JP3544895B2 - 樹脂封止型半導体装置及びその製造方法 - Google Patents

樹脂封止型半導体装置及びその製造方法 Download PDF

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JP3544895B2
JP3544895B2 JP21610899A JP21610899A JP3544895B2 JP 3544895 B2 JP3544895 B2 JP 3544895B2 JP 21610899 A JP21610899 A JP 21610899A JP 21610899 A JP21610899 A JP 21610899A JP 3544895 B2 JP3544895 B2 JP 3544895B2
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resin
substrate
sealed
cutting
semiconductor device
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JP21610899A
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JP2001044324A (ja
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浩司 宮田
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Sharp Corp
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Sharp Corp
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Priority to JP21610899A priority Critical patent/JP3544895B2/ja
Priority to US09/536,405 priority patent/US6538317B1/en
Priority to TW089105702A priority patent/TW454274B/zh
Priority to KR1020000028322A priority patent/KR100339473B1/ko
Publication of JP2001044324A publication Critical patent/JP2001044324A/ja
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP21610899A 1999-07-30 1999-07-30 樹脂封止型半導体装置及びその製造方法 Expired - Fee Related JP3544895B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP21610899A JP3544895B2 (ja) 1999-07-30 1999-07-30 樹脂封止型半導体装置及びその製造方法
US09/536,405 US6538317B1 (en) 1999-07-30 2000-03-28 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same
TW089105702A TW454274B (en) 1999-07-30 2000-03-28 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same
KR1020000028322A KR100339473B1 (ko) 1999-07-30 2000-05-25 수지 캡슐화된 반도체 장치용 기판, 수지 캡슐화된 반도체장치 및 이들의 제조방법

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Application Number Priority Date Filing Date Title
JP21610899A JP3544895B2 (ja) 1999-07-30 1999-07-30 樹脂封止型半導体装置及びその製造方法

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JP2001044324A JP2001044324A (ja) 2001-02-16
JP3544895B2 true JP3544895B2 (ja) 2004-07-21

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US (1) US6538317B1 (zh)
JP (1) JP3544895B2 (zh)
KR (1) KR100339473B1 (zh)
TW (1) TW454274B (zh)

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US6617680B2 (en) * 2001-08-22 2003-09-09 Siliconware Precision Industries Co., Ltd. Chip carrier, semiconductor package and fabricating method thereof
US20070045807A1 (en) * 2005-09-01 2007-03-01 Micron Technology, Inc. Microelectronic devices and methods for manufacturing microelectronic devices
CN101530011A (zh) * 2006-11-30 2009-09-09 株式会社德山 金属化陶瓷基板芯片的制造方法
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JP5543058B2 (ja) 2007-08-06 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 半導体装置の製造方法
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