JP2008217776A5 - - Google Patents

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Publication number
JP2008217776A5
JP2008217776A5 JP2008026598A JP2008026598A JP2008217776A5 JP 2008217776 A5 JP2008217776 A5 JP 2008217776A5 JP 2008026598 A JP2008026598 A JP 2008026598A JP 2008026598 A JP2008026598 A JP 2008026598A JP 2008217776 A5 JP2008217776 A5 JP 2008217776A5
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JP
Japan
Prior art keywords
integrated circuit
antenna
substrate
circuit portion
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008026598A
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English (en)
Japanese (ja)
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JP2008217776A (ja
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Publication date
Application filed filed Critical
Priority to JP2008026598A priority Critical patent/JP2008217776A/ja
Priority claimed from JP2008026598A external-priority patent/JP2008217776A/ja
Publication of JP2008217776A publication Critical patent/JP2008217776A/ja
Publication of JP2008217776A5 publication Critical patent/JP2008217776A5/ja
Withdrawn legal-status Critical Current

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JP2008026598A 2007-02-09 2008-02-06 半導体装置 Withdrawn JP2008217776A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008026598A JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007030858 2007-02-09
JP2008026598A JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Publications (2)

Publication Number Publication Date
JP2008217776A JP2008217776A (ja) 2008-09-18
JP2008217776A5 true JP2008217776A5 (enExample) 2011-03-17

Family

ID=39685402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008026598A Withdrawn JP2008217776A (ja) 2007-02-09 2008-02-06 半導体装置

Country Status (2)

Country Link
US (1) US7683838B2 (enExample)
JP (1) JP2008217776A (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1978472A3 (en) * 2007-04-06 2015-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8154456B2 (en) * 2008-05-22 2012-04-10 Philtech Inc. RF powder-containing base
US8188924B2 (en) * 2008-05-22 2012-05-29 Philtech Inc. RF powder and method for manufacturing the same
JP5581106B2 (ja) * 2009-04-27 2014-08-27 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN102714001B (zh) 2010-01-29 2015-11-25 株式会社半导体能源研究所 半导体装置与包含半导体装置的电子装置
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN102749770B (zh) * 2012-04-06 2015-02-04 信利工业(汕尾)有限公司 一种集成NFC天线的TP On/In Cell型薄膜晶体管显示器
US9221289B2 (en) 2012-07-27 2015-12-29 Apple Inc. Sapphire window
DE102012023064A1 (de) * 2012-11-20 2014-05-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. RFID-Transponder, der passiv betreibbar ist
US9232672B2 (en) 2013-01-10 2016-01-05 Apple Inc. Ceramic insert control mechanism
US9632537B2 (en) 2013-09-23 2017-04-25 Apple Inc. Electronic component embedded in ceramic material
US9678540B2 (en) 2013-09-23 2017-06-13 Apple Inc. Electronic component embedded in ceramic material
JP6220239B2 (ja) * 2013-11-13 2017-10-25 キヤノン株式会社 電磁波検出・発生装置
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US9225056B2 (en) 2014-02-12 2015-12-29 Apple Inc. Antenna on sapphire structure
JP6545976B2 (ja) 2014-03-07 2019-07-17 株式会社半導体エネルギー研究所 半導体装置
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
JP6399313B2 (ja) * 2015-07-13 2018-10-03 トッパン・フォームズ株式会社 電子機器
US9787368B2 (en) * 2015-11-06 2017-10-10 Mediatek Inc. Antenna having passive booster for near field communication
JP6917700B2 (ja) 2015-12-02 2021-08-11 株式会社半導体エネルギー研究所 半導体装置
CN106057662A (zh) * 2016-06-03 2016-10-26 杭州潮盛科技有限公司 射频标签及其制作工艺
JP6380719B2 (ja) * 2016-06-30 2018-08-29 株式会社村田製作所 アタッチメント型ブースターアンテナ及びこれを用いたリーダライタ
US10249456B2 (en) * 2017-03-21 2019-04-02 Illinois Tool Works Inc. Apparatus with membrane panel having close-proximity communication antenna
JP7275683B2 (ja) * 2018-03-15 2023-05-18 大日本印刷株式会社 配線基板、及び配線基板の製造方法
TWI679825B (zh) * 2019-01-10 2019-12-11 友達光電股份有限公司 顯示裝置以及無線傳輸裝置
CN110556404A (zh) * 2019-08-09 2019-12-10 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004078991A (ja) 1998-12-17 2004-03-11 Hitachi Ltd 半導体装置およびその製造方法
TW484101B (en) 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
JP4718677B2 (ja) * 2000-12-06 2011-07-06 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2003006592A (ja) * 2001-06-21 2003-01-10 Matsushita Electric Ind Co Ltd 情報送受信装置
JP2005252853A (ja) 2004-03-05 2005-09-15 Fec Inc Ｒｆ−ｉｄ用アンテナ
CN1938901B (zh) * 2004-03-26 2012-08-15 株式会社半导体能源研究所 半导体器件
JP4566794B2 (ja) * 2004-03-26 2010-10-20 株式会社半導体エネルギー研究所 半導体装置
JP5072208B2 (ja) * 2004-09-24 2012-11-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4071253B2 (ja) * 2005-08-25 2008-04-02 東芝テック株式会社 複合アンテナ

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