JP4179866B2 - 半導体複合装置及びｌｅｄヘッド - Google Patents

半導体複合装置及びｌｅｄヘッド Download PDF

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Publication number
JP4179866B2
JP4179866B2 JP2002371724A JP2002371724A JP4179866B2 JP 4179866 B2 JP4179866 B2 JP 4179866B2 JP 2002371724 A JP2002371724 A JP 2002371724A JP 2002371724 A JP2002371724 A JP 2002371724A JP 4179866 B2 JP4179866 B2 JP 4179866B2
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semiconductor
led
layer
region
thin film
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JP2002371724A
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English (en)
Japanese (ja)
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JP2004207323A5 (https=
JP2004207323A (ja
Inventor
光彦 荻原
博之 藤原
昌明 佐久田
一松 安孫子
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株式会社沖データ
株式会社沖デジタルイメージング
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Priority to JP2002371724A priority Critical patent/JP4179866B2/ja
Priority to EP03029114A priority patent/EP1434271A3/en
Priority to US10/743,104 priority patent/US20040135157A1/en
Publication of JP2004207323A publication Critical patent/JP2004207323A/ja
Publication of JP2004207323A5 publication Critical patent/JP2004207323A5/ja
Application granted granted Critical
Publication of JP4179866B2 publication Critical patent/JP4179866B2/ja
Priority to US12/654,486 priority patent/US8664668B2/en
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2002371724A 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド Expired - Fee Related JP4179866B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002371724A JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド
EP03029114A EP1434271A3 (en) 2002-12-24 2003-12-17 Integrated semiconductor device comprising semiconductor thin films and optical print head
US10/743,104 US20040135157A1 (en) 2002-12-24 2003-12-23 Combined semiconductor apparatus with semiconductor thin film
US12/654,486 US8664668B2 (en) 2002-12-24 2009-12-22 Combined semiconductor apparatus with semiconductor thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002371724A JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド

Publications (3)

Publication Number Publication Date
JP2004207323A JP2004207323A (ja) 2004-07-22
JP2004207323A5 JP2004207323A5 (https=) 2005-07-28
JP4179866B2 true JP4179866B2 (ja) 2008-11-12

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Family Applications (1)

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JP2002371724A Expired - Fee Related JP4179866B2 (ja) 2002-12-24 2002-12-24 半導体複合装置及びｌｅｄヘッド

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Country Link
US (2) US20040135157A1 (https=)
EP (1) EP1434271A3 (https=)
JP (1) JP4179866B2 (https=)

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DE102004050371A1 (de) 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung
JP4837295B2 (ja) * 2005-03-02 2011-12-14 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
JP4636501B2 (ja) * 2005-05-12 2011-02-23 株式会社沖データ 半導体装置、プリントヘッド及び画像形成装置
JP5258167B2 (ja) * 2006-03-27 2013-08-07 株式会社沖データ 半導体複合装置、ｌｅｄヘッド、及び画像形成装置
JP4420932B2 (ja) * 2007-03-09 2010-02-24 株式会社沖データ 可撓性表示体及び可撓性表示体付き物品
JP5438889B2 (ja) * 2007-06-20 2014-03-12 株式会社沖データ 半導体装置、及びｌｅｄプリントヘッド
CA2739327A1 (en) * 2008-10-10 2010-04-15 Alta Devices, Inc. Mesa etch method and composition for epitaxial lift off
JP2011086928A (ja) 2009-09-17 2011-04-28 Sumitomo Chemical Co Ltd 化合物半導体結晶の製造方法、電子デバイスの製造方法、および半導体基板
US9040332B2 (en) * 2010-10-12 2015-05-26 Koninklijke Philips N.V. Highly reflective coating on LED submount
EP2500623A1 (en) * 2011-03-18 2012-09-19 Koninklijke Philips Electronics N.V. Method for providing a reflective coating to a substrate for a light-emitting device
JP5404709B2 (ja) * 2011-08-02 2014-02-05 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
KR20130066271A (ko) * 2011-12-12 2013-06-20 한국전자통신연구원 유기발광다이오드의 제조 방법
DE102012101409A1 (de) 2011-12-23 2013-06-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP2015126189A (ja) * 2013-12-27 2015-07-06 株式会社沖データ 半導体装置、半導体装置の製造方法、光プリントヘッド及び画像形成装置
JP6129777B2 (ja) 2014-03-31 2017-05-17 株式会社沖データ 半導体装置、半導体装置の製造方法、プリントヘッド、及び画像形成装置
US9576595B1 (en) 2014-11-19 2017-02-21 Seagate Technology Llc Transfer printing an epitaxial layer to a read/write head to form an integral laser
DE102015115812B4 (de) * 2015-09-18 2025-12-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement sowie Verfahren zur Herstellung eines Bauelements
CN109300932B (zh) * 2018-11-12 2024-01-23 严光能 Led显示器及其制作方法

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JPS62123787A (ja) 1985-11-22 1987-06-05 Nec Corp 半導体装置の製造方法
JPH0694216B2 (ja) * 1987-04-06 1994-11-24 沖電気工業株式会社 光プリントヘツド
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Also Published As

Publication number Publication date
EP1434271A3 (en) 2011-01-12
US20100096748A1 (en) 2010-04-22
US20040135157A1 (en) 2004-07-15
US8664668B2 (en) 2014-03-04
JP2004207323A (ja) 2004-07-22
EP1434271A2 (en) 2004-06-30

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