JP3492350B2 - 回路基板および回路基板の製造方法 - Google Patents

回路基板および回路基板の製造方法

Info

Publication number
JP3492350B2
JP3492350B2 JP2002110320A JP2002110320A JP3492350B2 JP 3492350 B2 JP3492350 B2 JP 3492350B2 JP 2002110320 A JP2002110320 A JP 2002110320A JP 2002110320 A JP2002110320 A JP 2002110320A JP 3492350 B2 JP3492350 B2 JP 3492350B2
Authority
JP
Japan
Prior art keywords
circuit board
insulating base
alignment mark
wiring pattern
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002110320A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003304041A (ja
Inventor
克義 小林
Original Assignee
新藤電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新藤電子工業株式会社 filed Critical 新藤電子工業株式会社
Priority to JP2002110320A priority Critical patent/JP3492350B2/ja
Priority to KR1020047012733A priority patent/KR100594837B1/ko
Priority to PCT/JP2003/003964 priority patent/WO2003088724A1/ja
Priority to CNB03808189XA priority patent/CN1309281C/zh
Priority to TW092107653A priority patent/TW591987B/zh
Publication of JP2003304041A publication Critical patent/JP2003304041A/ja
Application granted granted Critical
Publication of JP3492350B2 publication Critical patent/JP3492350B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2002110320A 2002-04-12 2002-04-12 回路基板および回路基板の製造方法 Expired - Fee Related JP3492350B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002110320A JP3492350B2 (ja) 2002-04-12 2002-04-12 回路基板および回路基板の製造方法
KR1020047012733A KR100594837B1 (ko) 2002-04-12 2003-03-28 회로기판 및 회로기판의 제조 방법
PCT/JP2003/003964 WO2003088724A1 (en) 2002-04-12 2003-03-28 Circuit board and method for manufacturing the same
CNB03808189XA CN1309281C (zh) 2002-04-12 2003-03-28 电路基板及电路基板的制造方法
TW092107653A TW591987B (en) 2002-04-12 2003-04-03 Circuit substrate and manufacturing method of circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002110320A JP3492350B2 (ja) 2002-04-12 2002-04-12 回路基板および回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2003304041A JP2003304041A (ja) 2003-10-24
JP3492350B2 true JP3492350B2 (ja) 2004-02-03

Family

ID=29243227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002110320A Expired - Fee Related JP3492350B2 (ja) 2002-04-12 2002-04-12 回路基板および回路基板の製造方法

Country Status (5)

Country Link
JP (1) JP3492350B2 (zh)
KR (1) KR100594837B1 (zh)
CN (1) CN1309281C (zh)
TW (1) TW591987B (zh)
WO (1) WO2003088724A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340641A (ja) * 2004-05-28 2005-12-08 Nippon Mektron Ltd 可撓性回路基板
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置
CN100461984C (zh) * 2005-09-30 2009-02-11 友达光电股份有限公司 电路组装结构
KR101255508B1 (ko) 2006-06-30 2013-04-16 엘지디스플레이 주식회사 플렉서블 디스플레이 및 이의 얼라인 키의 제조 방법
JP5425363B2 (ja) * 2006-11-28 2014-02-26 ルネサスエレクトロニクス株式会社 半導体装置、及び表示装置
JP4431170B2 (ja) * 2006-12-04 2010-03-10 日本特殊陶業株式会社 積層基板及びその製造方法
CN101378628B (zh) * 2007-08-27 2010-06-02 燿华电子股份有限公司 适用于各种印刷电路板的局部性外加贴覆材的贴覆方法
CN101809402B (zh) * 2007-09-28 2012-04-04 松下电器产业株式会社 检查装置以及检查方法
TWI381780B (zh) * 2010-04-28 2013-01-01 Wus Printed Circuit Co Ltd 可辨識印刷電路板之製造方法
JP5933180B2 (ja) * 2011-01-11 2016-06-08 矢崎総業株式会社 基板とマスクの位置合わせ構造
CN102118918A (zh) * 2011-04-12 2011-07-06 中国计量学院 一种可弯折柔性透明电子电路及其制备方法
JP6338348B2 (ja) * 2012-12-26 2018-06-06 キヤノン株式会社 フレキシブルプリント基板及び電子機器
KR101802046B1 (ko) * 2013-02-28 2017-11-27 토카이 신에이 일렉트로닉스 인더스트리 가부시키가이샤 기판의 제조 방법과, 기판과, 마스크 필름
JP6463375B2 (ja) * 2014-04-16 2019-01-30 アボット・ラボラトリーズＡｂｂｏｔｔ Ｌａｂｏｒａｔｏｒｉｅｓ 液滴アクチュエータ製造装置、システム、および関連方法
JP6342698B2 (ja) * 2014-04-25 2018-06-13 新光電気工業株式会社 配線基板、及び配線基板の製造方法
TWI477216B (zh) 2014-06-09 2015-03-11 Chipbond Technology Corp 可撓式基板
CN110935496A (zh) 2014-12-31 2020-03-31 雅培制药有限公司 数字微流控稀释设备、系统及相关方法
CN105764278B (zh) * 2016-02-29 2020-04-03 上海天马微电子有限公司 电子设备及其对位方法
KR102637015B1 (ko) * 2016-06-08 2024-02-16 삼성디스플레이 주식회사 표시 장치 및 그것의 제조 방법
JP6384647B1 (ja) 2017-02-23 2018-09-05 株式会社村田製作所 電子部品、電子機器および電子部品の実装方法
CN108112177B (zh) * 2017-05-19 2020-02-14 大连大学 一种柔性透明电路的制备方法
JP7271081B2 (ja) 2017-10-18 2023-05-11 日東電工株式会社 配線回路基板
CN110797323A (zh) * 2019-11-08 2020-02-14 江苏上达电子有限公司 一种cof卷带及其制造方法
TWI710287B (zh) * 2019-12-19 2020-11-11 頎邦科技股份有限公司 具有待移除的穿孔預定區的電路板及其被移除的板體
TWI796550B (zh) * 2020-02-26 2023-03-21 頎邦科技股份有限公司 撓性電路板
TWI715492B (zh) 2020-05-08 2021-01-01 頎邦科技股份有限公司 線路板
KR20210156005A (ko) * 2020-06-17 2021-12-24 주식회사 엘지에너지솔루션 연성인쇄회로기판의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175623A (ja) * 1974-12-26 1976-06-30 Kurosaki Refractories Co Suraideingunozurusochi
JPH0249488A (ja) * 1988-08-11 1990-02-19 Hitachi Condenser Co Ltd 印刷配線板及びその製造方法
JPH05175623A (ja) * 1991-12-19 1993-07-13 Tanaka Kikinzoku Kogyo Kk プリント配線板
JPH10163588A (ja) * 1996-12-03 1998-06-19 Sumitomo Kinzoku Erekutorodebaisu:Kk 回路基板
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same

Also Published As

Publication number Publication date
CN1309281C (zh) 2007-04-04
JP2003304041A (ja) 2003-10-24
KR100594837B1 (ko) 2006-06-30
CN1647596A (zh) 2005-07-27
KR20040086388A (ko) 2004-10-08
WO2003088724A1 (en) 2003-10-23
TW200306769A (en) 2003-11-16
TW591987B (en) 2004-06-11

Similar Documents

Publication Publication Date Title
JP3492350B2 (ja) 回路基板および回路基板の製造方法
US7208349B2 (en) Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
KR100614864B1 (ko) 프린트 배선판 및 반도체 장치
JP3666955B2 (ja) 可撓性回路基板の製造法
KR100772625B1 (ko) 솔더 레지스트 코팅용 스크린 마스크
US20060008970A1 (en) Optimized plating process for multilayer printed circuit boards having edge connectors
KR20060048212A (ko) 전해 도금을 이용한 배선 기판의 제조 방법
CN112042283B (zh) 印刷电路板和印刷电路板条带
KR20010051541A (ko) 범프 부착 배선회로기판의 제조방법 및 범프 형성방법
KR100393271B1 (ko) 다층 전자부품탑재용 기판의 제조 방법
CN111326640B (zh) 在发光二极管载板形成开窗的方法
TWI700021B (zh) 同時具有貫孔及盲孔的多層電路板的製法
JP4110391B2 (ja) 配線基板及びその製造方法、半導体装置及び電子モジュール並びに電子機器
JP2002324962A (ja) インダクタ内蔵のプリント配線板及びその製造方法
KR101067214B1 (ko) 인쇄회로기판 및 그 제조방법
CN110972413A (zh) 复合电路板及其制作方法
CN209861268U (zh) 同时具有贯孔及盲孔的多层电路板结构
KR101194552B1 (ko) 인쇄회로기판 및 그 제조방법
JPH08204312A (ja) チップオンボード基板の製造方法
JPH1093213A (ja) 回路基板、回路装置および装置
KR100771308B1 (ko) 리지드-플렉서블 인쇄회로기판의 제조방법
JPH08255870A (ja) 電子部品実装板及びその製造方法
JPH11145607A (ja) 印刷回路基板におけるはんだ絶縁膜の形成方法及びこの方法によって製造された印刷回路基板
KR20030075824A (ko) 테일리스 패턴을 갖는 반도체 패키지용 인쇄회로기판의제조방법
KR20020095497A (ko) 비아 홀 랜드 위에 형성된 접속 패드를 갖는인쇄회로기판과 그 제조 방법

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20031028

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081114

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081114

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091114

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091114

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101114

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111114

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121114

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees