JP4783405B2 - 傾斜角調整装置及びワーク装着装置 - Google Patents
傾斜角調整装置及びワーク装着装置 Download PDFInfo
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- JP4783405B2 JP4783405B2 JP2008173234A JP2008173234A JP4783405B2 JP 4783405 B2 JP4783405 B2 JP 4783405B2 JP 2008173234 A JP2008173234 A JP 2008173234A JP 2008173234 A JP2008173234 A JP 2008173234A JP 4783405 B2 JP4783405 B2 JP 4783405B2
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- angle adjusting
- inclination angle
- workpiece mounting
- rotating body
- rotary table
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- 230000008878 coupling Effects 0.000 claims description 51
- 238000010168 coupling process Methods 0.000 claims description 51
- 238000005859 coupling reaction Methods 0.000 claims description 51
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 239000012530 fluid Substances 0.000 claims description 18
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 20
- 239000013078 crystal Substances 0.000 description 18
- 238000001514 detection method Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000003068 static effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
2 傾斜砥石
4 ワーク装着面(調整対象部)
3 ワーク装着装置
6 固定軸
7 回転体(支持体)
8,9 傾斜角調整面
10 傾斜角調整体
13 回転テーブル
14 球面結合手段
15 第1解除手段
16 第2解除手段
17 回転駆動手段
21 第1規制手段
22 第2規制手段
29 封止体
24 ワーク装着体(可動体)
36 傾斜角調整軸
37 位相角調整軸
42 突出軸
45 球面座金部
46 付勢手段
47 スラスト軸受
Claims (11)
- 駆動手段により軸心廻りに回転駆動される支持体と、該支持体に結合された可動体とを備え、前記可動体の前記支持体と反対側の調整対象部の傾斜角を調整可能にした傾斜角調整装置において、前記支持体はその軸心に対して傾斜する傾斜角調整面を有し、前記可動体は前記支持体の前記傾斜角調整面に面接触する傾斜角調整面と、前記支持体の前記傾斜角調整面と平行でない前記調整対象部とを有し、前記支持体と前記可動体との一方に、前記傾斜角調整面に対して略垂直に他方側へと突出して該他方側を相対回転自在に支持する傾斜角調整軸を設け、前記可動体を前記支持体側に付勢して前記支持体と前記可動体とを前記傾斜角調整軸廻りに回転調整可能に結合する結合手段と、前記支持体と前記可動体との結合を流体圧により前記結合手段に抗して解除する解除手段と、前記可動体に係脱自在に結合して該可動体の回転を規制する規制手段とを備えたことを特徴とする傾斜角調整装置。
- 固定部材により軸心廻りに回転自在に支持され且つ駆動手段により回転駆動される回転体と、ワーク装着面を有し且つ前記回転体により支持されたワーク装着体とを備え、前記ワーク装着面の傾斜角を調整するようにしたワーク装着装置において、前記回転体はその軸心に対して傾斜する傾斜角調整面を有し、前記ワーク装着体は前記ワーク装着面の反対側に該ワーク装着面に対して傾斜し且つ前記回転体の前記傾斜角調整面に面接触する傾斜角調整面を有し、前記ワーク装着体と前記回転体との一方に、前記傾斜角調整面に対して略垂直に他方側へと突出して該他方側を相対回転自在に支持する傾斜角調整軸を設け、前記ワーク装着体を前記回転体側に付勢して前記回転体と前記ワーク装着体とを前記傾斜角調整軸廻りに回転調整可能に結合し且つ前記ワーク装着体を前記固定部材に対して前記回転体と前記傾斜角調整軸との軸心の交点廻りに回転自在に結合する結合手段と、前記回転体と前記ワーク装着体との結合を流体圧により前記結合手段に抗して解除する解除手段と、前記ワーク装着体に係脱自在に結合して該ワーク装着体の回転を規制する規制手段とを備えたことを特徴とするワーク装着装置。
- 前記ワーク装着体は前記ワーク装着面と前記傾斜角調整面とを有する回転テーブルであることを特徴とする請求項2に記載のワーク装着装置。
- 前記ワーク装着体は前記ワーク装着面を有する回転テーブルと、該回転テーブルと前記回転体との間に相対回転可能に介在された傾斜角調整体とを備え、前記傾斜角調整体に前記傾斜角調整面を設け、前記傾斜角調整体と前記回転テーブルとの対向側に、面接触する位相角調整面を前記ワーク装着面と略平行に設け、前記傾斜角調整体と前記回転テーブルとの何れか一方に、前記位相角調整面に対して他方側へと略垂直に突出して該他方側を相対回転自在に支持する位相角調整軸を設けたことを特徴とする請求項2に記載のワーク装着装置。
- 前記回転体の軸心と直角な面と前記傾斜角調整面とのなす角と、前記ワーク装着体の前記ワーク装着面と前記傾斜角調整面のなす角とが略同一であることを特徴とする請求項2〜4の何れかに記載のワーク装着装置。
- 前記回転体を軸受を介して内周側から支持する筒状の固定軸と、前記回転テーブルの軸心上で前記固定軸内に突出する突出軸とを備え、前記突出軸と前記固定軸との間に前記結合手段を備え、該結合手段は前記回転テーブルを前記回転体側へと軸心方向に付勢する付勢手段を含むことを特徴とする請求項3又は4に記載のワーク装着装置。
- 前記結合手段は前記固定軸と前記突出軸との間に介在され且つ前記突出軸に対して軸心方向に摺動自在に套嵌された座金部と、前記突出軸に套嵌され且つ前記回転テーブルを前記回転体側へと軸心方向に付勢する前記付勢手段と、前記座金部と前記付勢手段との間に介在されたスラスト軸受とを備えたことを特徴とする請求項2〜6の何れかに記載のワーク装着装置。
- 前記回転体と前記ワーク装着体との結合を流体圧により解除する解除手段と、前記ワーク装着体に係脱自在に結合して該ワーク装着体の回転を規制する規制手段と、前記回転体を回転駆動する駆動手段とを備えたことを特徴とする請求項3に記載のワーク装着装置。
- 前記回転体と前記傾斜角調整体との結合を流体圧により解除する第1解除手段と、前記傾斜角調整体と前記回転テーブルとの結合を流体圧により解除する第2解除手段と、前記傾斜角調整体に係脱自在に結合して該傾斜角調整体の回転を規制する第1規制手段と、前記回転テーブルに係脱自在に結合して該回転テーブルの回転を規制する第2規制手段と、前記回転体を回転駆動する駆動手段とを備えたことを特徴とする請求項4に記載のワーク装着装置。
- 前記回転体は前記回転テーブルの前記ワーク装着面に装着されたワークを平面研削する研削砥石の砥石軸と略平行な軸心廻りに回転し、該回転体と前記傾斜角調整体との対向面に形成された前記各傾斜角調整面は前記軸心に対して傾斜し、前記回転テーブルと前記傾斜角調整体との対向面に形成された前記各位相角調整面は前記ワーク装着面と略平行であることを特徴とする請求項4に記載のワーク装着装置。
- 前記回転体上に該回転体を上側から覆う前記ワーク装着体が設けられ、前記軸受の下側で前記回転体と前記固定軸との間を封止する封止体が設けられていることを特徴とする請求項2〜10の何れかに記載のワーク装着装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008173234A JP4783405B2 (ja) | 2008-07-02 | 2008-07-02 | 傾斜角調整装置及びワーク装着装置 |
US12/483,713 US8403732B2 (en) | 2008-07-02 | 2009-06-12 | Inclination angle adjusting device and workpiece attaching device |
RU2009125306/02A RU2521776C2 (ru) | 2008-07-02 | 2009-07-01 | Устройство для крепления заготовки |
KR1020090060338A KR101592579B1 (ko) | 2008-07-02 | 2009-07-02 | 경사각 조정 장치 및 워크 장착 장치 |
Applications Claiming Priority (1)
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JP2008173234A JP4783405B2 (ja) | 2008-07-02 | 2008-07-02 | 傾斜角調整装置及びワーク装着装置 |
Publications (2)
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JP2010012540A JP2010012540A (ja) | 2010-01-21 |
JP4783405B2 true JP4783405B2 (ja) | 2011-09-28 |
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JP2008173234A Active JP4783405B2 (ja) | 2008-07-02 | 2008-07-02 | 傾斜角調整装置及びワーク装着装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8403732B2 (ja) |
JP (1) | JP4783405B2 (ja) |
KR (1) | KR101592579B1 (ja) |
RU (1) | RU2521776C2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101610832B1 (ko) * | 2010-03-03 | 2016-04-08 | 삼성전자주식회사 | 화학적 기계적 연마 설비 |
JP5926501B2 (ja) * | 2011-06-15 | 2016-05-25 | 東京応化工業株式会社 | 保持装置および保持方法 |
KR101407708B1 (ko) * | 2012-03-06 | 2014-06-13 | 도쿄 세이미츄 코퍼레이션 리미티드 | 연삭 장치 |
JP5355766B2 (ja) * | 2012-03-06 | 2013-11-27 | 株式会社東京精密 | 研削装置 |
JP2022033494A (ja) * | 2020-08-17 | 2022-03-02 | 株式会社ディスコ | 加工装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU433994A1 (ru) * | 1971-06-21 | 1974-06-30 | Наклоняемый стол | |
EP0017271B1 (de) * | 1979-03-27 | 1982-10-27 | Werkzeugmaschinenfabrik Oerlikon-Bührle AG | Aufspannvorrichtung zum Aufspannen von Messern einer Verzahnungsmaschine auf einer Schleifmaschine |
JPS58211840A (ja) * | 1982-05-29 | 1983-12-09 | Mitsubishi Heavy Ind Ltd | 傾斜面加工用治具 |
SU1127746A1 (ru) * | 1983-08-04 | 1984-12-07 | Московский Машиностроительный Завод "Коммунар" | Устройство дл изменени положени издели при обработке |
JPH0288167A (ja) * | 1988-09-27 | 1990-03-28 | Hitachi Electron Eng Co Ltd | ディスク回転装置 |
SU1731485A1 (ru) * | 1989-09-19 | 1992-05-07 | Производственное объединение "Коломенский завод тяжелого станкостроения" | Стол зубообрабатывающего станка |
DE4335980C2 (de) * | 1993-10-21 | 1998-09-10 | Wacker Siltronic Halbleitermat | Verfahren zum Positionieren einer Werkstückhalterung |
JPH08215964A (ja) * | 1995-02-10 | 1996-08-27 | Rap Master S F T Kk | ベースプレートの傾き調整機構 |
JPH1015795A (ja) | 1996-07-08 | 1998-01-20 | Koyo Mach Ind Co Ltd | 単結晶材料の方位修正用支持装置および研削装置 |
US5816895A (en) * | 1997-01-17 | 1998-10-06 | Tokyo Seimitsu Co., Ltd. | Surface grinding method and apparatus |
JP2003148583A (ja) * | 2001-11-14 | 2003-05-21 | Fuji Seiki Kk | ワーク姿勢調整装置 |
US6966817B2 (en) * | 2004-02-11 | 2005-11-22 | Industrial Technology Research Institute | Wafer grinder |
KR100865941B1 (ko) * | 2006-11-28 | 2008-10-30 | 세메스 주식회사 | 스핀헤드 및 상기 스핀헤드의 기판 척킹/언척킹방법,그리고 상기 스핀헤드를 구비하는 기판 처리 장치 |
KR101036605B1 (ko) * | 2008-06-30 | 2011-05-24 | 세메스 주식회사 | 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치 |
KR101004434B1 (ko) * | 2008-11-26 | 2010-12-28 | 세메스 주식회사 | 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법 |
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2008
- 2008-07-02 JP JP2008173234A patent/JP4783405B2/ja active Active
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2009
- 2009-06-12 US US12/483,713 patent/US8403732B2/en active Active
- 2009-07-01 RU RU2009125306/02A patent/RU2521776C2/ru active
- 2009-07-02 KR KR1020090060338A patent/KR101592579B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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KR101592579B1 (ko) | 2016-02-05 |
RU2009125306A (ru) | 2011-01-10 |
US8403732B2 (en) | 2013-03-26 |
KR20100004068A (ko) | 2010-01-12 |
JP2010012540A (ja) | 2010-01-21 |
RU2521776C2 (ru) | 2014-07-10 |
US20100003908A1 (en) | 2010-01-07 |
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