JP6463375B2 - 液滴アクチュエータ製造装置、システム、および関連方法 - Google Patents
液滴アクチュエータ製造装置、システム、および関連方法 Download PDFInfo
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
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- G01N27/44704—Details; Accessories
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01L2400/0427—Electrowetting
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- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
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Description
Claims (18)
- 装置であって、
非導電性層と、
非導電性層に接着された導電性層と、
導電性層内に配置された電極パターンとを備え、非導電性層の少なくとも部分が、電極パターンの特徴部または電極パターンに近接した擾乱部を備え、前記装置がさらに、
電極パターンの電極の実質的に全体を覆って配置された、疎水性または誘電性材料のうちの少なくとも一方を備える、装置。 - 特徴部が、電極パターンの少なくとも部分の輪郭である、請求項1に記載の装置。
- 電極パターンがラインを備え、特徴部が、電極パターン内のラインの位置に少なくとも部分的に対応する、請求項2に記載の装置。
- 擾乱部が、厚さの変化、凹部、または非導電性層の部分の表面内の凸部のうちの少なくとも1つである、請求項1に記載の装置。
- 電極パターン上に配置された防汚層をさらに備える、請求項1に記載の装置。
- 電極パターンが、第1の電極パターンおよび第2の電極パターンを含み、第2の電極パターンが第1の電極パターンから離隔されており、第1の電極パターンが第1のマーキングを備え、第2の電極パターンが第2のマーキングを備え、第1のマーキングが第2のマーキングと実質的に同一である、請求項1に記載の装置。
- 第1のマーキングおよび第2のマーキングが、第1のマーキングおよび第2のマーキングの、それぞれ第1の電極パターンおよび第2の電極パターン上での大きさまたは位置のうちの少なくとも一方に基づいて、実質的に同一である、請求項6に記載の装置。
- 電極パターンが複数のラインおよびギャップを備え、ラインが約10マイクロメートルの幅を有する、請求項1に記載の装置。
- 導電性層の厚さが約120ナノメートル未満である、請求項1に記載の装置。
- 非導電性層がその中に溝を画定し、溝が、第1の電極パターンに基づいている、請求項6に記載の装置。
- 非導電性層が、第1の電極パターンに基づいて凸部を画定する、請求項6に記載の装置。
- 導電性層を非導電性層にカップリングするために導電性層と非導電性層との間に配置された接着剤層をさらに備える、請求項1に記載の装置。
- 電極パターンがラインおよびスペーシングを備え、スペーシングと境をなすラインのエッジが実質的に平滑である、請求項6に記載の装置。
- 第1のマーキングが、第1の電極パターンを画定するラインの中断部である、請求項6に記載の装置。
- 非導電性層および導電性層が、第1の基板を形成し、第1の基板と位置合わせされた第2の基板をさらに備え、位置合わせには、第1の基板と第2の基板との間のギャップが含まれる、請求項1に記載の装置。
- ギャップ内に配置された1つまたは複数の凸部をさらに備える、請求項15に記載の装置。
- 凸部が毛細管である、請求項16に記載の装置。
- 電極パターンが、10ミクロンメートル未満の幅を有する第1のスペーシングおよび10ミクロンメートル未満の幅を有する第2のスペーシングを含む、請求項1に記載の装置。
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