JP4287882B2 - フレキシブル基板及び半導体装置 - Google Patents

フレキシブル基板及び半導体装置 Download PDF

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Publication number
JP4287882B2
JP4287882B2 JP2007011385A JP2007011385A JP4287882B2 JP 4287882 B2 JP4287882 B2 JP 4287882B2 JP 2007011385 A JP2007011385 A JP 2007011385A JP 2007011385 A JP2007011385 A JP 2007011385A JP 4287882 B2 JP4287882 B2 JP 4287882B2
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JP
Japan
Prior art keywords
semiconductor chip
wiring
flexible substrate
mounting region
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007011385A
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English (en)
Japanese (ja)
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JP2008177477A (ja
Inventor
克幸 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2007011385A priority Critical patent/JP4287882B2/ja
Priority to PCT/JP2007/073648 priority patent/WO2008090684A1/ja
Priority to TW101121964A priority patent/TWI420639B/zh
Priority to TW97100465A priority patent/TWI401779B/zh
Publication of JP2008177477A publication Critical patent/JP2008177477A/ja
Application granted granted Critical
Publication of JP4287882B2 publication Critical patent/JP4287882B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007011385A 2007-01-22 2007-01-22 フレキシブル基板及び半導体装置 Active JP4287882B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007011385A JP4287882B2 (ja) 2007-01-22 2007-01-22 フレキシブル基板及び半導体装置
PCT/JP2007/073648 WO2008090684A1 (ja) 2007-01-22 2007-12-07 フレキシブル基板及び半導体装置
TW101121964A TWI420639B (zh) 2007-01-22 2008-01-04 Semiconductor device
TW97100465A TWI401779B (zh) 2007-01-22 2008-01-04 Flexible substrate and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007011385A JP4287882B2 (ja) 2007-01-22 2007-01-22 フレキシブル基板及び半導体装置

Publications (2)

Publication Number Publication Date
JP2008177477A JP2008177477A (ja) 2008-07-31
JP4287882B2 true JP4287882B2 (ja) 2009-07-01

Family

ID=39644262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007011385A Active JP4287882B2 (ja) 2007-01-22 2007-01-22 フレキシブル基板及び半導体装置

Country Status (3)

Country Link
JP (1) JP4287882B2 (zh)
TW (2) TWI401779B (zh)
WO (1) WO2008090684A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5960633B2 (ja) * 2013-03-22 2016-08-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP6484983B2 (ja) * 2014-09-30 2019-03-20 日亜化学工業株式会社 発光装置およびその製造方法
TWI726441B (zh) * 2019-10-08 2021-05-01 南茂科技股份有限公司 可撓性線路基板及薄膜覆晶封裝結構
TWI712136B (zh) * 2020-02-26 2020-12-01 頎邦科技股份有限公司 覆晶接合結構及其線路基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2685040B2 (ja) * 1995-12-28 1997-12-03 日本電気株式会社 テープキャリアパッケージ
JP3613098B2 (ja) * 1998-12-21 2005-01-26 セイコーエプソン株式会社 回路基板ならびにそれを用いた表示装置および電子機器
JP2002164629A (ja) * 2000-09-13 2002-06-07 Seiko Epson Corp 配線基板、その製造方法、表示装置および電子機器
JP3983972B2 (ja) * 2000-11-29 2007-09-26 セイコーインスツル株式会社 電子回路モジュール
JP2002270649A (ja) * 2001-03-14 2002-09-20 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3814227B2 (ja) * 2002-05-31 2006-08-23 オプトレックス株式会社 チップオンフィルム基板
JP3685196B2 (ja) * 2003-09-24 2005-08-17 セイコーエプソン株式会社 配線基板、半導体装置及びその製造方法並びに電子機器

Also Published As

Publication number Publication date
TWI420639B (zh) 2013-12-21
JP2008177477A (ja) 2008-07-31
TW200843070A (en) 2008-11-01
TWI401779B (zh) 2013-07-11
TW201244040A (en) 2012-11-01
WO2008090684A1 (ja) 2008-07-31

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