JP4009828B2 - 窒化物蛍光体及びその製造方法 - Google Patents

窒化物蛍光体及びその製造方法 Download PDF

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Publication number
JP4009828B2
JP4009828B2 JP2002080879A JP2002080879A JP4009828B2 JP 4009828 B2 JP4009828 B2 JP 4009828B2 JP 2002080879 A JP2002080879 A JP 2002080879A JP 2002080879 A JP2002080879 A JP 2002080879A JP 4009828 B2 JP4009828 B2 JP 4009828B2
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JP
Japan
Prior art keywords
light
nitride
phosphor
nitride phosphor
emission spectrum
Prior art date
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Expired - Lifetime
Application number
JP2002080879A
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English (en)
Japanese (ja)
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JP2003277746A (ja
JP2003277746A5 (https=
Inventor
寛人 玉置
正敏 亀島
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Nichia Corp
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Nichia Corp
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Filing date
Publication date
Priority to JP2002080879A priority Critical patent/JP4009828B2/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to KR1020097013178A priority patent/KR100961322B1/ko
Priority to SG200600830-4A priority patent/SG155768A1/en
Priority to EP03710450.2A priority patent/EP1433831B1/en
Priority to SG2009037094A priority patent/SG185827A1/en
Priority to SG2009037052A priority patent/SG173925A1/en
Priority to CA2447288A priority patent/CA2447288C/en
Priority to US10/478,598 priority patent/US7258816B2/en
Priority to CNB038004542A priority patent/CN100430456C/zh
Priority to KR1020097013179A priority patent/KR100983193B1/ko
Priority to AU2003221442A priority patent/AU2003221442A1/en
Priority to PCT/JP2003/003418 priority patent/WO2003080764A1/ja
Priority to KR1020037015150A priority patent/KR100961324B1/ko
Priority to CNB200610005476XA priority patent/CN100509997C/zh
Priority to KR1020097013180A priority patent/KR100961342B1/ko
Priority to MYPI20030992 priority patent/MY148692A/en
Priority to TW092106347A priority patent/TWI258499B/zh
Publication of JP2003277746A publication Critical patent/JP2003277746A/ja
Publication of JP2003277746A5 publication Critical patent/JP2003277746A5/ja
Priority to US11/252,111 priority patent/US7297293B2/en
Priority to US11/905,725 priority patent/US7556744B2/en
Priority to US11/905,720 priority patent/US7597823B2/en
Application granted granted Critical
Publication of JP4009828B2 publication Critical patent/JP4009828B2/ja
Priority to US12/453,535 priority patent/US7964113B2/en
Priority to US12/453,534 priority patent/US8058793B2/en
Priority to US12/453,587 priority patent/US8076847B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2002080879A 2002-03-22 2002-03-22 窒化物蛍光体及びその製造方法 Expired - Lifetime JP4009828B2 (ja)

Priority Applications (23)

Application Number Priority Date Filing Date Title
JP2002080879A JP4009828B2 (ja) 2002-03-22 2002-03-22 窒化物蛍光体及びその製造方法
CNB200610005476XA CN100509997C (zh) 2002-03-22 2003-03-20 氮化物荧光体,其制造方法及发光装置
EP03710450.2A EP1433831B1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
SG2009037094A SG185827A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
CNB038004542A CN100430456C (zh) 2002-03-22 2003-03-20 氮化物荧光体,其制造方法及发光装置
CA2447288A CA2447288C (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
US10/478,598 US7258816B2 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
SG200600830-4A SG155768A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
KR1020097013179A KR100983193B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
AU2003221442A AU2003221442A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
PCT/JP2003/003418 WO2003080764A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and method for preparation thereof, and light emitting device
KR1020037015150A KR100961324B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
KR1020097013178A KR100961322B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
KR1020097013180A KR100961342B1 (ko) 2002-03-22 2003-03-20 질화물 형광체와 그 제조 방법 및 발광 장치
SG2009037052A SG173925A1 (en) 2002-03-22 2003-03-20 Nitride phosphor and production process thereof, and light emitting device
TW092106347A TWI258499B (en) 2002-03-22 2003-03-21 Nitride phosphor and method for preparation thereof, and light emitting device
MYPI20030992 MY148692A (en) 2002-03-22 2003-03-21 Nitride phosphor and production process thereof, and light emitting device
US11/252,111 US7297293B2 (en) 2002-03-22 2005-10-18 Nitride phosphor and production process thereof, and light emitting device
US11/905,725 US7556744B2 (en) 2002-03-22 2007-10-03 Nitride phosphor and production process thereof, and light emitting device
US11/905,720 US7597823B2 (en) 2002-03-22 2007-10-03 Nitride phosphor and production process thereof, and light emitting device
US12/453,535 US7964113B2 (en) 2002-03-22 2009-05-14 Nitride phosphor and production process thereof, and light emitting device
US12/453,534 US8058793B2 (en) 2002-03-22 2009-05-14 Nitride phosphor and production process thereof, and light emitting device
US12/453,587 US8076847B2 (en) 2002-03-22 2009-05-15 Nitride phosphor and production process thereof, and light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002080879A JP4009828B2 (ja) 2002-03-22 2002-03-22 窒化物蛍光体及びその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2004327264A Division JP4009869B2 (ja) 2004-11-11 2004-11-11 発光装置
JP2007090905A Division JP2007189254A (ja) 2007-03-30 2007-03-30 発光装置

Publications (3)

Publication Number Publication Date
JP2003277746A JP2003277746A (ja) 2003-10-02
JP2003277746A5 JP2003277746A5 (https=) 2005-07-14
JP4009828B2 true JP4009828B2 (ja) 2007-11-21

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Application Number Title Priority Date Filing Date
JP2002080879A Expired - Lifetime JP4009828B2 (ja) 2002-03-22 2002-03-22 窒化物蛍光体及びその製造方法

Country Status (2)

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JP (1) JP4009828B2 (https=)
CN (1) CN100509997C (https=)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
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JP4691955B2 (ja) * 2003-10-28 2011-06-01 日亜化学工業株式会社 蛍光物質および発光装置
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4568894B2 (ja) 2003-11-28 2010-10-27 Ｄｏｗａエレクトロニクス株式会社 複合導体および超電導機器システム
JP3931239B2 (ja) 2004-02-18 2007-06-13 独立行政法人物質・材料研究機構 発光素子及び照明器具
JP4511849B2 (ja) 2004-02-27 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体およびその製造方法、光源、並びにｌｅｄ
KR100833834B1 (ko) * 2004-03-24 2008-06-02 각코우호우징 메이조다이가쿠 형광체 및 발광 다이오드
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JP4491585B2 (ja) 2004-05-28 2010-06-30 Ｄｏｗａエレクトロニクス株式会社 金属ペーストの製造方法
JP4414821B2 (ja) 2004-06-25 2010-02-10 Ｄｏｗａエレクトロニクス株式会社 蛍光体並びに光源およびｌｅｄ
JP4511885B2 (ja) 2004-07-09 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体及びｌｅｄ並びに光源
JP4521227B2 (ja) * 2004-07-14 2010-08-11 株式会社東芝 窒素を含有する蛍光体の製造方法
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JP4543250B2 (ja) 2004-08-27 2010-09-15 Ｄｏｗａエレクトロニクス株式会社 蛍光体混合物および発光装置
CN102660260B (zh) 2004-09-22 2015-09-30 独立行政法人物质·材料研究机构 荧光体及其制造方法和发光器具
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JP6406109B2 (ja) * 2014-07-08 2018-10-17 日亜化学工業株式会社 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法
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JP6720944B2 (ja) * 2017-08-31 2020-07-08 日亜化学工業株式会社 窒化物蛍光体の製造方法、窒化物蛍光体及び発光装置
US11342311B2 (en) 2019-03-18 2022-05-24 Intematix Corporation LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material
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JP6741244B2 (ja) * 2019-07-11 2020-08-19 株式会社光波 発光装置
CN112048634B (zh) * 2020-09-11 2022-02-11 四川兰德高科技产业有限公司 一种铝合金用无氟无氯环保粒状精炼剂及其制备和应用
CN114806575A (zh) * 2022-05-23 2022-07-29 龙岩学院 一种高效铋离子激活的黄色荧光材料及其制备方法

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Publication number Publication date
CN1818012A (zh) 2006-08-16
JP2003277746A (ja) 2003-10-02
CN100509997C (zh) 2009-07-08

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