JP2006148033A5 - - Google Patents

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Publication number
JP2006148033A5
JP2006148033A5 JP2004339856A JP2004339856A JP2006148033A5 JP 2006148033 A5 JP2006148033 A5 JP 2006148033A5 JP 2004339856 A JP2004339856 A JP 2004339856A JP 2004339856 A JP2004339856 A JP 2004339856A JP 2006148033 A5 JP2006148033 A5 JP 2006148033A5
Authority
JP
Japan
Prior art keywords
ceramic electronic
electronic component
component assembly
assembly according
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004339856A
Other languages
English (en)
Japanese (ja)
Other versions
JP4307363B2 (ja
JP2006148033A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004339856A priority Critical patent/JP4307363B2/ja
Priority claimed from JP2004339856A external-priority patent/JP4307363B2/ja
Publication of JP2006148033A publication Critical patent/JP2006148033A/ja
Publication of JP2006148033A5 publication Critical patent/JP2006148033A5/ja
Application granted granted Critical
Publication of JP4307363B2 publication Critical patent/JP4307363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004339856A 2004-11-25 2004-11-25 セラミック電子部品アセンブリ及びその実装構造 Expired - Fee Related JP4307363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004339856A JP4307363B2 (ja) 2004-11-25 2004-11-25 セラミック電子部品アセンブリ及びその実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004339856A JP4307363B2 (ja) 2004-11-25 2004-11-25 セラミック電子部品アセンブリ及びその実装構造

Publications (3)

Publication Number Publication Date
JP2006148033A JP2006148033A (ja) 2006-06-08
JP2006148033A5 true JP2006148033A5 (enExample) 2006-12-07
JP4307363B2 JP4307363B2 (ja) 2009-08-05

Family

ID=36627335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004339856A Expired - Fee Related JP4307363B2 (ja) 2004-11-25 2004-11-25 セラミック電子部品アセンブリ及びその実装構造

Country Status (1)

Country Link
JP (1) JP4307363B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5821878B2 (ja) * 2013-03-14 2015-11-24 株式会社村田製作所 電子部品
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
JP6962282B2 (ja) * 2018-06-27 2021-11-05 株式会社村田製作所 積層セラミック電子部品

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