CN1070403C - 半导体片研磨机的工件夹持器及其定位方法 - Google Patents
半导体片研磨机的工件夹持器及其定位方法 Download PDFInfo
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- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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Abstract
一种用于研磨半导体片的旋转式研磨机上的工件夹持器,其具有一个朝向旋转磨具的可转动的工作面,工作面上放有等待加工的半导体片,还具有一些压电元件,这些元件将工件夹持器轴向支撑住,可以对压电元件进行彼此独立地调整并使其在调整时出现线性尺寸变化,同时通过调整压电元件使工件夹持器从压电元件支撑夹持器的位置开始上升或下降。此外,本发明还涉及使工件夹持器定位的方法。
Description
本发明涉及一种用于研磨半导体片的旋转式研磨机上的工件夹持器,其具有朝向旋转磨具的可转动工作面,工作面上置有待加工的半导体片,而且还具有一些其它装置,工件夹持器轴向支撑在这些装置上。此外,本发明还涉及一种使工件夹持器定位的方法。
在研磨半导体表面时,工件夹持器的转轴和旋转式研磨机的磨具的旋转轴之间的相对空间位置具有决定性的意义。例如,比较合适的是,最好是使磨具的旋转轴和工件夹持器的转轴彼此相对或互为基准地合适地保持在一个确定的角度内,以便通过研磨使半导体片呈一种特定的几何结构,例如形成弯曲的侧面。
在通常情况下,该目标是通过研磨过程中从待加工的半导体片的侧面上磨掉均匀厚度层而实现的。实现该目标的前提是,使工件夹持器的工作面和磨具的研磨面处于相互平行的位置。为了满足这个条件,必须使工件夹持器的转轴和磨具的旋转轴的方向相互平行。
在研磨半导体片期间,轴的位置会因温度影响和加工中力的作用而发生变化。因此必须采用一定的措施恢复在两轴之间建立起的所希望的相对位置。
迄今为止该目标是通过最终改变磨具旋转轴的定向来实现的,其中使磨具的心轴绕一个确定的转动点旋转或是使它的悬架变形。而固定安装的工件夹持器的转轴方向并不因此而发生改变。从对所研磨的半导体片几何结构的要求不断提高的角度上看,这种方式是繁琐的、费时的和不好的,而且该方法所得到的结果不精确。
因此,本发明的任务是提供这样一种装置和方法,借助于这种装置和方法可以用简单的方式和较高的精度精确调整磨具旋转轴和工件夹持器转轴之间的相对空间位置。
该任务是通过这样一个用于研磨半导体片的旋转式研磨机上的工件夹持器来完成的,该夹持器具有一个朝向旋转磨具的可转动的工作面,工作面上放有待加工的半导体片,还具有一些可将工件夹持器轴向支撑在其上的装置,其特征在于,这些装置是压电元件,这些压电元件可以彼此独立地调整,而且在调整时可以使其发生线性尺寸变化,同时受调整的压电元件使工件夹持器在该工件夹持器受支承的位置上轴向上升或下降。
此外,该任务是通过使本发明所述工件夹持器定位的方法而完成的,其中这样调整压电元件,即,使工件夹持器的转轴和磨具的旋转轴彼此平行定向或彼此处于一个所希望的确定位置上。
对于压电元件应理解为是一种公知的和市场上可买到的压电转换器,该转换器将电能转为运动能。本发明的构思基于,使压电元件与用于半导体片的旋转式研磨机的工件夹持器相结合并使它的运动有利于使工件夹持器定位。
下面将结合附图对本发明进行详细说明。
图1表示一个用于研磨半导体片的旋转式研磨机的示意性和示例性剖面图。其中只描述为更好地理解本发明所需的特征。
如图1所示,本发明所述的工件夹持器1(在英语中称为“夹具”)具有作为特殊技术特征的三个压电元件2,压电元件最好是固定在机座3上。压电元件轴向支撑工件夹持器。压电元件是这样布置的,即它们在调整时,也就是说在激励电压发生变化时,这些压电元件出现轴向的线性尺寸变化。根据电压的变化,工件夹持器将在其受压电元件支撑的位置上轴向上升或下降。压电元件支撑工件夹持器的支撑位置4最好是这样一种位置,其处于工件夹持器的外周上,因为布置在外周上时,由压电元件施加的转矩大于将支撑位置布置在靠近工件夹持器的转轴5附近时的转矩。然而,当工件夹持器的转轴和磨具旋转轴之间理想的相对空间位置不能通过设在外周上的支撑位置进行调整时,上述支撑位置的设置是很实用的。
最好将工件夹持器与一个负压装置装在一起,这样可以使用待加工半导体片的一个侧面吸在工件夹持器的工作面上。
每个压电元件都设有一个自用的测头,该测头记录压电元件的即时线性尺寸。根据所调整的工件夹持器1的转轴5和磨具7的旋转轴6之间的相对空间位置关系来调整压电元件。为了调整压电元件而设置了一个中央控制单元,通过该单元可以对压电元件进行单独调整。为了简单起见,在图中未示出测头和中央控制单元。
支承在压电元件上的工件夹持器以较高的精度定位。如果同时调整压电元件并使其线性尺寸同向地改变一个确定的值,那么工件夹持器将在不改变转轴5的取向的情况下产生一个进给运动。如果当根据需要仅允许磨掉很窄的允许量并且应形成尽可能均匀和连续的进给时,这种进给最好是通过工具轴8的轴向运动形成的进给。在此,比较合理的是,研磨半导体片首先是从由工具轴运动而控制的进给开始的,而且一旦磨具处于压电元件的最大上升区,就转为由工件夹持器的运动控制进给。
还可以使工件夹持器如此定位,即改变工件夹持器1转轴的空间定向并由此改变该转轴相对于磨具旋转轴的相对位置。这是通过调整一个或多个压电元件来实现的,其中在线性尺寸变化为同向的情况下不考虑对所有压电元件进行上述对称的,也就是说同时的调整。当压电元件的调整不对称时,工件夹持器1的工作面9和位于其上的半导体片10将从它们的原始位置上倾斜。
所以,压电元件线性尺寸的每一种状态都对应于工件夹持器转轴的一个确定的空间定向。如果需要改变该定向,例如当在检验研磨的半导体片的几何形状时发现磨具的旋转轴和工件夹持器的转轴之间的相对空间位置已经发生变化之后,可以通过适当地调整压电元件,使两个轴重新恢复到原始的相对空间位置。根据预先的规定可以这样调整压电元件,即使得工件夹持器的转轴和磨具的旋转轴平行定向或彼此处于所希望的确定位置。工件夹持器借助能对所有压电元件进行单独或整体调整的中央控制单元可获得理想定位。
通常,三个压电元件中最多有两个可以由支撑件代替。然而在这种情况下,工件夹持器的自由运动或多或少受到限制而且工件夹持器不可能有进给运动。
上述使用于半导体片的旋转式研磨机的工件夹持器定位的方法具有特别好的优点,即能够很快地和没有很大成本浪费地完成对工件夹持器转轴的空间定向的校正。其调整精度如此之高,以致于使半导体片能够获得高精度的研磨。因此,本发明可优选用于研磨硅片和所谓的粘合的SOI片(SOI=绝缘体上的硅)。
另一个优点是,通过施加到压电元件上的电压可以测出磨具的轴向切力。在研磨半导体片期间出现的不可预见的切力变化一般是这样一个信号,即磨具的旋转轴和工件夹持器的转轴之间的相对空间位置发生了出乎意料的变化。这还意味着,实际上其它影响研磨过程的参数发生了变化。因此,比较合适的是,在研磨半导体片期间借助于压电元件来监控轴向切力并且在出现异常情况时中止研磨过程和检查旋转式研磨机。实例
在一个实验中,将Pisco DFG-82IF/8型旋转式研磨机的工件夹持器按图中所示方式用Fa.Physik In-strument制造的三个压电元件轴向支撑到机座上。将压电元件的最大升程设计为10μm。每个压电元件上均设有测头,测头用于确定压电元件的线性尺寸。可以用一个中央控制单元对压电元件进行调整。借助这种机构布置,可以根据预先规定的在研磨之后尽可能成为平面的要求对半导体片进行研磨。通过采用本发明的方法可以达到使每个半导体片的全部厚度变化,即其平面度的量度,(TTV值)均保持在1μm以下的范围内。
Claims (9)
1、用于研磨半导体片的旋转式研磨机上的工件夹持器,其具有一个朝向旋转磨具的可转动的工作面,工作面上置有待加工的半导体片,而且还具有一些将工件夹持器轴向支撑在其上的装置,其特征在于,
这些装置是压电元件,这些元件可相互独立地进行调整而且在调整时形成线性尺寸变化,同时通过调整压电元件可以使工件夹持器从压电元件支撑该工件夹持器的位置上轴向上升或下降。
2、根据权利要求1所述的工件夹持器,其特征在于,设有三个用于轴向支撑工作夹持器的压电元件。
3、根据权利要求1或2所述的工件夹持器,其特征在于,设有用于将待加工的半导体片负压吸附到工件夹持器上的装置。
4、根据权利要求1所述的工件夹持器,其特征在于,压电元件支撑在工件夹持器的外周缘上。
5、根据权利要求1所述的工件夹持器,其特征在于,每个压电元件都装配一个测头,其用于记录压电元件的线性尺寸变化。
6、根据权利要求1所述的工件夹持器,其特征在于,设有一个中央控制单元,通过该单元可以对压电元件进行调整。
7、一种用于将权利要求1至6之一所述的工件夹持器定位的方法,其特征在于,
对压电元件施加电压,使所述压电元件的高度发生线性尺寸变化,从而调整压电元件,使得工件夹持器的转轴和磨具的旋转轴相互平行定向或相互处于所希望的确定位置上。
8、根据权利要求7所述的方法,其特征在于,对压电元件施加电压,使所述压电元件的高度发生线性尺寸变化,从而使得工件夹持器产生进给运动。
9、根据权利要求7或8所述的方法,其特征在于,在研磨半导体片期间,可借助于测量施加到压电元件上的电压,测量旋转式研磨机的轴向切力并且在出现出乎意料的切力变化之后使工件夹持器重新定位。
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DE4335980A DE4335980C2 (de) | 1993-10-21 | 1993-10-21 | Verfahren zum Positionieren einer Werkstückhalterung |
DEP4335980.9 | 1993-10-21 |
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US (1) | US5567199A (zh) |
JP (1) | JP2896746B2 (zh) |
KR (1) | KR0159916B1 (zh) |
CN (1) | CN1070403C (zh) |
DE (1) | DE4335980C2 (zh) |
IT (1) | IT1280040B1 (zh) |
MY (1) | MY110610A (zh) |
TW (1) | TW245818B (zh) |
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US5951368A (en) * | 1996-05-29 | 1999-09-14 | Ebara Corporation | Polishing apparatus |
DE19627142C2 (de) * | 1996-07-05 | 2003-04-24 | Andreas Hilker | Vorrichtung zur Oberflächenbearbeitung von Metall, Glas oder dergleichen |
KR100218309B1 (ko) * | 1996-07-09 | 1999-09-01 | 구본준 | 씨엠피장치의 반도체웨이퍼 레벨링 감지장치 및 방법 |
US5816895A (en) * | 1997-01-17 | 1998-10-06 | Tokyo Seimitsu Co., Ltd. | Surface grinding method and apparatus |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
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JPH1110498A (ja) * | 1997-06-18 | 1999-01-19 | Sumitomo Heavy Ind Ltd | 固体アクチュエータを用いた面振れ修正機構を持つ加工装置 |
US5888120A (en) * | 1997-09-29 | 1999-03-30 | Lsi Logic Corporation | Method and apparatus for chemical mechanical polishing |
US5920769A (en) * | 1997-12-12 | 1999-07-06 | Micron Technology, Inc. | Method and apparatus for processing a planar structure |
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JP4783405B2 (ja) * | 2008-07-02 | 2011-09-28 | 光洋機械工業株式会社 | 傾斜角調整装置及びワーク装着装置 |
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JP6660743B2 (ja) * | 2016-01-22 | 2020-03-11 | 株式会社東京精密 | 研削装置 |
JP6906312B2 (ja) * | 2017-01-16 | 2021-07-21 | 株式会社ディスコ | 研磨装置 |
CN109499984B (zh) * | 2018-10-13 | 2022-03-18 | 广东嗨学云教育科技有限公司 | 一种集成电路通用制造装置 |
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JP7391470B2 (ja) | 2019-12-20 | 2023-12-05 | 株式会社ディスコ | ワークの研削方法 |
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- 1994-07-12 TW TW083106328A patent/TW245818B/zh active
- 1994-08-12 JP JP21073394A patent/JP2896746B2/ja not_active Expired - Lifetime
- 1994-09-21 US US08/310,048 patent/US5567199A/en not_active Expired - Fee Related
- 1994-10-18 IT IT94RM000674A patent/IT1280040B1/it active IP Right Grant
- 1994-10-20 KR KR1019940026844A patent/KR0159916B1/ko not_active IP Right Cessation
- 1994-10-21 CN CN94117575A patent/CN1070403C/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
MY110610A (en) | 1998-08-29 |
ITRM940674A0 (it) | 1994-10-18 |
IT1280040B1 (it) | 1997-12-29 |
CN1108591A (zh) | 1995-09-20 |
JP2896746B2 (ja) | 1999-05-31 |
TW245818B (zh) | 1995-04-21 |
JPH07122524A (ja) | 1995-05-12 |
KR950012617A (ko) | 1995-05-16 |
KR0159916B1 (ko) | 1999-02-01 |
DE4335980C2 (de) | 1998-09-10 |
DE4335980A1 (de) | 1995-04-27 |
ITRM940674A1 (it) | 1996-04-18 |
US5567199A (en) | 1996-10-22 |
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