JP4441823B2 - 面取り砥石のツルーイング方法及び面取り装置 - Google Patents

面取り砥石のツルーイング方法及び面取り装置 Download PDF

Info

Publication number
JP4441823B2
JP4441823B2 JP2003396029A JP2003396029A JP4441823B2 JP 4441823 B2 JP4441823 B2 JP 4441823B2 JP 2003396029 A JP2003396029 A JP 2003396029A JP 2003396029 A JP2003396029 A JP 2003396029A JP 4441823 B2 JP4441823 B2 JP 4441823B2
Authority
JP
Japan
Prior art keywords
grindstone
truing
chamfering
shape
master
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003396029A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005153085A5 (enExample
JP2005153085A (ja
Inventor
一郎 片山
要一 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2003396029A priority Critical patent/JP4441823B2/ja
Priority to DE102004054104A priority patent/DE102004054104A1/de
Priority to US10/989,513 priority patent/US7189149B2/en
Priority to CNA2004100963693A priority patent/CN1621200A/zh
Publication of JP2005153085A publication Critical patent/JP2005153085A/ja
Publication of JP2005153085A5 publication Critical patent/JP2005153085A5/ja
Application granted granted Critical
Publication of JP4441823B2 publication Critical patent/JP4441823B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2003396029A 2003-11-26 2003-11-26 面取り砥石のツルーイング方法及び面取り装置 Expired - Fee Related JP4441823B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003396029A JP4441823B2 (ja) 2003-11-26 2003-11-26 面取り砥石のツルーイング方法及び面取り装置
DE102004054104A DE102004054104A1 (de) 2003-11-26 2004-11-09 Verfahren zum Abrichten einer Anfasscheibe und Anfasvorrichtung
US10/989,513 US7189149B2 (en) 2003-11-26 2004-11-17 Method of truing chamfering grindstone and chamfering device
CNA2004100963693A CN1621200A (zh) 2003-11-26 2004-11-26 倒角磨石的修整方法及倒角装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003396029A JP4441823B2 (ja) 2003-11-26 2003-11-26 面取り砥石のツルーイング方法及び面取り装置

Publications (3)

Publication Number Publication Date
JP2005153085A JP2005153085A (ja) 2005-06-16
JP2005153085A5 JP2005153085A5 (enExample) 2006-12-28
JP4441823B2 true JP4441823B2 (ja) 2010-03-31

Family

ID=34587623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003396029A Expired - Fee Related JP4441823B2 (ja) 2003-11-26 2003-11-26 面取り砥石のツルーイング方法及び面取り装置

Country Status (4)

Country Link
US (1) US7189149B2 (enExample)
JP (1) JP4441823B2 (enExample)
CN (1) CN1621200A (enExample)
DE (1) DE102004054104A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007061978A (ja) * 2005-09-01 2007-03-15 Tokyo Seimitsu Co Ltd ウェーハ面取り砥石のツルーイング方法及びウェーハ面取り装置
JP4742845B2 (ja) * 2005-12-15 2011-08-10 信越半導体株式会社 半導体ウエーハの面取り部の加工方法及び砥石の溝形状の修正方法
JP4639405B2 (ja) * 2005-12-28 2011-02-23 株式会社東京精密 ウェーハ面取り装置及びウェーハ面取り方法
JP4915146B2 (ja) 2006-06-08 2012-04-11 信越半導体株式会社 ウェーハの製造方法
KR20090063804A (ko) * 2007-12-14 2009-06-18 주식회사 실트론 연삭 휠 트루잉 공구 및 그 제작방법, 이를 이용한 트루잉장치, 연삭 휠의 제작방법, 및 웨이퍼 에지 연삭장치
DE102008010301A1 (de) * 2008-02-21 2009-09-03 Liebherr-Verzahntechnik Gmbh Verfahren zum Betrieb einer Verzahnungsschleifmaschine
JP2009283650A (ja) * 2008-05-22 2009-12-03 Sumco Corp 半導体ウェーハの再生方法
US20120028555A1 (en) * 2010-07-30 2012-02-02 Memc Electronic Materials, Inc. Grinding Tool For Trapezoid Grinding Of A Wafer
JP5967212B2 (ja) * 2012-10-22 2016-08-10 坂東機工株式会社 ガラス板の研削方法及び研削装置
JP6017263B2 (ja) * 2012-10-26 2016-10-26 株式会社東京精密 ウェーハの形状測定装置
JP2014085296A (ja) * 2012-10-26 2014-05-12 Tokyo Seimitsu Co Ltd ウェーハ形状測定装置
KR101452250B1 (ko) * 2013-05-28 2014-10-22 코닝정밀소재 주식회사 기판 대칭 면취 방법 및 장치
CN103394982B (zh) * 2013-08-20 2015-07-29 中国电子科技集团公司第四十六研究所 一种加工厚层外延用硅单晶片的倒角砂轮及倒角方法
JP6238117B2 (ja) * 2013-09-19 2017-11-29 旭硝子株式会社 板状体の加工方法
CN104952719A (zh) * 2014-03-25 2015-09-30 株洲南车时代电气股份有限公司 一种半导体芯片台面造型方法
CN104044075B (zh) * 2014-06-20 2016-04-27 哈尔滨工业大学 采用旋转绿碳化硅磨棒修整树脂基圆弧形金刚石砂轮的方法
JP6528527B2 (ja) * 2015-04-27 2019-06-12 株式会社Sumco ツルーアーの製造方法および半導体ウェーハの製造方法、ならびに半導体ウェーハの面取り加工装置
CN105415194A (zh) * 2015-10-29 2016-03-23 中国科学院长春光学精密机械与物理研究所 一种树脂基金刚石砂轮在位修整方法
JP6020869B2 (ja) * 2016-02-12 2016-11-02 株式会社東京精密 ウェーハ形状測定装置及び方法、並びにウェーハ面取り装置
CN106002635B (zh) * 2016-05-13 2017-11-17 哈尔滨工业大学 基于绿碳化硅碟片的金刚石球头砂轮精密在位修整装置及方法
JP7043179B2 (ja) * 2017-03-29 2022-03-29 株式会社東京精密 ツルーイング方法及び面取り装置
CN109202692B (zh) * 2017-07-07 2022-02-15 3M创新有限公司 研磨装置和研磨操作方法
CN109202725A (zh) * 2017-07-07 2019-01-15 3M创新有限公司 修整磨轮的方法、加工工件的方法、控制器及控制单元
CN109202726B (zh) * 2017-07-07 2025-06-03 广东科杰技术股份有限公司 修整单元和数控加工设备
CN107649978A (zh) * 2017-09-27 2018-02-02 大连德迈仕精密科技股份有限公司 轴类零件扁部及倒角加工装置
JP7046670B2 (ja) * 2018-03-26 2022-04-04 株式会社東京精密 面取り加工システム及びそれに用いられるツルーイング装置
JP7324889B2 (ja) * 2018-03-26 2023-08-10 株式会社東京精密 面取り加工システム
CN108747823B (zh) * 2018-06-19 2020-08-11 湖南镭盛机电科技有限公司 一种自动复合砂轮修整机
JP6590049B2 (ja) * 2018-08-15 2019-10-16 日本電気硝子株式会社 板状物の端面加工装置
JP7351611B2 (ja) * 2018-11-07 2023-09-27 株式会社ディスコ ウェーハの面取り加工装置
JP6939752B2 (ja) * 2018-11-19 2021-09-22 株式会社Sumco シリコンウェーハのヘリカル面取り加工方法
CN110281101B (zh) * 2019-07-23 2021-10-29 西安奕斯伟材料科技有限公司 一种边缘研磨装置及方法
CN110605629B (zh) * 2019-09-19 2022-11-18 西安奕斯伟材料科技有限公司 一种研磨装置
CN112677043B (zh) * 2020-12-22 2022-06-17 苏州格默精密自动化机械有限公司 一种修砂轮装置
CN112658865A (zh) * 2020-12-29 2021-04-16 杭州中欣晶圆半导体股份有限公司 树脂砂轮开沟槽的方法
JP7093875B2 (ja) 2021-06-24 2022-06-30 一郎 片山 ワーク加工装置、砥石、およびワーク加工方法
CN114260784A (zh) * 2021-12-24 2022-04-01 山东有研半导体材料有限公司 8英寸硅抛光片边缘t型轮廓加工用倒角磨削工装及方法
CN114619370B (zh) * 2022-04-12 2023-02-28 浙江工业大学 硅片倒角砂轮修整装置
JP7696865B2 (ja) * 2022-06-22 2025-06-23 株式会社東京精密 ツルアー成形方法
US20250153300A1 (en) * 2023-11-13 2025-05-15 Lapmaster International, Llc Workpiece edge grinding machine and method
JP2025093110A (ja) * 2023-12-11 2025-06-23 株式会社東京精密 ウェーハ加工システム及びウェーハ加工方法
JP2025151660A (ja) * 2024-03-28 2025-10-09 株式会社東京精密 面取り装置、及び、面取り方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586755A (en) * 1946-03-28 1952-02-19 Thompson Grinder Co Method and apparatus for grinding
FR1059719A (fr) * 1948-05-14 1954-03-26 Procédé de mise en forme et d'entretien du profil des meules de machines-outils
JPS58155170A (ja) * 1982-03-05 1983-09-14 Seiko Seiki Co Ltd ドレツシング装置を備えた研削盤
JPS60150965A (ja) * 1984-01-17 1985-08-08 F S K:Kk 超砥粒砥石の総形ドレツシング方法
US4953522A (en) * 1987-11-27 1990-09-04 Schaudt Maschinenbau Gmbh Method of dressing grinding wheels in grinding machines
JPH02218555A (ja) * 1989-02-16 1990-08-31 Fukumatsu Okabe 砥石修正装置
CH684581A5 (de) * 1990-11-07 1994-10-31 Reishauer Ag Verfahren und Vorrichtung zum Profilieren von Schleifscheiben.
US5595528A (en) * 1994-10-19 1997-01-21 Vermont Rebuild, Inc. Grinding wheel dresser
JP3801780B2 (ja) 1998-06-09 2006-07-26 株式会社東京精密 ツルーイング工具及びツルーイング工具付きウェーハ面取り装置

Also Published As

Publication number Publication date
US20050112999A1 (en) 2005-05-26
US7189149B2 (en) 2007-03-13
JP2005153085A (ja) 2005-06-16
DE102004054104A1 (de) 2005-06-23
CN1621200A (zh) 2005-06-01

Similar Documents

Publication Publication Date Title
JP4441823B2 (ja) 面取り砥石のツルーイング方法及び面取り装置
US9211631B2 (en) Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
JP7481518B2 (ja) ツルーイング方法及び面取り装置
CN1070403C (zh) 半导体片研磨机的工件夹持器及其定位方法
CN101161411A (zh) 晶片的磨削加工方法
CN101224552A (zh) 圆盘状基板的磨削方法、磨削装置
JP6789645B2 (ja) 面取り加工装置
KR20250159606A (ko) 트루어 성형방법
JP2009078326A (ja) ウェーハ面取り装置、及びウェーハ面取り方法
JP7128309B2 (ja) 面取り基板の製造方法及びそれに用いられる面取り装置
JP5321813B2 (ja) 面取り加工装置及び面取り加工方法
JP3789672B2 (ja) 研削加工方法
JP6608604B2 (ja) 面取り加工された基板及び液晶表示装置の製造方法
JP2007030119A (ja) ウェーハ面取り装置及びウェーハ面取り方法
JP2007044817A (ja) ウェーハ面取り装置、ウェーハ面取り用砥石、及びツルーイング砥石
JP7158702B2 (ja) 面取り研削装置
JP2007061978A (ja) ウェーハ面取り砥石のツルーイング方法及びウェーハ面取り装置
JP4591830B2 (ja) ウェーハ面取り装置
JP2007044853A (ja) ウェーハ面取り方法及びウェーハ面取り装置
JP4650678B2 (ja) 面取り用砥石のツルーイング方法
JP7024039B2 (ja) 面取り加工装置
JP2008023690A (ja) ウェーハ面取り砥石のツルーイング方法及びウェーハ面取り装置
JP2010162661A (ja) 面取り加工方法及び面取り加工装置
JP2006346818A (ja) ダミーウェーハのテスト加工方法
JP2008010734A (ja) ウェーハ面取り装置、ウェーハ面取り方法、及びツルーイング方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061115

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091216

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091229

R150 Certificate of patent or registration of utility model

Ref document number: 4441823

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130122

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130122

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140122

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees