1535—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with inclined cutting member for thin material, e.g. for sheets, strips or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/22—Safety devices specially adapted for cutting machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y10T83/0393—With means to rotate blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]
    • Y10T83/0467—By separating products from each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0538—Repetitive transverse severing from leading edge of work
    • Y10T83/0543—Alternately forming products of less than total width of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8798—With simple oscillating motion only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8821—With simple rectilinear reciprocating motion only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)
  • Control Of Cutting Processes (AREA)
JP2006015783A 2005-08-04 2006-01-25 シート切断装置及び切断方法 Expired - Lifetime JP4452691B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2006015783A JP4452691B2 (ja) 2005-08-04 2006-01-25 シート切断装置及び切断方法
CN2006800286430A CN101237973B (zh) 2005-08-04 2006-07-21 薄片切断装置及切断方法
US11/996,060 US20090126542A1 (en) 2005-08-04 2006-07-21 Sheet cutting device and cutting method
DE200611002063 DE112006002063T5 (de) 2005-08-04 2006-07-21 Folienschneidvorrichtung und Folienschneidverfahren
PCT/JP2006/314484 WO2007015379A1 (ja) 2005-08-04 2006-07-21 シート切断装置及び切断方法
KR1020087002927A KR101213966B1 (ko) 2005-08-04 2006-07-21 시트 절단 장치 및 절단 방법
TW095127322A TW200720037A (en) 2005-08-04 2006-07-26 Sheet cutting device and sheet cutting method
US12/636,576 US8186254B2 (en) 2005-08-04 2009-12-11 Sheet cutting device and cutting method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005226334 2005-08-04
JP2006015783A JP4452691B2 (ja) 2005-08-04 2006-01-25 シート切断装置及び切断方法

Publications (3)

Publication Number Publication Date
JP2007062004A JP2007062004A (ja) 2007-03-15
JP2007062004A5 JP2007062004A5 (OSRAM) 2009-11-12
JP4452691B2 true JP4452691B2 (ja) 2010-04-21

Family

ID=37708658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006015783A Expired - Lifetime JP4452691B2 (ja) 2005-08-04 2006-01-25 シート切断装置及び切断方法

Country Status (7)

Country Link
US (2) US20090126542A1 (OSRAM)
JP (1) JP4452691B2 (OSRAM)
KR (1) KR101213966B1 (OSRAM)
CN (1) CN101237973B (OSRAM)
DE (1) DE112006002063T5 (OSRAM)
TW (1) TW200720037A (OSRAM)
WO (1) WO2007015379A1 (OSRAM)

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JP5603100B2 (ja) * 2010-02-19 2014-10-08 リンテック株式会社 シート切断装置及び切断方法
JP5572045B2 (ja) * 2010-09-09 2014-08-13 リンテック株式会社 シート貼付装置及び貼付方法
JP5586093B2 (ja) * 2010-09-09 2014-09-10 リンテック株式会社 シート貼付装置及び貼付方法
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CN108656075A (zh) * 2018-05-20 2018-10-16 佛山市高芯科技服务有限公司 一种机械加工装备机器人
JP7313202B2 (ja) * 2019-06-18 2023-07-24 株式会社ディスコ 切削装置及び交換方法
US12194615B1 (en) * 2020-02-10 2025-01-14 The United States of America as represented by the Secretary of the U.S. Navy Surface removal system
CN111906951A (zh) * 2020-07-30 2020-11-10 重庆电子工程职业学院 一种室内装修用地砖切割装置
JP2022035860A (ja) * 2020-08-21 2022-03-04 株式会社ディスコ 保護部材形成装置
CN112908871B (zh) * 2021-04-08 2025-05-06 江阴长电先进封装有限公司 一种晶圆级层压塑封圆片的裁切成型方法
CN113064326B (zh) * 2021-04-22 2024-05-31 中电科风华信息装备股份有限公司 一种用于晶圆片的去胶边机构
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Publication number Publication date
KR20080031940A (ko) 2008-04-11
US20100089216A1 (en) 2010-04-15
TWI349606B (OSRAM) 2011-10-01
KR101213966B1 (ko) 2012-12-20
CN101237973B (zh) 2011-06-01
WO2007015379A1 (ja) 2007-02-08
TW200720037A (en) 2007-06-01
JP2007062004A (ja) 2007-03-15
US8186254B2 (en) 2012-05-29
CN101237973A (zh) 2008-08-06
US20090126542A1 (en) 2009-05-21
DE112006002063T5 (de) 2008-07-10

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