JP4434427B2 - 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム - Google Patents
熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム Download PDFInfo
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- JP4434427B2 JP4434427B2 JP2000127319A JP2000127319A JP4434427B2 JP 4434427 B2 JP4434427 B2 JP 4434427B2 JP 2000127319 A JP2000127319 A JP 2000127319A JP 2000127319 A JP2000127319 A JP 2000127319A JP 4434427 B2 JP4434427 B2 JP 4434427B2
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- general formula
- resin
- hydrogen atom
- polyhydroxy polyether
- carbon atoms
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- Expired - Lifetime
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- 229920005989 resin Polymers 0.000 title claims description 52
- 239000011347 resin Substances 0.000 title claims description 52
- 229920001169 thermoplastic Polymers 0.000 title claims description 20
- 239000004416 thermosoftening plastic Substances 0.000 title claims description 20
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 32
- 229920000570 polyether Polymers 0.000 claims description 32
- 229910052698 phosphorus Inorganic materials 0.000 claims description 30
- 239000011574 phosphorus Substances 0.000 claims description 29
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 11
- 230000001588 bifunctional effect Effects 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- CIUQDSCDWFSTQR-UHFFFAOYSA-N [C]1=CC=CC=C1 Chemical compound [C]1=CC=CC=C1 CIUQDSCDWFSTQR-UHFFFAOYSA-N 0.000 claims description 8
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 6
- 239000003063 flame retardant Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 44
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 27
- 239000002966 varnish Substances 0.000 description 24
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 17
- 229920003002 synthetic resin Polymers 0.000 description 14
- 239000000057 synthetic resin Substances 0.000 description 14
- 238000005259 measurement Methods 0.000 description 9
- 150000004820 halides Chemical class 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- -1 flame retardant compound Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007719 peel strength test Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 2
- KMRIWYPVRWEWRG-UHFFFAOYSA-N 2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)benzene-1,4-diol Chemical compound OC1=CC=C(O)C(P2(=O)C3=CC=CC=C3C3=CC=CC=C3O2)=C1 KMRIWYPVRWEWRG-UHFFFAOYSA-N 0.000 description 2
- LLOXZCFOAUCDAE-UHFFFAOYSA-N 2-diphenylphosphorylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(P(=O)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 LLOXZCFOAUCDAE-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- IMJWYODDPLPNHC-UHFFFAOYSA-N 2-[[2,5-ditert-butyl-4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound CC(C)(C)C=1C=C(OCC2OC2)C(C(C)(C)C)=CC=1OCC1CO1 IMJWYODDPLPNHC-UHFFFAOYSA-N 0.000 description 1
- RHYLFJIYMVTKQO-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)naphthalen-1-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C1=CC=CC=C11)=CC=C1OCC1CO1 RHYLFJIYMVTKQO-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- Polyethers (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000127319A JP4434427B2 (ja) | 2000-04-27 | 2000-04-27 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000127319A JP4434427B2 (ja) | 2000-04-27 | 2000-04-27 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001310939A JP2001310939A (ja) | 2001-11-06 |
| JP2001310939A5 JP2001310939A5 (https=) | 2007-06-14 |
| JP4434427B2 true JP4434427B2 (ja) | 2010-03-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000127319A Expired - Lifetime JP4434427B2 (ja) | 2000-04-27 | 2000-04-27 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4434427B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4530187B2 (ja) * | 2000-06-21 | 2010-08-25 | 新日鐵化学株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物 |
| US6762251B2 (en) * | 2002-09-04 | 2004-07-13 | Tohto Kasei Co., Ltd. | Thermoplastic polyhydroxypolyether resin and an insulation film produced therefrom |
| US7751678B2 (en) | 2004-10-07 | 2010-07-06 | Hitachi Chemical Company, Ltd. | Resin composition for optical material, resin film for optical material and optical waveguide using same |
| TWI445790B (zh) * | 2007-02-28 | 2014-07-21 | Nippon Steel & Sumikin Chem Co | A flame retardant adhesive resin composition, and a flexible printed circuit board material using the same |
| JP2008208315A (ja) * | 2007-02-28 | 2008-09-11 | Toto Kasei Co Ltd | ノンハロゲン難燃性接着剤およびそれを用いたフレキシブルプリント配線板用材料 |
| JP5376767B2 (ja) * | 2007-03-26 | 2013-12-25 | 新日鉄住金化学株式会社 | 新規熱可塑性ポリヒドロキシポリエーテル樹脂及び、それを配合した樹脂組成物 |
| TWI437063B (zh) * | 2007-06-05 | 2014-05-11 | Nippon Steel & Sumikin Chem Co | A flame retardant adhesive resin composition and an adhesive film using the same |
| JP5153320B2 (ja) * | 2007-12-28 | 2013-02-27 | 新日鉄住金化学株式会社 | 新規リン含有難燃性樹脂、それを含有するエポキシ樹脂組成物及びその硬化物 |
| JP5246744B2 (ja) * | 2007-12-28 | 2013-07-24 | 新日鉄住金化学株式会社 | 難燃性接着剤樹脂組成物及びそれを用いたフレキシブルプリント基板用材料 |
| JP5485521B2 (ja) * | 2008-05-26 | 2014-05-07 | 新日鉄住金化学株式会社 | 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム、カバーレイフィルム及びフレキシブル銅張積層板 |
| CN102585203A (zh) * | 2012-01-11 | 2012-07-18 | 吉林大学 | 卤苯侧基取代聚芳醚阻燃材料及其制备方法 |
| JP6193689B2 (ja) * | 2013-09-09 | 2017-09-06 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂及び組成物、硬化物 |
| JP7055664B2 (ja) | 2018-02-26 | 2022-04-18 | 日鉄ケミカル＆マテリアル株式会社 | リン含有フェノキシ樹脂、その樹脂組成物、及び硬化物 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3092009B2 (ja) * | 1990-05-01 | 2000-09-25 | 東都化成株式会社 | 難燃剤及び該難燃剤を含有した熱硬化性難燃性樹脂組成物 |
| JPH0784509B2 (ja) * | 1991-08-02 | 1995-09-13 | 北興化学工業株式会社 | リン含有エポキシ樹脂の製造方法 |
| JPH0539345A (ja) * | 1991-08-02 | 1993-02-19 | Hokko Chem Ind Co Ltd | リン含有エポキシ樹脂 |
| JP2669217B2 (ja) * | 1991-10-02 | 1997-10-27 | 日立化成工業株式会社 | 難燃性エポキシフィルム |
| JP3471395B2 (ja) * | 1993-12-17 | 2003-12-02 | 旭化成エポキシ株式会社 | 低発煙性難燃性化合物 |
| JP3517933B2 (ja) * | 1994-03-24 | 2004-04-12 | 東都化成株式会社 | エポキシ基含有ポリヒドロキシポリエ−テル樹脂及びその樹脂組成物 |
| JPH08188638A (ja) * | 1995-01-11 | 1996-07-23 | Hitachi Ltd | 樹脂封止型半導体装置並びにその製造方法 |
| JP3613724B2 (ja) * | 1997-09-09 | 2005-01-26 | 東都化成株式会社 | リン含有エポキシ樹脂組成物 |
| JP4155422B2 (ja) * | 1998-03-24 | 2008-09-24 | 東都化成株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
| JP3811571B2 (ja) * | 1998-04-22 | 2006-08-23 | 東都化成株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
| JP3873248B2 (ja) * | 1998-11-13 | 2007-01-24 | 東都化成株式会社 | 合成樹脂用難燃剤及び難燃性樹脂組成物 |
| JP2000297138A (ja) * | 1999-02-10 | 2000-10-24 | Matsushita Electric Works Ltd | 難燃性樹脂組成物およびその難燃性樹脂組成物を用いた積層板 |
| JP3642403B2 (ja) * | 1999-02-23 | 2005-04-27 | 大日本インキ化学工業株式会社 | 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法 |
| JP3320670B2 (ja) * | 1999-03-10 | 2002-09-03 | 松下電工株式会社 | エポキシ樹脂組成物、その製造方法、および樹脂付き金属箔、ならびにそれを用いた多層プリント配線板 |
| JP2000336146A (ja) * | 1999-05-26 | 2000-12-05 | Takeda Chem Ind Ltd | 難燃性エポキシ樹脂組成物 |
| JP2001114867A (ja) * | 1999-10-15 | 2001-04-24 | Takeda Chem Ind Ltd | ノンハロゲン難燃性エポキシ樹脂組成物 |
| JP4224912B2 (ja) * | 1999-12-22 | 2009-02-18 | パナソニック電工株式会社 | リン含有エポキシ樹脂組成物、これを用いたプリプレグ、樹脂付き金属箔、接着シート、積層板及び多層板、塗工用樹脂ワニス及びこれを用いた多層板 |
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2000
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