JP2012028771A5 - - Google Patents

Download PDF

Info

Publication number
JP2012028771A5
JP2012028771A5 JP2011158573A JP2011158573A JP2012028771A5 JP 2012028771 A5 JP2012028771 A5 JP 2012028771A5 JP 2011158573 A JP2011158573 A JP 2011158573A JP 2011158573 A JP2011158573 A JP 2011158573A JP 2012028771 A5 JP2012028771 A5 JP 2012028771A5
Authority
JP
Japan
Prior art keywords
heat spreader
integrated circuit
substrate
heat
conductive core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011158573A
Other languages
English (en)
Japanese (ja)
Other versions
JP5885952B2 (ja
JP2012028771A (ja
Filing date
Publication date
Priority claimed from US12/840,016 external-priority patent/US8492911B2/en
Application filed filed Critical
Publication of JP2012028771A publication Critical patent/JP2012028771A/ja
Publication of JP2012028771A5 publication Critical patent/JP2012028771A5/ja
Application granted granted Critical
Publication of JP5885952B2 publication Critical patent/JP5885952B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011158573A 2010-07-20 2011-07-20 積層状の相互接続ヒートシンク Active JP5885952B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/840,016 US8492911B2 (en) 2010-07-20 2010-07-20 Stacked interconnect heat sink
US12/840,016 2010-07-20

Publications (3)

Publication Number Publication Date
JP2012028771A JP2012028771A (ja) 2012-02-09
JP2012028771A5 true JP2012028771A5 (enExample) 2014-08-14
JP5885952B2 JP5885952B2 (ja) 2016-03-16

Family

ID=44719192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011158573A Active JP5885952B2 (ja) 2010-07-20 2011-07-20 積層状の相互接続ヒートシンク

Country Status (6)

Country Link
US (3) US8492911B2 (enExample)
EP (2) EP2410563B1 (enExample)
JP (1) JP5885952B2 (enExample)
KR (1) KR101795047B1 (enExample)
CN (1) CN102339800A (enExample)
TW (1) TWI413222B (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120053675A (ko) * 2010-11-18 2012-05-29 삼성전자주식회사 반도체 패키지 및 그의 제조 방법, 및 인터포저 칩 및 그의 제조 방법
TWI496271B (zh) * 2010-12-30 2015-08-11 財團法人工業技術研究院 晶圓級模封接合結構及其製造方法
US20120299173A1 (en) * 2011-05-26 2012-11-29 Futurewei Technologies, Inc. Thermally Enhanced Stacked Package and Method
DE102011088256A1 (de) * 2011-12-12 2013-06-13 Zf Friedrichshafen Ag Multilayer-Leiterplatte sowie Anordnung mit einer solchen
US8946757B2 (en) * 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9236322B2 (en) * 2012-04-11 2016-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for heat spreader on silicon
US9337123B2 (en) 2012-07-11 2016-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal structure for integrated circuit package
US10269676B2 (en) * 2012-10-04 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced package-on-package (PoP)
US20140133105A1 (en) * 2012-11-09 2014-05-15 Nvidia Corporation Method of embedding cpu/gpu/logic chip into a substrate of a package-on-package structure
US20140225248A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated Power distribution and thermal solution for direct stacked integrated circuits
KR102103375B1 (ko) * 2013-06-18 2020-04-22 삼성전자주식회사 반도체 패키지
KR102057210B1 (ko) 2013-07-05 2020-01-22 에스케이하이닉스 주식회사 반도체 칩 및 이를 갖는 적층형 반도체 패키지
US9496297B2 (en) 2013-12-05 2016-11-15 Optiz, Inc. Sensor package with cooling feature and method of making same
TW201533882A (zh) * 2014-02-21 2015-09-01 南茂科技股份有限公司 覆晶堆疊封裝
US9786633B2 (en) 2014-04-23 2017-10-10 Massachusetts Institute Of Technology Interconnect structures for fine pitch assembly of semiconductor structures and related techniques
US9524917B2 (en) 2014-04-23 2016-12-20 Optiz, Inc. Chip level heat dissipation using silicon
US9356009B2 (en) 2014-05-27 2016-05-31 Micron Technology, Inc. Interconnect structure with redundant electrical connectors and associated systems and methods
US9691746B2 (en) 2014-07-14 2017-06-27 Micron Technology, Inc. Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
WO2016073049A1 (en) * 2014-08-11 2016-05-12 Massachusetts Institute Of Technology Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure
TWI614860B (zh) * 2014-10-08 2018-02-11 李明芬 一種半導體引線鍵合結構及其製程
US9706668B2 (en) * 2014-10-24 2017-07-11 Samsung Electro-Mechanics Co., Ltd. Printed circuit board, electronic module and method of manufacturing the same
US9812429B2 (en) 2014-11-05 2017-11-07 Massachusetts Institute Of Technology Interconnect structures for assembly of multi-layer semiconductor devices
DE112014007285B4 (de) * 2014-12-26 2024-01-18 Mitsubishi Electric Corporation Halbleitermodul
US9971970B1 (en) 2015-04-27 2018-05-15 Rigetti & Co, Inc. Microwave integrated quantum circuits with VIAS and methods for making the same
CN104851860B (zh) * 2015-04-30 2018-03-13 华为技术有限公司 一种集成电路管芯及制造方法
US9302905B1 (en) * 2015-06-15 2016-04-05 Innovative Micro Technology Method for forming a microfabricated structure
US10134972B2 (en) 2015-07-23 2018-11-20 Massachusetts Institute Of Technology Qubit and coupler circuit structures and coupling techniques
US10658424B2 (en) 2015-07-23 2020-05-19 Massachusetts Institute Of Technology Superconducting integrated circuit
DE102015116807A1 (de) * 2015-10-02 2017-04-06 Infineon Technologies Austria Ag Funktionalisierte Schnittstellenstruktur
US10242968B2 (en) 2015-11-05 2019-03-26 Massachusetts Institute Of Technology Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
WO2017079394A1 (en) 2015-11-05 2017-05-11 Massachusetts Institute Of Technology Interconnect structures and methods for fabricating interconnect structures
KR102372300B1 (ko) 2015-11-26 2022-03-08 삼성전자주식회사 스택 패키지 및 그 제조 방법
DE102016214607B4 (de) * 2016-08-05 2023-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches Modul und Verfahren zu seiner Herstellung
US10586909B2 (en) 2016-10-11 2020-03-10 Massachusetts Institute Of Technology Cryogenic electronic packages and assemblies
US9996725B2 (en) 2016-11-03 2018-06-12 Optiz, Inc. Under screen sensor assembly
US10163751B2 (en) * 2016-11-29 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Heat transfer structures and methods for IC packages
US11276667B2 (en) * 2016-12-31 2022-03-15 Intel Corporation Heat removal between top and bottom die interface
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US10229864B1 (en) * 2017-09-14 2019-03-12 Northrop Grumman Systems Corporation Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias
US11004763B2 (en) 2018-12-20 2021-05-11 Northrop Grumman Systems Corporation Superconducting device with multiple thermal sinks
JP7267767B2 (ja) * 2019-02-20 2023-05-02 ローム株式会社 半導体装置および半導体装置の製造方法
CN110707055B (zh) * 2019-09-11 2021-12-28 长江存储科技有限责任公司 芯片、电子设备
US11522118B2 (en) 2020-01-09 2022-12-06 Northrop Grumman Systems Corporation Superconductor structure with normal metal connection to a resistor and method of making the same
CN113113367A (zh) * 2020-01-13 2021-07-13 华为技术有限公司 芯片、芯片的制造方法和电子设备
KR102767656B1 (ko) * 2020-03-26 2025-02-17 엘지마그나 이파워트레인 주식회사 양면 냉각형 파워 모듈
EP4184573A4 (en) * 2020-08-04 2023-09-20 Huawei Technologies Co., Ltd. STACKED MULTICHIP ENCLOSURE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING
WO2023007383A1 (en) * 2021-07-29 2023-02-02 Marvell Asia Pte Ltd Improving heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuits
US20230046413A1 (en) * 2021-08-13 2023-02-16 Mediatek Inc. Semiconductor package assembly
US20230395450A1 (en) * 2022-06-01 2023-12-07 Taiwan Semiconductor Manufacturing Company Limited Reinforced structure with capping layer and methods of forming the same
WO2025069019A1 (en) * 2023-09-28 2025-04-03 P.C.B. Technologies Ltd. Heat spreading core with conductive pass-through for high power device packages

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020637A (en) 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
KR100432715B1 (ko) * 2001-07-18 2004-05-24 엘지전자 주식회사 방열부재를 갖는 인쇄회로기판 및 그 제조방법
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート
JP4300316B2 (ja) * 2005-02-15 2009-07-22 独立行政法人産業技術総合研究所 積層型集積回路装置
US7317256B2 (en) 2005-06-01 2008-01-08 Intel Corporation Electronic packaging including die with through silicon via
JP5025113B2 (ja) * 2005-09-29 2012-09-12 三洋電機株式会社 回路装置
JP4463178B2 (ja) * 2005-09-30 2010-05-12 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
US7432592B2 (en) 2005-10-13 2008-10-07 Intel Corporation Integrated micro-channels for 3D through silicon architectures
KR100702968B1 (ko) 2005-11-24 2007-04-03 삼성전자주식회사 플로팅된 히트 싱크를 갖는 반도체 패키지와, 그를 이용한적층 패키지 및 그의 제조 방법
KR100842910B1 (ko) * 2006-06-29 2008-07-02 주식회사 하이닉스반도체 스택 패키지
US8110899B2 (en) 2006-12-20 2012-02-07 Intel Corporation Method for incorporating existing silicon die into 3D integrated stack
US20080153200A1 (en) * 2006-12-22 2008-06-26 Arkalgud Sitaram Stacked semiconductor components
CN101589468A (zh) * 2007-01-17 2009-11-25 Nxp股份有限公司 具有通过衬底的通路孔的系统级封装
US20080173792A1 (en) * 2007-01-23 2008-07-24 Advanced Chip Engineering Technology Inc. Image sensor module and the method of the same
US20080217761A1 (en) * 2007-03-08 2008-09-11 Advanced Chip Engineering Technology Inc. Structure of semiconductor device package and method of the same
US20080237844A1 (en) * 2007-03-28 2008-10-02 Aleksandar Aleksov Microelectronic package and method of manufacturing same
TWI338939B (en) 2007-08-15 2011-03-11 Via Tech Inc Package module and electronic device
US7592697B2 (en) 2007-08-27 2009-09-22 Intel Corporation Microelectronic package and method of cooling same
JP2009071004A (ja) * 2007-09-13 2009-04-02 Panasonic Corp 半導体装置とその製造方法
JP2009246258A (ja) * 2008-03-31 2009-10-22 Nikon Corp 半導体装置および製造方法
US7803714B2 (en) 2008-03-31 2010-09-28 Freescale Semiconductor, Inc. Semiconductor through silicon vias of variable size and method of formation
US8154134B2 (en) * 2008-05-12 2012-04-10 Texas Instruments Incorporated Packaged electronic devices with face-up die having TSV connection to leads and die pad
US7928563B2 (en) 2008-05-28 2011-04-19 Georgia Tech Research Corporation 3-D ICs with microfluidic interconnects and methods of constructing same
US8026567B2 (en) * 2008-12-22 2011-09-27 Taiwan Semiconductor Manufactuirng Co., Ltd. Thermoelectric cooler for semiconductor devices with TSV
US8314483B2 (en) * 2009-01-26 2012-11-20 Taiwan Semiconductor Manufacturing Company, Ltd. On-chip heat spreader
KR20120053675A (ko) * 2010-11-18 2012-05-29 삼성전자주식회사 반도체 패키지 및 그의 제조 방법, 및 인터포저 칩 및 그의 제조 방법

Similar Documents

Publication Publication Date Title
JP2012028771A5 (enExample)
JP2016192568A5 (enExample)
JP2013004881A5 (enExample)
WO2012074783A3 (en) Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
JP2008160160A5 (enExample)
JP2013527434A5 (enExample)
EP2762441A3 (en) Internal electrical contact for enclosed MEMS devices
EP2469591A3 (en) Method for fabricating a semiconductor device package
JP2010003295A5 (enExample)
WO2008123766A3 (en) High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity
JP2010529652A5 (enExample)
EP2728981A3 (en) Connecting structure between circuit boards and battery pack having the same
JP2012069952A5 (enExample)
JP2017508281A5 (enExample)
WO2011140141A3 (en) Printed circuit board with embossed hollow heatsink pad
JP2014150102A5 (enExample)
JP2011249718A5 (enExample)
JP2013073882A5 (enExample)
JP2009044154A5 (enExample)
JP2012004505A5 (enExample)
JP2010278425A5 (enExample)
JP2007299900A5 (enExample)
TWI508635B (zh) 具有內埋電子元件的電路板及其製作方法
JP2015133387A5 (enExample)
TW200723988A (en) Via structure of printed circuit board