JP3211820U7 - - Google Patents
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- Publication number
- JP3211820U7 JP3211820U7 JP2017002368U JP2017002368U JP3211820U7 JP 3211820 U7 JP3211820 U7 JP 3211820U7 JP 2017002368 U JP2017002368 U JP 2017002368U JP 2017002368 U JP2017002368 U JP 2017002368U JP 3211820 U7 JP3211820 U7 JP 3211820U7
- Authority
- JP
- Japan
- Prior art keywords
- layer
- contact
- copper
- gold
- metal alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims 93
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 19
- 229910052802 copper Inorganic materials 0.000 claims 19
- 239000010949 copper Substances 0.000 claims 19
- 229910045601 alloy Inorganic materials 0.000 claims 18
- 239000000956 alloy Substances 0.000 claims 18
- 230000004888 barrier function Effects 0.000 claims 18
- 229910000510 noble metal Inorganic materials 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 14
- 239000000463 material Substances 0.000 claims 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 11
- 229910052737 gold Inorganic materials 0.000 claims 11
- 239000010931 gold Substances 0.000 claims 11
- 229910052763 palladium Inorganic materials 0.000 claims 11
- 238000007747 plating Methods 0.000 claims 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 10
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 6
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 6
- 238000000576 coating method Methods 0.000 claims 6
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 claims 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 6
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 claims 6
- 229910052707 ruthenium Inorganic materials 0.000 claims 6
- 229910001080 W alloy Inorganic materials 0.000 claims 5
- 229910052759 nickel Inorganic materials 0.000 claims 5
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims 5
- 229910052709 silver Inorganic materials 0.000 claims 5
- 239000004332 silver Substances 0.000 claims 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- PQJKKINZCUWVKL-UHFFFAOYSA-N [Ni].[Cu].[Ag] Chemical compound [Ni].[Cu].[Ag] PQJKKINZCUWVKL-UHFFFAOYSA-N 0.000 claims 1
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- 229910000923 precious metal alloy Inorganic materials 0.000 claims 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662310445P | 2016-03-18 | 2016-03-18 | |
| US62/310,445 | 2016-03-18 | ||
| US201662383381P | 2016-09-02 | 2016-09-02 | |
| US62/383,381 | 2016-09-02 | ||
| US201662384120P | 2016-09-06 | 2016-09-06 | |
| US62/384,120 | 2016-09-06 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017054331 Continuation | 2017-03-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP3211820U JP3211820U (ja) | 2017-08-03 |
| JP3211820U7 true JP3211820U7 (enExample) | 2018-02-08 |
Family
ID=59409883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017002368U Expired - Fee Related JP3211820U (ja) | 2016-03-18 | 2017-05-26 | 貴金属合金接点 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10411379B2 (enExample) |
| JP (1) | JP3211820U (enExample) |
| KR (1) | KR200489473Y1 (enExample) |
| CN (1) | CN207638036U (enExample) |
| DE (1) | DE202017001425U1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202017001425U1 (de) | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
| US10998657B2 (en) | 2016-03-18 | 2021-05-04 | Apple Inc. | Precious-metal-alloy contacts |
| WO2017195595A1 (ja) * | 2016-05-12 | 2017-11-16 | 住友電装株式会社 | 端子金具 |
| JP2018120698A (ja) * | 2017-01-24 | 2018-08-02 | 矢崎総業株式会社 | 端子用めっき材並びにそれを用いた端子、端子付き電線及びワイヤーハーネス |
| CN107630149A (zh) * | 2017-08-30 | 2018-01-26 | 惠州市好得高精密五金有限公司 | 一种硬质千足金表壳及其制配方法 |
| EP4060821B1 (en) * | 2017-09-20 | 2023-11-22 | Huawei Technologies Co., Ltd. | Electrical connector and mobile terminal |
| US20190103693A1 (en) * | 2017-09-29 | 2019-04-04 | Apple Inc. | Electrical contacts having sacrificial layer for corrosion protection |
| CN109659750B (zh) | 2017-10-12 | 2021-09-17 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其制造方法 |
| CN109787007A (zh) | 2017-11-15 | 2019-05-21 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其导电端子 |
| FR3074193B1 (fr) * | 2017-11-28 | 2020-07-10 | Linxens Holding | Circuit electrique, module electronique pour carte a puce realise sur ce circuit electrique et procede pour la realisation d’un tel circuit electrique. |
| CN109904705B (zh) * | 2017-12-07 | 2021-10-08 | 泰科电子(上海)有限公司 | 导电端子坯料条的制造方法和导电端子的制造方法 |
| US11674235B2 (en) * | 2018-04-11 | 2023-06-13 | Hutchinson Technology Incorporated | Plating method to reduce or eliminate voids in solder applied without flux |
| US11201426B2 (en) * | 2018-08-13 | 2021-12-14 | Apple Inc. | Electrical contact appearance and protection |
| CN110350339B (zh) * | 2018-08-29 | 2022-04-22 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其制造方法和电连接器 |
| DE102018009544A1 (de) * | 2018-11-29 | 2020-06-04 | Serafettin Kesim | Taster Hubdruckvorrichtung für Elektro- und Automaten Anlagen |
| KR102148316B1 (ko) | 2018-12-11 | 2020-08-26 | 히로세코리아 주식회사 | 전기적 접촉 단자 |
| DE102019104644B3 (de) | 2019-02-25 | 2020-07-09 | Carl Zeiss Industrielle Messtechnik Gmbh | Taststiftwechselhalterung und Taststift |
| JP2020187971A (ja) * | 2019-05-16 | 2020-11-19 | 株式会社オートネットワーク技術研究所 | コネクタ端子、端子付き電線、及び端子対 |
| CN110416782A (zh) * | 2019-08-27 | 2019-11-05 | 问问智能信息科技有限公司 | 一种充电触点组合结构及其制备方法 |
| CN110504574A (zh) * | 2019-08-27 | 2019-11-26 | 问问智能信息科技有限公司 | 一种充电触点结构及其制备方法 |
| WO2021036137A1 (zh) * | 2019-08-23 | 2021-03-04 | 问问智能信息科技有限公司 | 触点、触点结构、电子设备和充电设备 |
| CN112467431B (zh) * | 2019-09-09 | 2022-04-19 | 苹果公司 | 贵金属合金触点 |
| WO2021188674A1 (en) * | 2020-03-18 | 2021-09-23 | Xtalic Corporation | Nanostructured palladium-based alloys and related methods |
| CN111961906B (zh) * | 2020-07-29 | 2021-11-05 | 济南大学 | 一种高强高韧耐蚀镍基复合材料的制备方法及所得产品 |
| KR20220046883A (ko) * | 2020-10-08 | 2022-04-15 | 삼성전자주식회사 | 호스트 커넥터와 메모리 장치를 포함하는 전자 장치 |
| CN112725653A (zh) * | 2020-12-21 | 2021-04-30 | 有研亿金新材料有限公司 | 一种新型高塑性金基电刷材料及其制备方法 |
| US11764505B2 (en) * | 2021-07-21 | 2023-09-19 | Dell Products L.P. | Add-in card connector contact optimization for high-speed signaling |
| AU2022375737A1 (en) | 2021-10-26 | 2024-03-21 | Halliburton Energy Services, Inc. | Auto-insulating concentric wet-mate electrical connector for downhole applications |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810998B2 (ja) * | 1975-06-30 | 1983-02-28 | 松下電工株式会社 | 電気接点およびその電気接点の製造方法 |
| JPS56112022A (en) * | 1980-02-08 | 1981-09-04 | Fujitsu Ltd | Electric slide contactor |
| JPS60127673A (ja) * | 1983-12-12 | 1985-07-08 | 田中貴金属工業株式会社 | コネクタ材料の製造方法 |
| US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| JPS62219479A (ja) * | 1986-03-20 | 1987-09-26 | 日立電線株式会社 | 金めつき接点材 |
| US4747783A (en) | 1986-10-28 | 1988-05-31 | International Business Machines Corporation | Resistive pin for printed circuit card connector |
| JPH0590834U (ja) * | 1992-05-22 | 1993-12-10 | 日本航空電子工業株式会社 | コンタクト |
| JP3211820B2 (ja) | 1998-12-04 | 2001-09-25 | 株式会社デンソー | 内燃機関用スパークプラグ |
| US6335107B1 (en) | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| JP4054208B2 (ja) * | 2002-04-01 | 2008-02-27 | 富士通株式会社 | コンタクタの製造方法 |
| US6666713B1 (en) * | 2002-07-19 | 2003-12-23 | Ronald D. Norvelle | Ganged receptacle fixture apparatus |
| DE10245343A1 (de) | 2002-09-27 | 2004-04-08 | Robert Bosch Gmbh | Elektrischer Kontakt |
| US7030325B2 (en) * | 2002-12-16 | 2006-04-18 | Trw Automotive U.S. Llc | Electrical switch assembly |
| JP2006108057A (ja) * | 2004-10-08 | 2006-04-20 | Matsushita Electric Works Ltd | コネクタ接続端子 |
| JP5128153B2 (ja) | 2006-03-17 | 2013-01-23 | 古河電気工業株式会社 | 電気接点材料及びその製造方法 |
| JP2009259595A (ja) | 2008-04-16 | 2009-11-05 | Hitachi Cable Ltd | 電気接点層付金属材およびその製造方法 |
| US9694562B2 (en) * | 2010-03-12 | 2017-07-04 | Xtalic Corporation | Coated articles and methods |
| CN102485959A (zh) | 2010-12-01 | 2012-06-06 | 鸿富锦精密工业(深圳)有限公司 | 金属多孔材料的制备方法及由该方法制得的金属多孔材料 |
| DE102011006899B4 (de) | 2011-04-06 | 2025-01-30 | Te Connectivity Germany Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung |
| US8637165B2 (en) * | 2011-09-30 | 2014-01-28 | Apple Inc. | Connector with multi-layer Ni underplated contacts |
| JP2013080623A (ja) * | 2011-10-04 | 2013-05-02 | Jst Mfg Co Ltd | コンタクトおよび電気コネクタ |
| JP5851186B2 (ja) * | 2011-10-04 | 2016-02-03 | 日本圧着端子製造株式会社 | コンタクトおよび電気コネクタ |
| JP5138827B1 (ja) | 2012-03-23 | 2013-02-06 | Jx日鉱日石金属株式会社 | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 |
| JP5427945B2 (ja) | 2012-06-27 | 2014-02-26 | Jx日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
| US8905793B2 (en) * | 2012-09-07 | 2014-12-09 | Apple Inc. | Contacts for an electrical connector |
| US8747155B2 (en) * | 2012-09-07 | 2014-06-10 | Apple Inc. | Underfill applicator device and methods for assembling electrical contacts |
| KR20160018600A (ko) | 2013-06-10 | 2016-02-17 | 오리엔타루토킨 가부시키가이샤 | 도금 적층체의 제조방법 및 도금 적층체 |
| JP6182757B2 (ja) * | 2013-09-02 | 2017-08-23 | オリエンタル鍍金株式会社 | めっき材の製造方法及びめっき材 |
| CA2924778A1 (en) | 2013-09-20 | 2015-03-26 | Toyo Kohan Co., Ltd. | Metal plate coated stainless material and method of producing metal plate coated stainless material |
| US20170253008A1 (en) | 2016-02-16 | 2017-09-07 | Xtalic Corporation | Articles including a multi-layer coating and methods |
| DE202017001425U1 (de) | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
-
2017
- 2017-03-16 DE DE202017001425.4U patent/DE202017001425U1/de not_active Expired - Lifetime
- 2017-03-17 KR KR2020170001277U patent/KR200489473Y1/ko active Active
- 2017-03-17 CN CN201720268902.2U patent/CN207638036U/zh active Active
- 2017-03-20 US US15/464,051 patent/US10411379B2/en active Active
- 2017-05-26 JP JP2017002368U patent/JP3211820U/ja not_active Expired - Fee Related
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