JP4059522B1 - 電気接続構造、それに用いる第１の接続部材 - Google Patents

電気接続構造、それに用いる第１の接続部材 Download PDF

Info

Publication number
JP4059522B1
JP4059522B1 JP2007513583A JP2007513583A JP4059522B1 JP 4059522 B1 JP4059522 B1 JP 4059522B1 JP 2007513583 A JP2007513583 A JP 2007513583A JP 2007513583 A JP2007513583 A JP 2007513583A JP 4059522 B1 JP4059522 B1 JP 4059522B1
Authority
JP
Japan
Prior art keywords
electrical connection
conductive
connection structure
connection member
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007513583A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2008050448A1 (ja
Inventor
昌範 溝口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Denka Kenkyusho Co Ltd
Original Assignee
Asahi Denka Kenkyusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kenkyusho Co Ltd filed Critical Asahi Denka Kenkyusho Co Ltd
Application granted granted Critical
Publication of JP4059522B1 publication Critical patent/JP4059522B1/ja
Publication of JPWO2008050448A1 publication Critical patent/JPWO2008050448A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/592—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connections to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/777—Coupling parts carrying pins, blades or analogous contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/778—Coupling parts carrying sockets, clips or analogous counter-contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2007513583A 2006-10-27 2006-10-27 電気接続構造、それに用いる第１の接続部材 Active JP4059522B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/321534 WO2008050448A1 (fr) 2006-10-27 2006-10-27 Structure de connexion électrique

Publications (2)

Publication Number Publication Date
JP4059522B1 true JP4059522B1 (ja) 2008-03-12
JPWO2008050448A1 JPWO2008050448A1 (ja) 2010-02-25

Family

ID=39243674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007513583A Active JP4059522B1 (ja) 2006-10-27 2006-10-27 電気接続構造、それに用いる第１の接続部材

Country Status (6)

Country Link
US (1) US7785113B2 (enExample)
EP (1) EP2117082B1 (enExample)
JP (1) JP4059522B1 (enExample)
CN (1) CN101273494B (enExample)
TW (1) TW200838384A (enExample)
WO (1) WO2008050448A1 (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139323A1 (ja) * 2008-05-15 2009-11-19 株式会社旭電化研究所 コネクタ構造
WO2010047141A1 (ja) * 2008-10-21 2010-04-29 株式会社旭電化研究所 メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
EP2345314A1 (de) * 2008-10-18 2011-07-20 Conti Temic Microelectronic GmbH Flexible leiterplatte
US8192207B2 (en) 2010-02-26 2012-06-05 Panasonic Corporation Female circuit board having non-circular conduction portions and conformal to insertion portions
WO2014002592A1 (ja) * 2012-06-29 2014-01-03 株式会社 村田製作所 ケーブルの配線基板への固定構造、ケーブル、またはケーブルの製造方法
JP2014017155A (ja) * 2012-07-10 2014-01-30 Panasonic Corp コネクタ装置
US8708712B2 (en) 2009-12-25 2014-04-29 Panasonic Corporation Male connector block, female connector block, and connector
JP2014519694A (ja) * 2011-06-16 2014-08-14 バリアン・メディカル・システムズ・インコーポレイテッド Ｘ線管用電子放出素子
US9466905B2 (en) 2012-10-29 2016-10-11 Asahi Denka Kenkyusho Co., Ltd. Connector structure, female connector, and male connector
US9478879B2 (en) 2012-07-10 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Connector assembly and female connector used for the same
JP2019193093A (ja) * 2018-04-24 2019-10-31 株式会社日立製作所 超音波送受信素子とこれを備える超音波検査装置、スマートフォン、およびタブレット
JP2020184694A (ja) * 2019-05-08 2020-11-12 株式会社日立製作所 超音波探触子及びそれを用いた超音波送受信装置
CN113411953A (zh) * 2021-06-17 2021-09-17 深圳佑驾创新科技有限公司 印制电路板及其封装结构

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5175489B2 (ja) * 2007-04-27 2013-04-03 新光電気工業株式会社 半導体パッケージの製造方法
US20110278048A1 (en) * 2009-01-27 2011-11-17 Kenshi Numakura Structure for connecting flexible circuit to target member
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
JP5702081B2 (ja) * 2010-06-10 2015-04-15 株式会社旭電化研究所 疑似同軸フラットケーブル及びプラグ構造体
JP5609451B2 (ja) * 2010-09-09 2014-10-22 富士通株式会社 コネクタ、光伝送装置およびコネクタ接続方法
JP5570395B2 (ja) * 2010-10-08 2014-08-13 モレックス インコーポレイテド シートコネクタ
US8569167B2 (en) 2011-03-29 2013-10-29 Micron Technology, Inc. Methods for forming a semiconductor structure
GB201119050D0 (en) 2011-11-04 2011-12-14 Rolls Royce Plc Electrical harness connector
GB201119045D0 (en) 2011-11-04 2011-12-14 Rolls Royce Plc Electrical harness
GB2498006B (en) * 2011-12-22 2014-07-09 Rolls Royce Plc Gas turbine engine systems
JP2013218237A (ja) 2012-04-12 2013-10-24 Japan Display Inc 液晶表示装置
JP5907503B2 (ja) * 2012-08-30 2016-04-26 アルプス電気株式会社 電子機器
JP2014063975A (ja) * 2012-08-31 2014-04-10 Nidec Copal Corp フレキシブルプリント配線板、及びそれを備えた機器
TWI460945B (zh) * 2012-09-07 2014-11-11 Chief Land Electronic Co Ltd 焊料件與焊接端子之掛設方法、其掛設結構及連接器
KR101722140B1 (ko) * 2012-09-21 2017-03-31 엘에스엠트론 주식회사 전기 커넥터 어셈블리, 이를 포함하는 기판 대 기판 커넥터 어셈블리 및 기판 대 케이블 커넥터 어셈블리
US20140104776A1 (en) * 2012-10-17 2014-04-17 James E. Clayton Rigid circuit board with flexibly attached module
US8834182B2 (en) * 2012-10-17 2014-09-16 Microelectronics Assembly Technologies Pierced flexible circuit and compression joint
CN103889148B (zh) * 2012-12-21 2017-03-15 上海天马微电子有限公司 一种柔性电路板及制作方法、显示模块
US9039448B2 (en) 2013-02-18 2015-05-26 Tyco Electronics Corporation Electronic interconnect devices having conductive vias
KR102038102B1 (ko) * 2013-03-07 2019-10-30 삼성디스플레이 주식회사 압착 품질 검사용 저항 측정 장치 및 이를 이용한 측정 방법
US9374898B2 (en) * 2013-04-24 2016-06-21 Apple Inc. Electrical and mechanical interconnection for electronic components
GB201308028D0 (en) 2013-05-03 2013-06-12 Rolls Royce Plc Electrical harness connector
GB201308029D0 (en) 2013-05-03 2013-06-12 Rolls Royce Plc Electrical harness connector
US9723725B2 (en) * 2013-05-29 2017-08-01 Finisar Corporation Rigid-flexible circuit interconnects
KR101488266B1 (ko) * 2013-08-06 2015-01-30 주식회사 유니드 착탈형 전기 접속 구조와 이를 구비한 전기 접속용 커넥터, 반도체 패키지 조립체 및 전자기기
US9105288B1 (en) 2014-03-11 2015-08-11 Magnecomp Corporation Formed electrical contact pad for use in a dual stage actuated suspension
DE102014103895A1 (de) * 2014-03-21 2015-09-24 Bender & Wirth Gmbh & Co. Verbinder
US9748723B2 (en) * 2014-12-12 2017-08-29 Peter Sussman Solder-less board-to-wire connector
JP6665979B2 (ja) * 2015-05-19 2020-03-13 日本電子材料株式会社 電気的接触子
US10008797B2 (en) 2015-07-10 2018-06-26 Te Connectivity Corporation Flexible printed circuit connector and connector assembly including the same
EP3890460A1 (en) * 2015-09-28 2021-10-06 Tactotek Oy Multilayer structure and related method of manufacture for electronics
JP6748517B2 (ja) * 2016-08-25 2020-09-02 日本航空電子工業株式会社 コネクタ組立体
DE102016223187B3 (de) * 2016-11-23 2018-03-22 Robert Bosch Gmbh Batterie umfassend eine erste Batteriezelle und eine zweite Batteriezelle und Verfahren zum elektrischen Kontaktieren einer ersten Batteriezelle mit einer zweiten Batteriezelle zum Zusammenbauen einer Batterie
DE102016223194B4 (de) * 2016-11-23 2018-07-26 Robert Bosch Gmbh Batteriezelle umfassend mindestens eine galvanische Zelle, Batterie und Verfahren zum Herstellen einer Batteriezelle
CN110050513B (zh) * 2016-12-01 2022-09-27 3M创新有限公司 将柔性部件层与联锁装置结合的电子装置
DE102016225973B4 (de) * 2016-12-22 2019-06-13 Conti Temic Microelectronic Gmbh Verfahren zum Kontaktieren einer Kontaktfläche auf einer flexiblen Leiterplatte mit einem Metallkontakt, Verbindung von flexibler Leiterplatte und Metallkontakt sowie Steuergerät
KR101944997B1 (ko) * 2017-01-06 2019-02-01 조인셋 주식회사 금속패드 인터페이스
EP3349549A1 (en) * 2017-01-11 2018-07-18 Itron Global SARL Solderless joint arrangement
JP6558514B2 (ja) * 2017-03-31 2019-08-14 株式会社村田製作所 電子機器
US10133133B1 (en) * 2017-06-28 2018-11-20 Advanced Optoelectronic Technology, Inc Liquid crystal display base
EP3435490B1 (en) * 2017-07-24 2019-11-20 Japan Aviation Electronics Industry, Ltd. Connection assisting member and circuit board assembly
CN109524822B (zh) * 2017-09-20 2024-09-17 泰科电子(上海)有限公司 导电端子和连接器
US10998160B2 (en) * 2018-08-21 2021-05-04 General Electric Company Cathode emitter to emitter attachment system and method
KR102659421B1 (ko) * 2018-11-20 2024-04-22 삼성디스플레이 주식회사 표시장치용 커넥터
KR102306042B1 (ko) * 2018-12-11 2021-09-27 주식회사 엘지에너지솔루션 배터리 모듈용 fpcb 조립체, 그 제조방법 및 그를 포함하는 배터리 모듈
JP7144332B2 (ja) * 2019-01-21 2022-09-29 日本航空電子工業株式会社 コネクタ、配線板組立体および接続構造
JP2021027177A (ja) * 2019-08-05 2021-02-22 日立オートモティブシステムズ株式会社 回路基板
US11121489B2 (en) * 2019-08-20 2021-09-14 Seagate Technology Llc Electrical connector with flexible circuit and stiffener
CN112449488A (zh) * 2019-09-05 2021-03-05 华为技术有限公司 电路板及电子设备
CN113038701A (zh) * 2019-12-24 2021-06-25 广州方邦电子股份有限公司 集成器件
FR3121988B1 (fr) 2021-04-19 2023-10-20 Tyco Electronics France Sas Dispositif de mesure de température destiné à mesurer la température d’une broche d’un connecteur électrique
US12224237B2 (en) 2021-05-24 2025-02-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing a via and a metal wiring for a semiconductor device
JP7720182B2 (ja) * 2021-07-12 2025-08-07 新電元工業株式会社 半導体装置
CN113677103A (zh) * 2021-08-24 2021-11-19 无锡胜脉电子有限公司 一种用于陶瓷封装压力传感器的焊接结构
CN118448346A (zh) * 2023-02-03 2024-08-06 联华电子股份有限公司 半导体线路图案以及其制作方法
JP7677705B1 (ja) * 2024-05-14 2025-05-15 Ｎｅｃプラットフォームズ株式会社 電子部品、コネクタユニット、コネクタ部材、電子部品の組立方法

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
US3214827A (en) * 1962-12-10 1965-11-02 Sperry Rand Corp Electrical circuitry fabrication
US3541223A (en) * 1966-09-23 1970-11-17 Texas Instruments Inc Interconnections between layers of a multilayer printed circuit board
US3541225A (en) * 1968-12-20 1970-11-17 Gen Electric Electrical conductor with improved solder characteristics
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US3859711A (en) * 1973-03-20 1975-01-14 Ibm Method of detecting misregistration of internal layers of a multilayer printed circuit panel
US4394712A (en) * 1981-03-18 1983-07-19 General Electric Company Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
US4720470A (en) * 1983-12-15 1988-01-19 Laserpath Corporation Method of making electrical circuitry
JPS63246837A (ja) * 1987-04-02 1988-10-13 Canon Inc 電気回路部材
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US4929185A (en) * 1989-04-03 1990-05-29 Nrc Corporation Printed circuit board assembly
US5030110A (en) * 1989-11-06 1991-07-09 Litton Systems, Inc. Case assembly for stacking integrated circuit packages
US5132879A (en) * 1990-10-01 1992-07-21 Hewlett-Packard Company Secondary board for mounting of components having differing bonding requirements
US5128831A (en) * 1991-10-31 1992-07-07 Micron Technology, Inc. High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
US5199879A (en) * 1992-02-24 1993-04-06 International Business Machines Corporation Electrical assembly with flexible circuit
US5617300A (en) * 1993-08-23 1997-04-01 Nagano Japan Radio Co., Ltd. Connecting method of printed substrate and apparatus
JP2867209B2 (ja) * 1993-08-27 1999-03-08 日東電工株式会社 フレキシブル回路基板と接触対象物との接続方法およびその構造
US5610371A (en) * 1994-03-15 1997-03-11 Fujitsu Limited Electrical connecting device and method for making same
CA2135241C (en) * 1993-12-17 1998-08-04 Mohi Sobhani Cavity and bump interconnection structure for electronic packages
US5456004A (en) * 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
US5414223A (en) * 1994-08-10 1995-05-09 Ast Research, Inc. Solder pad for printed circuit boards
US5896276A (en) * 1994-08-31 1999-04-20 Nec Corporation Electronic assembly package including connecting member between first and second substrates
US5938455A (en) * 1996-05-15 1999-08-17 Ford Motor Company Three-dimensional molded circuit board having interlocking connections
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
US6188028B1 (en) * 1997-06-09 2001-02-13 Tessera, Inc. Multilayer structure with interlocking protrusions
CA2213590C (en) * 1997-08-21 2006-11-07 Keith C. Carroll Flexible circuit connector and method of making same
US6086384A (en) * 1997-08-22 2000-07-11 Molex Incorporated Method of fabricating electronic device employing a flat flexible circuit and including the device itself
US5873740A (en) * 1998-01-07 1999-02-23 International Business Machines Corporation Electrical connector system with member having layers of different durometer elastomeric materials
US6030234A (en) * 1998-01-23 2000-02-29 Molex Incorporated Terminal pins mounted in flexible substrates
US5951305A (en) * 1998-07-09 1999-09-14 Tessera, Inc. Lidless socket and method of making same
EP0982978B1 (de) * 1998-08-25 2005-05-25 Kiekert Aktiengesellschaft Gehäuse, insbesondere Schlossgehäuse mit elektrischen Anschlusseinrichtungen
US6354000B1 (en) * 1999-05-12 2002-03-12 Microconnex Corp. Method of creating an electrical interconnect device bearing an array of electrical contact pads
US6524115B1 (en) * 1999-08-20 2003-02-25 3M Innovative Properties Company Compliant interconnect assembly
JP2001076787A (ja) * 1999-09-03 2001-03-23 Shin Etsu Polymer Co Ltd 電気コネクタ及びこれを用いた接続構造
US6490168B1 (en) * 1999-09-27 2002-12-03 Motorola, Inc. Interconnection of circuit substrates on different planes in electronic module
US6347042B1 (en) * 1999-10-26 2002-02-12 International Business Machines Corporation Printed circuit board top side mounting standoff
JP3694825B2 (ja) * 1999-11-18 2005-09-14 日本航空電子工業株式会社 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材
DE19957789A1 (de) * 1999-12-01 2001-06-21 Leoni Bordnetz Sys Gmbh & Co Kontaktierungssystem für zwei Leiterplatten
US6200146B1 (en) * 2000-02-23 2001-03-13 Itt Manufacturing Enterprises, Inc. Right angle connector
US6326698B1 (en) * 2000-06-08 2001-12-04 Micron Technology, Inc. Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices
US6456506B1 (en) * 2000-06-23 2002-09-24 Chiang Chun Lin Electronic retainer for preventing electromagnetic interference and capable of being absorbed mechanically
JP3897278B2 (ja) * 2001-04-05 2007-03-22 カシオマイクロニクス株式会社 フレキシブル配線基板の製造方法
KR100484168B1 (ko) * 2002-10-11 2005-04-19 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
US6921860B2 (en) * 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
US7088008B2 (en) * 2003-03-20 2006-08-08 International Business Machines Corporation Electronic package with optimized circuitization pattern
US6817870B1 (en) * 2003-06-12 2004-11-16 Nortel Networks Limited Technique for interconnecting multilayer circuit boards
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US6966784B2 (en) * 2003-12-19 2005-11-22 Palo Alto Research Center Incorporated Flexible cable interconnect assembly
US7119276B2 (en) * 2004-07-09 2006-10-10 Dell Products L.P. Method and apparatus for board mounting in a chassis
JP2006156943A (ja) * 2004-09-28 2006-06-15 Seiko Epson Corp 配線パターンの形成方法、配線パターンおよび電子機器
US7541826B2 (en) * 2005-05-13 2009-06-02 Kla-Tencor Corporation Compliant pad wafer chuck
JP2007087679A (ja) * 2005-09-21 2007-04-05 Alps Electric Co Ltd 接続部材
US7448923B2 (en) * 2006-09-14 2008-11-11 Harshad K Uka Connection for flex circuit and rigid circuit board

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139323A1 (ja) * 2008-05-15 2009-11-19 株式会社旭電化研究所 コネクタ構造
KR101166343B1 (ko) 2008-05-15 2012-07-18 가부시키가이샤 아사히 덴카 겐큐쇼 커넥터 구조, 이에 사용되는 암커넥터, 수커넥터, 플렉시블 회로 기판 , 리지드 회로 기판, 및 커넥터 구조를 내장한 전기ㆍ전자 기기
US8267700B2 (en) 2008-05-15 2012-09-18 Asahi Denka Kenkyusho Co., Ltd. Connector structure
EP2345314A1 (de) * 2008-10-18 2011-07-20 Conti Temic Microelectronic GmbH Flexible leiterplatte
JP5373809B2 (ja) * 2008-10-21 2013-12-18 株式会社旭電化研究所 メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
WO2010047141A1 (ja) * 2008-10-21 2010-04-29 株式会社旭電化研究所 メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
US8215965B2 (en) 2008-10-21 2012-07-10 Asahi Denka Kenkyusho Co., Ltd. Female connector, male connector assembled to the same, and electric/electronic apparatus using them
US8708712B2 (en) 2009-12-25 2014-04-29 Panasonic Corporation Male connector block, female connector block, and connector
US8192207B2 (en) 2010-02-26 2012-06-05 Panasonic Corporation Female circuit board having non-circular conduction portions and conformal to insertion portions
JP2014519694A (ja) * 2011-06-16 2014-08-14 バリアン・メディカル・システムズ・インコーポレイテッド Ｘ線管用電子放出素子
US9647312B2 (en) 2012-06-29 2017-05-09 Murata Manufacturing Co., Ltd. Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable
JPWO2014002592A1 (ja) * 2012-06-29 2016-05-30 株式会社村田製作所 ケーブルの配線基板への固定構造または固定方法
WO2014002592A1 (ja) * 2012-06-29 2014-01-03 株式会社 村田製作所 ケーブルの配線基板への固定構造、ケーブル、またはケーブルの製造方法
JP2014017155A (ja) * 2012-07-10 2014-01-30 Panasonic Corp コネクタ装置
US9077127B2 (en) 2012-07-10 2015-07-07 Panasonic Intellectual Property Management Co., Ltd. Connector assembly
US9478879B2 (en) 2012-07-10 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Connector assembly and female connector used for the same
US9466905B2 (en) 2012-10-29 2016-10-11 Asahi Denka Kenkyusho Co., Ltd. Connector structure, female connector, and male connector
JP2019193093A (ja) * 2018-04-24 2019-10-31 株式会社日立製作所 超音波送受信素子とこれを備える超音波検査装置、スマートフォン、およびタブレット
JP7079648B2 (ja) 2018-04-24 2022-06-02 富士フイルムヘルスケア株式会社 超音波探触子の製造方法、超音波探触子、超音波検査装置、スマートフォン、および、タブレット
JP2020184694A (ja) * 2019-05-08 2020-11-12 株式会社日立製作所 超音波探触子及びそれを用いた超音波送受信装置
JP7236320B2 (ja) 2019-05-08 2023-03-09 富士フイルムヘルスケア株式会社 超音波探触子及びそれを用いた超音波送受信装置
CN113411953A (zh) * 2021-06-17 2021-09-17 深圳佑驾创新科技有限公司 印制电路板及其封装结构
CN113411953B (zh) * 2021-06-17 2022-06-10 深圳佑驾创新科技有限公司 印制电路板及其封装结构

Also Published As

Publication number Publication date
CN101273494B (zh) 2012-02-22
TWI342175B (enExample) 2011-05-11
EP2117082A4 (en) 2012-05-16
US7785113B2 (en) 2010-08-31
WO2008050448A1 (fr) 2008-05-02
JPWO2008050448A1 (ja) 2010-02-25
EP2117082A1 (en) 2009-11-11
EP2117082B1 (en) 2016-05-18
TW200838384A (en) 2008-09-16
US20090233465A1 (en) 2009-09-17
CN101273494A (zh) 2008-09-24

Similar Documents

Publication Publication Date Title
JP4059522B1 (ja) 電気接続構造、それに用いる第１の接続部材
JP4584144B2 (ja) 回路基板装置及び配線基板間接続方法
JP5373809B2 (ja) メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
EP2913897B1 (en) Connector structure, female connector and male connector
WO2004098252A1 (ja) プリント配線板の接続構造
JP5274584B2 (ja) フレキシブル基板と相手側部材の接続構造
JP2007207618A (ja) 狭ピッチフレキシブル配線
JP2010277829A (ja) 接続端子付き基板
CN1327746C (zh) 电路基板装置及基板间的连接方法
JP2018064063A (ja) 回路基板及び回路装置
JP3640268B2 (ja) コネクタ及びコネクタ製造方法
KR100885121B1 (ko) 전기 접속구조
JPWO2012011193A1 (ja) フレキシブル基板と相手側部材の接続構造
JP2010114326A (ja) フレキシブルプリント配線板
JP4172433B2 (ja) 基板接続部材とそれを用いた三次元接続構造体並びに三次元接続構造体の製造方法
JP2010287606A (ja) フレキシブルプリント配線板およびフレキシブルプリント配線板一体型コネクタ構造
JP2008218185A (ja) 異方性導電部材およびこれを用いたデバイス接続構造
JP2006313759A (ja) スパイラル状接触子

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071217

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101228

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4059522

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101228

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121228

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131228

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250