CN103394982B - 一种加工厚层外延用硅单晶片的倒角砂轮及倒角方法 - Google Patents
一种加工厚层外延用硅单晶片的倒角砂轮及倒角方法 Download PDFInfo
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- CN103394982B CN103394982B CN201310363809.6A CN201310363809A CN103394982B CN 103394982 B CN103394982 B CN 103394982B CN 201310363809 A CN201310363809 A CN 201310363809A CN 103394982 B CN103394982 B CN 103394982B
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- abrasive wheel
- chamfering
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
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CN201310363809.6A CN103394982B (zh) | 2013-08-20 | 2013-08-20 | 一种加工厚层外延用硅单晶片的倒角砂轮及倒角方法 |
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CN103394982B true CN103394982B (zh) | 2015-07-29 |
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Families Citing this family (8)
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CN104952719A (zh) * | 2014-03-25 | 2015-09-30 | 株洲南车时代电气股份有限公司 | 一种半导体芯片台面造型方法 |
CN106239306B (zh) * | 2016-08-01 | 2018-07-31 | 中国电子科技集团公司第四十六研究所 | 一种变r值晶片边缘倒角方法 |
CN108177044B (zh) * | 2017-12-22 | 2020-09-18 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角方法 |
CN109732497B (zh) * | 2019-03-05 | 2021-05-18 | 业成科技(成都)有限公司 | 磨削砂轮棒及其制作方法 |
CN111993295A (zh) * | 2020-06-16 | 2020-11-27 | 上海新欣晶圆半导体科技有限公司 | 一种带有一粗四精沟槽的砂轮及其应用 |
CN111805343A (zh) * | 2020-06-17 | 2020-10-23 | 上海新欣晶圆半导体科技有限公司 | 一种改善硅片倒角面粗糙度的方法 |
CN112171385A (zh) * | 2020-09-14 | 2021-01-05 | 自贡硬质合金有限责任公司 | 一种零件倒角磨削方法 |
CN114406841B (zh) * | 2022-03-29 | 2022-07-26 | 江苏巨弘捆带制造有限公司 | 一种用于钢带生产的打磨装置 |
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JPH05243196A (ja) * | 1992-02-28 | 1993-09-21 | Shin Etsu Handotai Co Ltd | ウエーハ面取部の鏡面研磨方法及び装置 |
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Application publication date: 20131120 Assignee: Tianjing Jinming Electronic Material LLC Assignor: China Electronics Science & Technology Group The 46th Institute Contract record no.: 2016120000039 Denomination of invention: Chamfering grinding wheel for machining silicon single crystal wafer for thick-layer epitaxy, and chamfering method Granted publication date: 20150729 License type: Exclusive License Record date: 20161201 |
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