JP3544464B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP3544464B2
JP3544464B2 JP32479497A JP32479497A JP3544464B2 JP 3544464 B2 JP3544464 B2 JP 3544464B2 JP 32479497 A JP32479497 A JP 32479497A JP 32479497 A JP32479497 A JP 32479497A JP 3544464 B2 JP3544464 B2 JP 3544464B2
Authority
JP
Japan
Prior art keywords
insulating film
wiring
opening
semiconductor device
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP32479497A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11162980A (ja
JPH11162980A5 (https=
Inventor
隆 上原
健裕 平井
弘明 中岡
彰弘 神田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18169763&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3544464(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP32479497A priority Critical patent/JP3544464B2/ja
Publication of JPH11162980A publication Critical patent/JPH11162980A/ja
Application granted granted Critical
Publication of JP3544464B2 publication Critical patent/JP3544464B2/ja
Publication of JPH11162980A5 publication Critical patent/JPH11162980A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP32479497A 1997-11-26 1997-11-26 半導体装置およびその製造方法 Expired - Fee Related JP3544464B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32479497A JP3544464B2 (ja) 1997-11-26 1997-11-26 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32479497A JP3544464B2 (ja) 1997-11-26 1997-11-26 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JPH11162980A JPH11162980A (ja) 1999-06-18
JP3544464B2 true JP3544464B2 (ja) 2004-07-21
JPH11162980A5 JPH11162980A5 (https=) 2004-10-14

Family

ID=18169763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32479497A Expired - Fee Related JP3544464B2 (ja) 1997-11-26 1997-11-26 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP3544464B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2364170B (en) * 1999-12-16 2002-06-12 Lucent Technologies Inc Dual damascene bond pad structure for lowering stress and allowing circuitry under pads and a process to form the same
JP3685722B2 (ja) 2001-02-28 2005-08-24 三洋電機株式会社 半導体装置及びその製造方法
JP2003218114A (ja) 2002-01-22 2003-07-31 Toshiba Corp 半導体装置及びその製造方法
JP2005243907A (ja) * 2004-02-26 2005-09-08 Renesas Technology Corp 半導体装置
JP4886396B2 (ja) * 2006-07-03 2012-02-29 キヤノン株式会社 反射型液晶表示パネルに用いられる半導体基板の製造方法
US20110156260A1 (en) * 2009-12-28 2011-06-30 Yu-Hua Huang Pad structure and integrated circuit chip with such pad structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03227539A (ja) * 1990-02-01 1991-10-08 Matsushita Electron Corp 半導体装置
JP2972484B2 (ja) * 1993-05-10 1999-11-08 日本電気株式会社 半導体装置の製造方法
JPH06326150A (ja) * 1993-05-12 1994-11-25 Sony Corp パッド構造
JP2560625B2 (ja) * 1993-10-29 1996-12-04 日本電気株式会社 半導体装置およびその製造方法
JPH07201909A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 半導体装置
JP3396790B2 (ja) * 1994-08-02 2003-04-14 富士通株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH11162980A (ja) 1999-06-18

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