WO2008090684A1 - フレキシブル基板及び半導体装置 - Google Patents
フレキシブル基板及び半導体装置 Download PDFInfo
- Publication number
- WO2008090684A1 WO2008090684A1 PCT/JP2007/073648 JP2007073648W WO2008090684A1 WO 2008090684 A1 WO2008090684 A1 WO 2008090684A1 JP 2007073648 W JP2007073648 W JP 2007073648W WO 2008090684 A1 WO2008090684 A1 WO 2008090684A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor chip
- flexible substrate
- chip mounting
- mounting region
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007011385A JP4287882B2 (ja) | 2007-01-22 | 2007-01-22 | フレキシブル基板及び半導体装置 |
JP2007-011385 | 2007-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008090684A1 true WO2008090684A1 (ja) | 2008-07-31 |
Family
ID=39644262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/073648 WO2008090684A1 (ja) | 2007-01-22 | 2007-12-07 | フレキシブル基板及び半導体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4287882B2 (zh) |
TW (2) | TWI401779B (zh) |
WO (1) | WO2008090684A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014187186A (ja) * | 2013-03-22 | 2014-10-02 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6484983B2 (ja) * | 2014-09-30 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
TWI726441B (zh) * | 2019-10-08 | 2021-05-01 | 南茂科技股份有限公司 | 可撓性線路基板及薄膜覆晶封裝結構 |
TWI712136B (zh) * | 2020-02-26 | 2020-12-01 | 頎邦科技股份有限公司 | 覆晶接合結構及其線路基板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186203A (ja) * | 1995-12-28 | 1997-07-15 | Nec Corp | テープキャリアパッケージ |
JP2000294896A (ja) * | 1998-12-21 | 2000-10-20 | Seiko Epson Corp | 回路基板ならびにそれを用いた表示装置および電子機器 |
JP2002270649A (ja) * | 2001-03-14 | 2002-09-20 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2004006462A (ja) * | 2002-05-31 | 2004-01-08 | Optrex Corp | チップオンフィルム基板 |
JP2005101167A (ja) * | 2003-09-24 | 2005-04-14 | Seiko Epson Corp | 配線基板、半導体装置及びその製造方法並びに電子機器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002164629A (ja) * | 2000-09-13 | 2002-06-07 | Seiko Epson Corp | 配線基板、その製造方法、表示装置および電子機器 |
JP3983972B2 (ja) * | 2000-11-29 | 2007-09-26 | セイコーインスツル株式会社 | 電子回路モジュール |
-
2007
- 2007-01-22 JP JP2007011385A patent/JP4287882B2/ja active Active
- 2007-12-07 WO PCT/JP2007/073648 patent/WO2008090684A1/ja active Application Filing
-
2008
- 2008-01-04 TW TW97100465A patent/TWI401779B/zh active
- 2008-01-04 TW TW101121964A patent/TWI420639B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186203A (ja) * | 1995-12-28 | 1997-07-15 | Nec Corp | テープキャリアパッケージ |
JP2000294896A (ja) * | 1998-12-21 | 2000-10-20 | Seiko Epson Corp | 回路基板ならびにそれを用いた表示装置および電子機器 |
JP2002270649A (ja) * | 2001-03-14 | 2002-09-20 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2004006462A (ja) * | 2002-05-31 | 2004-01-08 | Optrex Corp | チップオンフィルム基板 |
JP2005101167A (ja) * | 2003-09-24 | 2005-04-14 | Seiko Epson Corp | 配線基板、半導体装置及びその製造方法並びに電子機器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014187186A (ja) * | 2013-03-22 | 2014-10-02 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI420639B (zh) | 2013-12-21 |
JP2008177477A (ja) | 2008-07-31 |
TW200843070A (en) | 2008-11-01 |
TWI401779B (zh) | 2013-07-11 |
JP4287882B2 (ja) | 2009-07-01 |
TW201244040A (en) | 2012-11-01 |
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