CN203726355U - 一种大直径碳化硅晶片的边缘倒角用砂轮 - Google Patents
一种大直径碳化硅晶片的边缘倒角用砂轮 Download PDFInfo
- Publication number
- CN203726355U CN203726355U CN201420140316.6U CN201420140316U CN203726355U CN 203726355 U CN203726355 U CN 203726355U CN 201420140316 U CN201420140316 U CN 201420140316U CN 203726355 U CN203726355 U CN 203726355U
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- China
- Prior art keywords
- emery wheel
- chamfering
- silicon carbide
- grinding wheel
- carbide wafer
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Links
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 25
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910001651 emery Inorganic materials 0.000 claims description 60
- 238000000034 method Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420140316.6U CN203726355U (zh) | 2014-03-26 | 2014-03-26 | 一种大直径碳化硅晶片的边缘倒角用砂轮 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420140316.6U CN203726355U (zh) | 2014-03-26 | 2014-03-26 | 一种大直径碳化硅晶片的边缘倒角用砂轮 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203726355U true CN203726355U (zh) | 2014-07-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420140316.6U Expired - Lifetime CN203726355U (zh) | 2014-03-26 | 2014-03-26 | 一种大直径碳化硅晶片的边缘倒角用砂轮 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203726355U (zh) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106239306A (zh) * | 2016-08-01 | 2016-12-21 | 中国电子科技集团公司第四十六研究所 | 一种变r值晶片边缘倒角方法 |
| CN106363546A (zh) * | 2016-10-14 | 2017-02-01 | 苏州赛尔科技有限公司 | 多片一体式活塞环精密切割砂轮 |
| CN107225515A (zh) * | 2017-07-11 | 2017-10-03 | 苏州精协机械制造有限公司 | 挤压丝锥螺纹磨床的组合式多线磨轮 |
| CN108177044A (zh) * | 2017-12-22 | 2018-06-19 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角技术 |
| CN109048547A (zh) * | 2018-08-24 | 2018-12-21 | 北京铂阳顶荣光伏科技有限公司 | 磨边倒角方法及磨边倒角设备 |
| CN110757287A (zh) * | 2019-10-24 | 2020-02-07 | 西安奕斯伟硅片技术有限公司 | 倒角磨轮及其制备方法、晶圆加工设备 |
| CN115870641A (zh) * | 2023-02-20 | 2023-03-31 | 湖北三维半导体集成创新中心有限责任公司 | 一种芯片及其制造方法、封装结构 |
-
2014
- 2014-03-26 CN CN201420140316.6U patent/CN203726355U/zh not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106239306A (zh) * | 2016-08-01 | 2016-12-21 | 中国电子科技集团公司第四十六研究所 | 一种变r值晶片边缘倒角方法 |
| CN106239306B (zh) * | 2016-08-01 | 2018-07-31 | 中国电子科技集团公司第四十六研究所 | 一种变r值晶片边缘倒角方法 |
| CN106363546A (zh) * | 2016-10-14 | 2017-02-01 | 苏州赛尔科技有限公司 | 多片一体式活塞环精密切割砂轮 |
| CN107225515A (zh) * | 2017-07-11 | 2017-10-03 | 苏州精协机械制造有限公司 | 挤压丝锥螺纹磨床的组合式多线磨轮 |
| CN108177044A (zh) * | 2017-12-22 | 2018-06-19 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角技术 |
| CN108177044B (zh) * | 2017-12-22 | 2020-09-18 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅片边缘倒角方法 |
| CN109048547A (zh) * | 2018-08-24 | 2018-12-21 | 北京铂阳顶荣光伏科技有限公司 | 磨边倒角方法及磨边倒角设备 |
| CN110757287A (zh) * | 2019-10-24 | 2020-02-07 | 西安奕斯伟硅片技术有限公司 | 倒角磨轮及其制备方法、晶圆加工设备 |
| CN115870641A (zh) * | 2023-02-20 | 2023-03-31 | 湖北三维半导体集成创新中心有限责任公司 | 一种芯片及其制造方法、封装结构 |
| CN115870641B (zh) * | 2023-02-20 | 2023-05-23 | 湖北三维半导体集成创新中心有限责任公司 | 一种芯片及其制造方法、封装结构 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Grinding wheel for chamfering edge of large-diameter silicon carbide wafer Effective date of registration: 20150618 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2015990000494 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Grinding wheel for chamfering edge of large-diameter silicon carbide wafer Effective date of registration: 20160729 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2016990000657 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20160726 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2015990000494 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170615 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2016990000657 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Grinding wheel for chamfering edge of large-diameter silicon carbide wafer Effective date of registration: 20170616 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2017370000066 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190626 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2017370000066 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Grinding wheel for chamfering edge of large-diameter silicon carbide wafer Effective date of registration: 20190627 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2019370000145 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191216 Granted publication date: 20140723 Pledgee: China Co. truction Bank Corp Ji'nan hi tech sub branch Pledgor: SICC MATERIALS Co.,Ltd. Registration number: 2019370000145 |
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Effective date of registration: 20191230 Address after: No. 99, South Tianyue Road, Huaiyin District, Jinan City, Shandong Province Patentee after: SICC Co.,Ltd. Address before: 250118 Shandong province Huaiyin District of Ji'nan city in the middle Mile Lake Patentee before: SICC MATERIALS Co.,Ltd. |
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Address after: No.99, Tianyue South Road, Huaiyin District, Jinan City, Shandong Province Patentee after: Shandong Tianyue advanced technology Co.,Ltd. Address before: No.99, Tianyue South Road, Huaiyin District, Jinan City, Shandong Province Patentee before: SICC Co.,Ltd. |
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