WO2008090684A1 - Substrat flexible et dispositif semi-conducteur - Google Patents

Substrat flexible et dispositif semi-conducteur Download PDF

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Publication number
WO2008090684A1
WO2008090684A1 PCT/JP2007/073648 JP2007073648W WO2008090684A1 WO 2008090684 A1 WO2008090684 A1 WO 2008090684A1 JP 2007073648 W JP2007073648 W JP 2007073648W WO 2008090684 A1 WO2008090684 A1 WO 2008090684A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
flexible substrate
chip mounting
mounting region
semiconductor device
Prior art date
Application number
PCT/JP2007/073648
Other languages
English (en)
Japanese (ja)
Inventor
Katsuyuki Naitoh
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008090684A1 publication Critical patent/WO2008090684A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne un substrat flexible (101) qui comporte un matériau de base (100) ayant une région (103) de montage de puce semi-conductrice sur une surface ; une pluralité de fils conducteurs internes (106) formés sur la surface ; et un câblage de cavalier (111) connecté aux deux fils conducteurs internes (106). Une première section de câblage (121) du câblage de cavalier (111) traverse la région (103) de montage de puce semi-conductrice. Ainsi, les effets du déchargement de bulles d'air à l'extérieur de la région (103) de montage de puce semi-conductrice à partir de l'intérieur de la région (103) de montage de puce semi-conductrice sont améliorés.
PCT/JP2007/073648 2007-01-22 2007-12-07 Substrat flexible et dispositif semi-conducteur WO2008090684A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007011385A JP4287882B2 (ja) 2007-01-22 2007-01-22 フレキシブル基板及び半導体装置
JP2007-011385 2007-01-22

Publications (1)

Publication Number Publication Date
WO2008090684A1 true WO2008090684A1 (fr) 2008-07-31

Family

ID=39644262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073648 WO2008090684A1 (fr) 2007-01-22 2007-12-07 Substrat flexible et dispositif semi-conducteur

Country Status (3)

Country Link
JP (1) JP4287882B2 (fr)
TW (2) TWI401779B (fr)
WO (1) WO2008090684A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187186A (ja) * 2013-03-22 2014-10-02 Renesas Electronics Corp 半導体装置の製造方法および半導体装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6484983B2 (ja) * 2014-09-30 2019-03-20 日亜化学工業株式会社 発光装置およびその製造方法
TWI726441B (zh) * 2019-10-08 2021-05-01 南茂科技股份有限公司 可撓性線路基板及薄膜覆晶封裝結構
TWI712136B (zh) * 2020-02-26 2020-12-01 頎邦科技股份有限公司 覆晶接合結構及其線路基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186203A (ja) * 1995-12-28 1997-07-15 Nec Corp テープキャリアパッケージ
JP2000294896A (ja) * 1998-12-21 2000-10-20 Seiko Epson Corp 回路基板ならびにそれを用いた表示装置および電子機器
JP2002270649A (ja) * 2001-03-14 2002-09-20 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004006462A (ja) * 2002-05-31 2004-01-08 Optrex Corp チップオンフィルム基板
JP2005101167A (ja) * 2003-09-24 2005-04-14 Seiko Epson Corp 配線基板、半導体装置及びその製造方法並びに電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164629A (ja) * 2000-09-13 2002-06-07 Seiko Epson Corp 配線基板、その製造方法、表示装置および電子機器
JP3983972B2 (ja) * 2000-11-29 2007-09-26 セイコーインスツル株式会社 電子回路モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186203A (ja) * 1995-12-28 1997-07-15 Nec Corp テープキャリアパッケージ
JP2000294896A (ja) * 1998-12-21 2000-10-20 Seiko Epson Corp 回路基板ならびにそれを用いた表示装置および電子機器
JP2002270649A (ja) * 2001-03-14 2002-09-20 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004006462A (ja) * 2002-05-31 2004-01-08 Optrex Corp チップオンフィルム基板
JP2005101167A (ja) * 2003-09-24 2005-04-14 Seiko Epson Corp 配線基板、半導体装置及びその製造方法並びに電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187186A (ja) * 2013-03-22 2014-10-02 Renesas Electronics Corp 半導体装置の製造方法および半導体装置

Also Published As

Publication number Publication date
JP4287882B2 (ja) 2009-07-01
TWI401779B (zh) 2013-07-11
TW200843070A (en) 2008-11-01
TWI420639B (zh) 2013-12-21
JP2008177477A (ja) 2008-07-31
TW201244040A (en) 2012-11-01

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