CN207638036U - 用于连接器的触点、电子设备和连接器插入件 - Google Patents
用于连接器的触点、电子设备和连接器插入件 Download PDFInfo
- Publication number
- CN207638036U CN207638036U CN201720268902.2U CN201720268902U CN207638036U CN 207638036 U CN207638036 U CN 207638036U CN 201720268902 U CN201720268902 U CN 201720268902U CN 207638036 U CN207638036 U CN 207638036U
- Authority
- CN
- China
- Prior art keywords
- contact
- layer
- copper
- coating layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 90
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 89
- 239000000956 alloy Substances 0.000 claims abstract description 89
- 239000010410 layer Substances 0.000 claims description 366
- 239000011247 coating layer Substances 0.000 claims description 277
- 239000000463 material Substances 0.000 claims description 229
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 108
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 87
- 239000010949 copper Substances 0.000 claims description 87
- 229910052802 copper Inorganic materials 0.000 claims description 86
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 80
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 74
- 229910052737 gold Inorganic materials 0.000 claims description 74
- 239000010931 gold Substances 0.000 claims description 74
- 229910052763 palladium Inorganic materials 0.000 claims description 54
- 230000004888 barrier function Effects 0.000 claims description 46
- 229910000923 precious metal alloy Inorganic materials 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 40
- 238000004080 punching Methods 0.000 claims description 39
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 38
- 238000003780 insertion Methods 0.000 claims description 35
- 230000037431 insertion Effects 0.000 claims description 35
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 28
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 26
- 229910052707 ruthenium Inorganic materials 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 241000784726 Lycaena thetis Species 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 claims description 12
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 11
- 229910000906 Bronze Inorganic materials 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 239000010974 bronze Substances 0.000 claims description 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 7
- PQJKKINZCUWVKL-UHFFFAOYSA-N [Ni].[Cu].[Ag] Chemical compound [Ni].[Cu].[Ag] PQJKKINZCUWVKL-UHFFFAOYSA-N 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims 2
- 238000001962 electrophoresis Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 89
- 238000004891 communication Methods 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 description 53
- 230000007797 corrosion Effects 0.000 description 51
- 238000000034 method Methods 0.000 description 38
- 239000010948 rhodium Substances 0.000 description 34
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 34
- 229910052703 rhodium Inorganic materials 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 28
- 238000003475 lamination Methods 0.000 description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 18
- 229910052718 tin Inorganic materials 0.000 description 18
- 229910000881 Cu alloy Inorganic materials 0.000 description 17
- 229910017052 cobalt Inorganic materials 0.000 description 16
- 239000010941 cobalt Substances 0.000 description 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 16
- 239000011135 tin Substances 0.000 description 15
- 238000004070 electrodeposition Methods 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000005299 abrasion Methods 0.000 description 12
- 239000004033 plastic Substances 0.000 description 12
- 238000005498 polishing Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 230000000873 masking effect Effects 0.000 description 11
- 238000003466 welding Methods 0.000 description 11
- 229920003023 plastic Polymers 0.000 description 10
- 239000010959 steel Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 241000209094 Oryza Species 0.000 description 7
- 235000007164 Oryza sativa Nutrition 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910001092 metal group alloy Inorganic materials 0.000 description 7
- 239000000049 pigment Substances 0.000 description 7
- 235000009566 rice Nutrition 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000004069 differentiation Effects 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000007790 scraping Methods 0.000 description 6
- 238000010146 3D printing Methods 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 238000001652 electrophoretic deposition Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000003678 scratch resistant effect Effects 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- 229910000971 Silver steel Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- -1 bullet Property body Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 230000001552 evening effect Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920002972 Acrylic fiber Polymers 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 2
- 238000000375 direct analysis in real time Methods 0.000 description 2
- 238000012063 dual-affinity re-targeting Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- REOJLIXKJWXUGB-UHFFFAOYSA-N mofebutazone Chemical group O=C1C(CCCC)C(=O)NN1C1=CC=CC=C1 REOJLIXKJWXUGB-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 244000075955 Andropogon parviflorus Species 0.000 description 1
- 241000271460 Crotalus cerastes Species 0.000 description 1
- 241000403354 Microplus Species 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- 229910000929 Ru alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- APTZNLHMIGJTEW-UHFFFAOYSA-N pyraflufen-ethyl Chemical compound C1=C(Cl)C(OCC(=O)OCC)=CC(C=2C(=C(OC(F)F)N(C)N=2)Cl)=C1F APTZNLHMIGJTEW-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662310445P | 2016-03-18 | 2016-03-18 | |
| US62/310,445 | 2016-03-18 | ||
| US201662383381P | 2016-09-02 | 2016-09-02 | |
| US62/383,381 | 2016-09-02 | ||
| US201662384120P | 2016-09-06 | 2016-09-06 | |
| US62/384,120 | 2016-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207638036U true CN207638036U (zh) | 2018-07-20 |
Family
ID=59409883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720268902.2U Active CN207638036U (zh) | 2016-03-18 | 2017-03-17 | 用于连接器的触点、电子设备和连接器插入件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10411379B2 (enExample) |
| JP (1) | JP3211820U (enExample) |
| KR (1) | KR200489473Y1 (enExample) |
| CN (1) | CN207638036U (enExample) |
| DE (1) | DE202017001425U1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110350339A (zh) * | 2018-08-29 | 2019-10-18 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其制造方法和电连接器 |
| CN110416782A (zh) * | 2019-08-27 | 2019-11-05 | 问问智能信息科技有限公司 | 一种充电触点组合结构及其制备方法 |
| CN110504574A (zh) * | 2019-08-27 | 2019-11-26 | 问问智能信息科技有限公司 | 一种充电触点结构及其制备方法 |
| WO2021036137A1 (zh) * | 2019-08-23 | 2021-03-04 | 问问智能信息科技有限公司 | 触点、触点结构、电子设备和充电设备 |
| CN112467431A (zh) * | 2019-09-09 | 2021-03-09 | 苹果公司 | 贵金属合金触点 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10998657B2 (en) | 2016-03-18 | 2021-05-04 | Apple Inc. | Precious-metal-alloy contacts |
| DE202017001425U1 (de) | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
| WO2017195595A1 (ja) | 2016-05-12 | 2017-11-16 | 住友電装株式会社 | 端子金具 |
| JP2018120698A (ja) * | 2017-01-24 | 2018-08-02 | 矢崎総業株式会社 | 端子用めっき材並びにそれを用いた端子、端子付き電線及びワイヤーハーネス |
| CN107630149A (zh) * | 2017-08-30 | 2018-01-26 | 惠州市好得高精密五金有限公司 | 一种硬质千足金表壳及其制配方法 |
| CN108701926B (zh) | 2017-09-20 | 2019-09-03 | 华为技术有限公司 | 通用串行总线接口、移动终端及通用串行总线接口的制作方法 |
| US20190103693A1 (en) * | 2017-09-29 | 2019-04-04 | Apple Inc. | Electrical contacts having sacrificial layer for corrosion protection |
| CN109659750B (zh) | 2017-10-12 | 2021-09-17 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其制造方法 |
| CN109787007A (zh) | 2017-11-15 | 2019-05-21 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其导电端子 |
| FR3074193B1 (fr) * | 2017-11-28 | 2020-07-10 | Linxens Holding | Circuit electrique, module electronique pour carte a puce realise sur ce circuit electrique et procede pour la realisation d’un tel circuit electrique. |
| CN109904705B (zh) * | 2017-12-07 | 2021-10-08 | 泰科电子(上海)有限公司 | 导电端子坯料条的制造方法和导电端子的制造方法 |
| US11674235B2 (en) | 2018-04-11 | 2023-06-13 | Hutchinson Technology Incorporated | Plating method to reduce or eliminate voids in solder applied without flux |
| US11201426B2 (en) * | 2018-08-13 | 2021-12-14 | Apple Inc. | Electrical contact appearance and protection |
| DE102018009544A1 (de) * | 2018-11-29 | 2020-06-04 | Serafettin Kesim | Taster Hubdruckvorrichtung für Elektro- und Automaten Anlagen |
| KR102148316B1 (ko) | 2018-12-11 | 2020-08-26 | 히로세코리아 주식회사 | 전기적 접촉 단자 |
| DE102019104644B3 (de) | 2019-02-25 | 2020-07-09 | Carl Zeiss Industrielle Messtechnik Gmbh | Taststiftwechselhalterung und Taststift |
| JP2020187971A (ja) * | 2019-05-16 | 2020-11-19 | 株式会社オートネットワーク技術研究所 | コネクタ端子、端子付き電線、及び端子対 |
| EP4121285A4 (en) * | 2020-03-18 | 2024-03-20 | Xtalic Corporation | NANOSTRUCTURED PALLADIUM ALLOYS AND ASSOCIATED PROCESSES |
| CN111961906B (zh) * | 2020-07-29 | 2021-11-05 | 济南大学 | 一种高强高韧耐蚀镍基复合材料的制备方法及所得产品 |
| KR20220046883A (ko) | 2020-10-08 | 2022-04-15 | 삼성전자주식회사 | 호스트 커넥터와 메모리 장치를 포함하는 전자 장치 |
| CN112725653A (zh) * | 2020-12-21 | 2021-04-30 | 有研亿金新材料有限公司 | 一种新型高塑性金基电刷材料及其制备方法 |
| US11764505B2 (en) * | 2021-07-21 | 2023-09-19 | Dell Products L.P. | Add-in card connector contact optimization for high-speed signaling |
| GB2624355A (en) | 2021-10-26 | 2024-05-15 | Halliburton Energy Services Inc | Auto-insulating concentric wet-mate electrical connector for downhole applications |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810998B2 (ja) * | 1975-06-30 | 1983-02-28 | 松下電工株式会社 | 電気接点およびその電気接点の製造方法 |
| JPS56112022A (en) * | 1980-02-08 | 1981-09-04 | Fujitsu Ltd | Electric slide contactor |
| JPS60127673A (ja) * | 1983-12-12 | 1985-07-08 | 田中貴金属工業株式会社 | コネクタ材料の製造方法 |
| US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| JPS62219479A (ja) * | 1986-03-20 | 1987-09-26 | 日立電線株式会社 | 金めつき接点材 |
| US4747783A (en) | 1986-10-28 | 1988-05-31 | International Business Machines Corporation | Resistive pin for printed circuit card connector |
| JPH0590834U (ja) * | 1992-05-22 | 1993-12-10 | 日本航空電子工業株式会社 | コンタクト |
| JP3211820B2 (ja) | 1998-12-04 | 2001-09-25 | 株式会社デンソー | 内燃機関用スパークプラグ |
| US6335107B1 (en) | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| JP4054208B2 (ja) * | 2002-04-01 | 2008-02-27 | 富士通株式会社 | コンタクタの製造方法 |
| US6666713B1 (en) * | 2002-07-19 | 2003-12-23 | Ronald D. Norvelle | Ganged receptacle fixture apparatus |
| DE10245343A1 (de) | 2002-09-27 | 2004-04-08 | Robert Bosch Gmbh | Elektrischer Kontakt |
| US7030325B2 (en) * | 2002-12-16 | 2006-04-18 | Trw Automotive U.S. Llc | Electrical switch assembly |
| JP2006108057A (ja) * | 2004-10-08 | 2006-04-20 | Matsushita Electric Works Ltd | コネクタ接続端子 |
| JP5128153B2 (ja) | 2006-03-17 | 2013-01-23 | 古河電気工業株式会社 | 電気接点材料及びその製造方法 |
| JP2009259595A (ja) | 2008-04-16 | 2009-11-05 | Hitachi Cable Ltd | 電気接点層付金属材およびその製造方法 |
| US9694562B2 (en) * | 2010-03-12 | 2017-07-04 | Xtalic Corporation | Coated articles and methods |
| CN102485959A (zh) | 2010-12-01 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | 金属多孔材料的制备方法及由该方法制得的金属多孔材料 |
| DE102011006899B4 (de) | 2011-04-06 | 2025-01-30 | Te Connectivity Germany Gmbh | Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung |
| US8637165B2 (en) * | 2011-09-30 | 2014-01-28 | Apple Inc. | Connector with multi-layer Ni underplated contacts |
| JP5851186B2 (ja) * | 2011-10-04 | 2016-02-03 | 日本圧着端子製造株式会社 | コンタクトおよび電気コネクタ |
| JP2013080623A (ja) * | 2011-10-04 | 2013-05-02 | Jst Mfg Co Ltd | コンタクトおよび電気コネクタ |
| JP5138827B1 (ja) | 2012-03-23 | 2013-02-06 | Ｊｘ日鉱日石金属株式会社 | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 |
| JP5427945B2 (ja) | 2012-06-27 | 2014-02-26 | Ｊｘ日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
| US8747155B2 (en) * | 2012-09-07 | 2014-06-10 | Apple Inc. | Underfill applicator device and methods for assembling electrical contacts |
| US8905793B2 (en) * | 2012-09-07 | 2014-12-09 | Apple Inc. | Contacts for an electrical connector |
| KR20160018600A (ko) | 2013-06-10 | 2016-02-17 | 오리엔타루토킨 가부시키가이샤 | 도금 적층체의 제조방법 및 도금 적층체 |
| JP6182757B2 (ja) * | 2013-09-02 | 2017-08-23 | オリエンタル鍍金株式会社 | めっき材の製造方法及びめっき材 |
| WO2015041132A1 (ja) | 2013-09-20 | 2015-03-26 | 東洋鋼鈑株式会社 | 金属めっき被覆ステンレス材、および金属めっき被覆ステンレス材の製造方法 |
| WO2017143033A1 (en) | 2016-02-16 | 2017-08-24 | Xtalic Corporation | Articles including a multi-layer coating and methods |
| DE202017001425U1 (de) | 2016-03-18 | 2017-07-06 | Apple Inc. | Kontakte aus Edelmetallegierungen |
-
2017
- 2017-03-16 DE DE202017001425.4U patent/DE202017001425U1/de not_active Expired - Lifetime
- 2017-03-17 KR KR2020170001277U patent/KR200489473Y1/ko active Active
- 2017-03-17 CN CN201720268902.2U patent/CN207638036U/zh active Active
- 2017-03-20 US US15/464,051 patent/US10411379B2/en active Active
- 2017-05-26 JP JP2017002368U patent/JP3211820U/ja not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110350339A (zh) * | 2018-08-29 | 2019-10-18 | 富士康(昆山)电脑接插件有限公司 | 导电端子及其制造方法和电连接器 |
| WO2021036137A1 (zh) * | 2019-08-23 | 2021-03-04 | 问问智能信息科技有限公司 | 触点、触点结构、电子设备和充电设备 |
| CN110416782A (zh) * | 2019-08-27 | 2019-11-05 | 问问智能信息科技有限公司 | 一种充电触点组合结构及其制备方法 |
| CN110504574A (zh) * | 2019-08-27 | 2019-11-26 | 问问智能信息科技有限公司 | 一种充电触点结构及其制备方法 |
| CN112467431A (zh) * | 2019-09-09 | 2021-03-09 | 苹果公司 | 贵金属合金触点 |
| CN112467431B (zh) * | 2019-09-09 | 2022-04-19 | 苹果公司 | 贵金属合金触点 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170003367U (ko) | 2017-09-27 |
| DE202017001425U1 (de) | 2017-07-06 |
| US20170271800A1 (en) | 2017-09-21 |
| KR200489473Y1 (ko) | 2019-06-21 |
| JP3211820U (ja) | 2017-08-03 |
| US10411379B2 (en) | 2019-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207638036U (zh) | 用于连接器的触点、电子设备和连接器插入件 | |
| US10998657B2 (en) | Precious-metal-alloy contacts | |
| CN207381564U (zh) | 电子设备 | |
| CN102171631B (zh) | 电子设备显示窗的带有触摸输入功能的保护面板 | |
| EP2131269A1 (en) | Protective panel with touch input function of electronic instrument display window | |
| CN105493362B (zh) | 放电装置 | |
| US9004960B2 (en) | Connector with gold-palladium plated contacts | |
| CN105633704A (zh) | 薄膜型磁性连接器模块 | |
| CN109586081A (zh) | 混合连接器 | |
| CN103361705B (zh) | 对特定位置电镀的电镀治具、电镀方法及被电镀物产品 | |
| CN106845433A (zh) | 指纹识别模组及电子设备 | |
| CN112467431B (zh) | 贵金属合金触点 | |
| US20180030608A1 (en) | Plating having increased thickness and reduced grain size | |
| US20190103693A1 (en) | Electrical contacts having sacrificial layer for corrosion protection | |
| CN108390176A (zh) | 接线端子、连接装置、电子设备及接线端子的制作方法 | |
| US20180083406A1 (en) | Sealed corrosion-resistant contacts | |
| US20250350059A1 (en) | Conductive colors for electrical contacts | |
| CN210886265U (zh) | 一种用于手持电子设备接口端子的电镀镀层 | |
| JP2025172033A (ja) | 電気接点用の導電性カラー | |
| CN206135206U (zh) | 放电装置 | |
| US11201426B2 (en) | Electrical contact appearance and protection | |
| US20200099166A1 (en) | Wireformed contacts that conserve resources | |
| CN106785597A (zh) | 多触点数据接口及应用其的移动终端 | |
| JP3899722B2 (ja) | 電子部品のバレルめっき方法 | |
| CN106229721B (zh) | 连接触点、充电数据线、电子设备及连接触点的制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |