JP2015532570A5 - - Google Patents

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Publication number
JP2015532570A5
JP2015532570A5 JP2015539723A JP2015539723A JP2015532570A5 JP 2015532570 A5 JP2015532570 A5 JP 2015532570A5 JP 2015539723 A JP2015539723 A JP 2015539723A JP 2015539723 A JP2015539723 A JP 2015539723A JP 2015532570 A5 JP2015532570 A5 JP 2015532570A5
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JP
Japan
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metallization layer
metallization
portions
vias
layer
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JP2015539723A
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Japanese (ja)
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JP2015532570A (ja
JP6322639B2 (ja
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Priority claimed from US13/657,615 external-priority patent/US9356352B2/en
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JP2015539723A 2012-10-22 2013-10-22 導波路カプラー Active JP6322639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/657,615 US9356352B2 (en) 2012-10-22 2012-10-22 Waveguide coupler
US13/657,615 2012-10-22
PCT/US2013/066254 WO2014066437A1 (en) 2012-10-22 2013-10-22 Waveguide coupler

Publications (3)

Publication Number Publication Date
JP2015532570A JP2015532570A (ja) 2015-11-09
JP2015532570A5 true JP2015532570A5 (enExample) 2016-12-08
JP6322639B2 JP6322639B2 (ja) 2018-05-09

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ID=50484874

Family Applications (1)

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JP2015539723A Active JP6322639B2 (ja) 2012-10-22 2013-10-22 導波路カプラー

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US (3) US9356352B2 (enExample)
JP (1) JP6322639B2 (enExample)
CN (1) CN104737364B (enExample)
WO (1) WO2014066437A1 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9356352B2 (en) * 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
DE112016006695T5 (de) 2016-04-01 2018-12-06 Intel IP Corporation Gehäuse auf Antennengehäuse
US10756033B2 (en) 2016-06-03 2020-08-25 Intel IP Corporation Wireless module with antenna package and cap package
US10971822B2 (en) 2016-10-31 2021-04-06 Kyocera Corporation Antenna, module substrate, and module
US10224634B2 (en) * 2016-11-03 2019-03-05 At&T Intellectual Property I, L.P. Methods and apparatus for adjusting an operational characteristic of an antenna
US10944180B2 (en) * 2017-07-10 2021-03-09 Viasat, Inc. Phased array antenna
US11735806B2 (en) * 2018-05-14 2023-08-22 Texas Instruments Incorporated Wireless device with waveguiding structures between radiating structures and waveguide feeds
DE102018118765A1 (de) * 2018-08-02 2020-02-06 Endress+Hauser SE+Co. KG Hochfrequenzbaustein
KR102656395B1 (ko) * 2018-09-04 2024-04-09 삼성전기주식회사 고주파 필터 장치 및 고주파 모듈
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
DE102019102784A1 (de) * 2019-02-05 2020-08-06 Infineon Technologies Ag Halbleitervorrichtungen mit Radar-Halbleiterchip und zugehörige Herstellungsverfahren
US10651541B1 (en) * 2019-02-27 2020-05-12 Nxp Usa, Inc. Package integrated waveguide
US11031681B2 (en) 2019-06-20 2021-06-08 Nxp Usa, Inc. Package integrated waveguide
US11335652B2 (en) 2019-07-29 2022-05-17 Nxp Usa, Inc. Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide
US11133578B2 (en) * 2019-09-06 2021-09-28 Nxp B.V. Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide
US11133273B2 (en) * 2019-12-17 2021-09-28 Nxp Usa, Inc. Semiconductor device with waveguide and method therefor
DE102020113232A1 (de) * 2020-05-15 2021-11-18 Infineon Technologies Ag Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren
US11557544B2 (en) * 2020-08-27 2023-01-17 Nxp Usa, Inc. Semiconductor device having a translation feature and method therefor
US11757166B2 (en) 2020-11-10 2023-09-12 Aptiv Technologies Limited Surface-mount waveguide for vertical transitions of a printed circuit board
US11749883B2 (en) 2020-12-18 2023-09-05 Aptiv Technologies Limited Waveguide with radiation slots and parasitic elements for asymmetrical coverage
US11901601B2 (en) 2020-12-18 2024-02-13 Aptiv Technologies Limited Waveguide with a zigzag for suppressing grating lobes
US11444364B2 (en) 2020-12-22 2022-09-13 Aptiv Technologies Limited Folded waveguide for antenna
EP4030557A1 (en) 2021-01-15 2022-07-20 Nxp B.V. A package
US12058804B2 (en) 2021-02-09 2024-08-06 Aptiv Technologies AG Formed waveguide antennas of a radar assembly
US11616306B2 (en) 2021-03-22 2023-03-28 Aptiv Technologies Limited Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board
US11600581B2 (en) 2021-04-15 2023-03-07 Texas Instruments Incorporated Packaged electronic device and multilevel lead frame coupler
EP4084222A1 (en) 2021-04-30 2022-11-02 Aptiv Technologies Limited Dielectric loaded waveguide for low loss signal distributions and small form factor antennas
US11962085B2 (en) 2021-05-13 2024-04-16 Aptiv Technologies AG Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength
US12033950B2 (en) * 2021-07-13 2024-07-09 Nxp Usa, Inc. Semiconductor device with self-aligned waveguide and method therefor
US12444702B2 (en) 2021-08-02 2025-10-14 Texas Instruments Incorporated Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate
US11616282B2 (en) 2021-08-03 2023-03-28 Aptiv Technologies Limited Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports
US12224502B2 (en) 2021-10-14 2025-02-11 Aptiv Technologies AG Antenna-to-printed circuit board transition
US12456816B2 (en) 2022-05-02 2025-10-28 Aptiv Technologies AG Waveguide with slot antennas and reflectors
US12265172B2 (en) 2022-05-25 2025-04-01 Aptiv Technologies AG Vertical microstrip-to-waveguide transition
EP4366077A1 (en) 2022-11-04 2024-05-08 Nxp B.V. A system
US12424767B2 (en) 2022-11-15 2025-09-23 Aptiv Technologies AG Planar surface features for waveguide and antenna
US12148992B2 (en) 2023-01-25 2024-11-19 Aptiv Technologies AG Hybrid horn waveguide antenna
US12489211B2 (en) 2023-03-15 2025-12-02 Texas Instruments Incorporated Electronic device with patch antenna in packaging substrate

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218682A (en) * 1979-06-22 1980-08-19 Nasa Multiple band circularly polarized microstrip antenna
US4835540A (en) * 1985-09-18 1989-05-30 Mitsubishi Denki Kabushiki Kaisha Microstrip antenna
US6154176A (en) * 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
JP2000101377A (ja) * 1998-09-21 2000-04-07 Nippon Telegr & Teleph Corp <Ntt> フィルタ装置およびアンテナ装置
US6211824B1 (en) * 1999-05-06 2001-04-03 Raytheon Company Microstrip patch antenna
DE10031255A1 (de) * 2000-06-27 2002-01-17 Bosch Gmbh Robert Schlitzantenne
WO2003055065A1 (en) 2001-12-20 2003-07-03 Koninklijke Philips Electronics N.V. Coupler, integrated electronic component and electronic device
US7019709B2 (en) * 2002-08-22 2006-03-28 Matsushita Electric Industrial Co., Ltd. Antenna device
US7190315B2 (en) * 2003-12-18 2007-03-13 Intel Corporation Frequency selective surface to suppress surface currents
WO2006019776A2 (en) 2004-07-14 2006-02-23 William Marsh Rice University A method for coupling terahertz pulses into a coaxial waveguide
WO2006009274A1 (en) * 2004-07-23 2006-01-26 Nec Corporation Composite via structures and filters in multilayer printed circuit boards
JP4504798B2 (ja) * 2004-12-16 2010-07-14 パナソニック株式会社 多段構成半導体モジュール
US20060202269A1 (en) * 2005-03-08 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and electronic appliance having the same
US7864113B2 (en) * 2005-03-31 2011-01-04 Georgia Tech Research Corporation Module, filter, and antenna technology for millimeter waves multi-gigabits wireless systems
JP2007036571A (ja) * 2005-07-26 2007-02-08 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
ES2380580T3 (es) * 2005-10-14 2012-05-16 Fractus S.A. Formación menuda de antenas de triple banda para estaciones base celulares
JP4681614B2 (ja) * 2005-11-14 2011-05-11 アンリツ株式会社 直線偏波アンテナ及びそれを用いるレーダ装置
US7423608B2 (en) * 2005-12-20 2008-09-09 Motorola, Inc. High impedance electromagnetic surface and method
KR20060071388A (ko) 2006-06-06 2006-06-26 엔알디테크 주식회사 패치 안테나를 이용한 밀리미터파 대역용 송수신기 시스템
JP4294670B2 (ja) * 2006-09-15 2009-07-15 シャープ株式会社 無線通信装置
US9172145B2 (en) * 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
KR101593686B1 (ko) * 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
JP4980306B2 (ja) * 2007-09-07 2012-07-18 シャープ株式会社 無線通信装置
JP5389352B2 (ja) * 2007-12-06 2014-01-15 ローム株式会社 半導体装置
US8174450B2 (en) * 2008-04-30 2012-05-08 Topcon Gps, Llc Broadband micropatch antenna system with reduced sensitivity to multipath reception
US8384596B2 (en) * 2008-06-19 2013-02-26 Broadcom Corporation Method and system for inter-chip communication via integrated circuit package antennas
US7728774B2 (en) 2008-07-07 2010-06-01 International Business Machines Corporation Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production
BRPI0914914B1 (pt) 2008-07-07 2021-12-14 Gapwaves Ab Dispositivo de micro-ondas
JP5387133B2 (ja) * 2009-05-20 2014-01-15 日本電気株式会社 半導体装置
WO2011030277A2 (en) 2009-09-08 2011-03-17 Yigal Leiba Rfic interfaces and millimeter-wave structures
EP2502311B1 (en) * 2009-11-17 2017-02-01 Topcon Positioning Systems, Inc. Compact multipath-resistant antenna system with integrated navigation receiver
EP2551956A4 (en) * 2010-03-23 2014-12-03 Furukawa Electric Co Ltd ANTENNA AND INTEGRATED ANTENNA
JP4988002B2 (ja) * 2010-03-25 2012-08-01 シャープ株式会社 無線通信装置
US8169060B2 (en) 2010-03-29 2012-05-01 Infineon Technologies Ag Integrated circuit package assembly including wave guide
US8558637B2 (en) * 2010-05-12 2013-10-15 Mediatek Inc. Circuit device with signal line transition element
US8674892B2 (en) * 2010-06-20 2014-03-18 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures
US9386688B2 (en) * 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
WO2012089799A1 (en) * 2010-12-30 2012-07-05 Pirelli Tyre S.P.A. Multiple-frequency antenna for a system of vehicle tyre sensors
US8988299B2 (en) * 2011-02-17 2015-03-24 International Business Machines Corporation Integrated antenna for RFIC package applications
US8842046B2 (en) * 2011-07-22 2014-09-23 Texas Instruments Incorporated Loop antenna
US20130026586A1 (en) * 2011-07-26 2013-01-31 Texas Instruments Incorporated Cross-loop antenna
US20130113668A1 (en) * 2011-11-04 2013-05-09 Chryssoula A. Kyriazidou Systems for Focusing and Defocusing an Antenna
US9356352B2 (en) * 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9431369B2 (en) * 2012-12-13 2016-08-30 Taiwan Semiconductor Manufacturing Company, Ltd. Antenna apparatus and method
WO2014123024A1 (ja) * 2013-02-07 2014-08-14 三菱電機株式会社 アンテナ装置およびアレーアンテナ装置
US9373885B2 (en) * 2013-02-08 2016-06-21 Ubiquiti Networks, Inc. Radio system for high-speed wireless communication
US9515366B2 (en) * 2013-03-19 2016-12-06 Texas Instruments Incorporated Printed circuit board dielectric waveguide core and metallic waveguide end
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
CN105940553A (zh) * 2014-02-14 2016-09-14 Hrl实验室有限责任公司 像素化金属贴片的可重构电磁表面
US9853361B2 (en) * 2014-05-02 2017-12-26 The Invention Science Fund I Llc Surface scattering antennas with lumped elements
US9620841B2 (en) * 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US9917372B2 (en) * 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US9257973B1 (en) 2014-11-04 2016-02-09 Texas Instruments Incorporated Supply-state-enabled level shifter interface circuit and method
US9941226B2 (en) * 2014-12-15 2018-04-10 Industrial Technology Research Institute Integrated millimeter-wave chip package
US9865935B2 (en) * 2015-01-12 2018-01-09 Huawei Technologies Co., Ltd. Printed circuit board for antenna system
US9653810B2 (en) * 2015-06-12 2017-05-16 City University Of Hong Kong Waveguide fed and wideband complementary antenna
WO2016205808A1 (en) * 2015-06-19 2016-12-22 Nxgen Partners Ip, Llc Patch antenna array for transmission of hermite-gaussian and laguerre gaussian beams
US10686257B2 (en) * 2016-09-01 2020-06-16 Wafer Llc Method of manufacturing software controlled antenna
US10476136B2 (en) * 2017-07-20 2019-11-12 Apple Inc. Electronic device with speaker port aligned antennas

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