CN100509997C - 氮化物荧光体,其制造方法及发光装置 - Google Patents

氮化物荧光体,其制造方法及发光装置 Download PDF

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Publication number
CN100509997C
CN100509997C CNB200610005476XA CN200610005476A CN100509997C CN 100509997 C CN100509997 C CN 100509997C CN B200610005476X A CNB200610005476X A CN B200610005476XA CN 200610005476 A CN200610005476 A CN 200610005476A CN 100509997 C CN100509997 C CN 100509997C
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light
phosphor
nitride
emitting device
phosphors
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Expired - Fee Related
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Chinese (zh)
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CN1818012A (zh
Inventor
玉置宽人
龟岛正敏
高岛优
山田元量
内藤隆宏
阪井一彦
村崎嘉典
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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CNB200610005476XA 2002-03-22 2003-03-20 氮化物荧光体,其制造方法及发光装置 Expired - Fee Related CN100509997C (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP200280879 2002-03-22
JP2002080879A JP4009828B2 (ja) 2002-03-22 2002-03-22 窒化物蛍光体及びその製造方法
JP2002126566 2002-04-26
JP2002148555 2002-05-23
JP2002167166 2002-06-07
JP2002187647 2002-06-27
JP2002226855 2002-08-05
JP2002348386 2002-11-29
JP2002348387 2002-11-29
JP2002351634 2002-12-03

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CNB038004542A Division CN100430456C (zh) 2002-03-22 2003-03-20 氮化物荧光体,其制造方法及发光装置

Publications (2)

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CN1818012A CN1818012A (zh) 2006-08-16
CN100509997C true CN100509997C (zh) 2009-07-08

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CN (1) CN100509997C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725378A (zh) * 2010-01-29 2012-10-10 默克专利有限公司 发光物质

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* Cited by examiner, † Cited by third party
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JP4691955B2 (ja) * 2003-10-28 2011-06-01 日亜化学工業株式会社 蛍光物質および発光装置
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4568894B2 (ja) 2003-11-28 2010-10-27 Ｄｏｗａエレクトロニクス株式会社 複合導体および超電導機器システム
JP3931239B2 (ja) 2004-02-18 2007-06-13 独立行政法人物質・材料研究機構 発光素子及び照明器具
JP4511849B2 (ja) 2004-02-27 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体およびその製造方法、光源、並びにｌｅｄ
KR100833834B1 (ko) * 2004-03-24 2008-06-02 각코우호우징 메이조다이가쿠 형광체 및 발광 다이오드
WO2005103199A1 (en) 2004-04-27 2005-11-03 Matsushita Electric Industrial Co., Ltd. Phosphor composition and method for producing the same, and light-emitting device using the same
JP4524468B2 (ja) 2004-05-14 2010-08-18 Ｄｏｗａエレクトロニクス株式会社 蛍光体とその製造方法および当該蛍光体を用いた光源並びにｌｅｄ
JP4491585B2 (ja) 2004-05-28 2010-06-30 Ｄｏｗａエレクトロニクス株式会社 金属ペーストの製造方法
JP4414821B2 (ja) 2004-06-25 2010-02-10 Ｄｏｗａエレクトロニクス株式会社 蛍光体並びに光源およびｌｅｄ
JP4511885B2 (ja) 2004-07-09 2010-07-28 Ｄｏｗａエレクトロニクス株式会社 蛍光体及びｌｅｄ並びに光源
JP4521227B2 (ja) * 2004-07-14 2010-08-11 株式会社東芝 窒素を含有する蛍光体の製造方法
US7476337B2 (en) 2004-07-28 2009-01-13 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method for the same, and light source
US7138756B2 (en) 2004-08-02 2006-11-21 Dowa Mining Co., Ltd. Phosphor for electron beam excitation and color display device using the same
JP4933739B2 (ja) * 2004-08-02 2012-05-16 Ｄｏｗａホールディングス株式会社 電子線励起用の蛍光体および蛍光体膜、並びにそれらを用いたカラー表示装置
JP4524470B2 (ja) 2004-08-20 2010-08-18 Ｄｏｗａエレクトロニクス株式会社 蛍光体およびその製造方法、並びに当該蛍光体を用いた光源
US7476338B2 (en) 2004-08-27 2009-01-13 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method for the same, and light source
JP4543250B2 (ja) 2004-08-27 2010-09-15 Ｄｏｗａエレクトロニクス株式会社 蛍光体混合物および発光装置
CN102660260B (zh) 2004-09-22 2015-09-30 独立行政法人物质·材料研究机构 荧光体及其制造方法和发光器具
US7452483B2 (en) * 2004-09-30 2008-11-18 Global Tungsten & Powders Corp. Yellow-emitting phosphor blend for electroluminescent lamps
JP4543253B2 (ja) 2004-10-28 2010-09-15 Ｄｏｗａエレクトロニクス株式会社 蛍光体混合物および発光装置
US7671529B2 (en) * 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
JP4756261B2 (ja) 2005-01-27 2011-08-24 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
JP4892193B2 (ja) 2005-03-01 2012-03-07 Ｄｏｗａホールディングス株式会社 蛍光体混合物および発光装置
US7524437B2 (en) 2005-03-04 2009-04-28 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method of the same, and light emitting device using the phosphor
US7443094B2 (en) 2005-03-31 2008-10-28 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method of the same, and light emitting device using the phosphor
US7445730B2 (en) 2005-03-31 2008-11-04 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method of the same, and light emitting device using the phosphor
EP2781575A3 (en) * 2005-04-01 2015-02-18 Mitsubishi Chemical Corporation Alloy powder for inorganic funtional material precursor and phosphor
JP4975269B2 (ja) 2005-04-28 2012-07-11 Ｄｏｗａホールディングス株式会社 蛍光体およびその製造方法、並びに当該蛍光体を用いた発光装置
WO2006126567A1 (ja) 2005-05-24 2006-11-30 Mitsubishi Chemical Corporation 蛍光体及びその利用
JP5378644B2 (ja) 2006-09-29 2013-12-25 Ｄｏｗａホールディングス株式会社 窒化物蛍光体または酸窒化物蛍光体の製造方法
US7700967B2 (en) * 2007-05-25 2010-04-20 Philips Lumileds Lighting Company Llc Illumination device with a wavelength converting element held by a support structure having an aperture
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JP6406109B2 (ja) * 2014-07-08 2018-10-17 日亜化学工業株式会社 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法
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JP6720944B2 (ja) * 2017-08-31 2020-07-08 日亜化学工業株式会社 窒化物蛍光体の製造方法、窒化物蛍光体及び発光装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725378A (zh) * 2010-01-29 2012-10-10 默克专利有限公司 发光物质
CN102725378B (zh) * 2010-01-29 2016-01-13 默克专利有限公司 发光物质

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JP2003277746A (ja) 2003-10-02
JP4009828B2 (ja) 2007-11-21

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