JP2009170849A5 - - Google Patents

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Publication number
JP2009170849A5
JP2009170849A5 JP2008010489A JP2008010489A JP2009170849A5 JP 2009170849 A5 JP2009170849 A5 JP 2009170849A5 JP 2008010489 A JP2008010489 A JP 2008010489A JP 2008010489 A JP2008010489 A JP 2008010489A JP 2009170849 A5 JP2009170849 A5 JP 2009170849A5
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JP
Japan
Prior art keywords
conductor
wiring board
layer
electronic component
conductor portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008010489A
Other languages
English (en)
Japanese (ja)
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JP2009170849A (ja
JP4949279B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008010489A priority Critical patent/JP4949279B2/ja
Priority claimed from JP2008010489A external-priority patent/JP4949279B2/ja
Priority to US12/348,514 priority patent/US8183469B2/en
Publication of JP2009170849A publication Critical patent/JP2009170849A/ja
Publication of JP2009170849A5 publication Critical patent/JP2009170849A5/ja
Application granted granted Critical
Publication of JP4949279B2 publication Critical patent/JP4949279B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008010489A 2008-01-21 2008-01-21 配線基板及びその製造方法 Active JP4949279B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008010489A JP4949279B2 (ja) 2008-01-21 2008-01-21 配線基板及びその製造方法
US12/348,514 US8183469B2 (en) 2008-01-21 2009-01-05 Wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008010489A JP4949279B2 (ja) 2008-01-21 2008-01-21 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009170849A JP2009170849A (ja) 2009-07-30
JP2009170849A5 true JP2009170849A5 (enExample) 2010-12-24
JP4949279B2 JP4949279B2 (ja) 2012-06-06

Family

ID=40875539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008010489A Active JP4949279B2 (ja) 2008-01-21 2008-01-21 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US8183469B2 (enExample)
JP (1) JP4949279B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9129955B2 (en) * 2009-02-04 2015-09-08 Texas Instruments Incorporated Semiconductor flip-chip system having oblong connectors and reduced trace pitches
KR101019642B1 (ko) * 2009-04-27 2011-03-07 삼성전기주식회사 인쇄회로기판 제조 방법
KR101932727B1 (ko) * 2012-05-07 2018-12-27 삼성전자주식회사 범프 구조물, 이를 갖는 반도체 패키지 및 이의 제조 방법
KR101673649B1 (ko) * 2013-07-16 2016-11-08 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
JP6210777B2 (ja) * 2013-07-26 2017-10-11 新光電気工業株式会社 バンプ構造、配線基板及び半導体装置並びにバンプ構造の製造方法
US10835323B2 (en) * 2013-08-28 2020-11-17 Institute Of Technical Education System and apparatus for guiding an instrument
JP2015072996A (ja) * 2013-10-02 2015-04-16 新光電気工業株式会社 半導体装置
US9706643B2 (en) * 2014-06-19 2017-07-11 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing the same
JP6451569B2 (ja) * 2015-09-14 2019-01-16 株式会社デンソー 電子装置
CN119421589A (zh) 2019-05-31 2025-02-11 京东方科技集团股份有限公司 显示背板及其制备方法和显示装置
WO2020237629A1 (zh) 2019-05-31 2020-12-03 京东方科技集团股份有限公司 显示背板及制作方法、显示面板及制作方法、显示装置
EP4016630B1 (en) * 2019-08-16 2025-11-19 BOE Technology Group Co., Ltd. Display backplane and manufacturing method therefor, and display device
CN110600497B (zh) * 2019-10-22 2022-06-17 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01226160A (ja) 1988-03-07 1989-09-08 Nippon Telegr & Teleph Corp <Ntt> 電子部品接続用の端子装置および端子の製造方法
JPH0270370U (enExample) * 1988-11-17 1990-05-29
JP2798605B2 (ja) * 1994-04-27 1998-09-17 日本電気株式会社 実装装置の製造方法
JP3446508B2 (ja) 1996-12-03 2003-09-16 松下電器産業株式会社 バンプ付きワークの実装方法および実装基板
US6188028B1 (en) * 1997-06-09 2001-02-13 Tessera, Inc. Multilayer structure with interlocking protrusions
JP3085283B2 (ja) * 1998-07-13 2000-09-04 日本電気株式会社 電子部品と基板との接続装置及びその接続方法
JP2000183507A (ja) 1998-12-17 2000-06-30 Shinko Electric Ind Co Ltd 半導体チップ若しくは半導体装置の実装基板への実装構造
JP3160583B2 (ja) * 1999-01-27 2001-04-25 日本特殊陶業株式会社 樹脂製基板

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