CN104737364B - 波导耦合器 - Google Patents
波导耦合器 Download PDFInfo
- Publication number
- CN104737364B CN104737364B CN201380055058.XA CN201380055058A CN104737364B CN 104737364 B CN104737364 B CN 104737364B CN 201380055058 A CN201380055058 A CN 201380055058A CN 104737364 B CN104737364 B CN 104737364B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- hole
- antenna
- layer
- circular patch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/657,615 US9356352B2 (en) | 2012-10-22 | 2012-10-22 | Waveguide coupler |
| US13/657,615 | 2012-10-22 | ||
| PCT/US2013/066254 WO2014066437A1 (en) | 2012-10-22 | 2013-10-22 | Waveguide coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104737364A CN104737364A (zh) | 2015-06-24 |
| CN104737364B true CN104737364B (zh) | 2018-05-11 |
Family
ID=50484874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380055058.XA Active CN104737364B (zh) | 2012-10-22 | 2013-10-22 | 波导耦合器 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US9356352B2 (enExample) |
| JP (1) | JP6322639B2 (enExample) |
| CN (1) | CN104737364B (enExample) |
| WO (1) | WO2014066437A1 (enExample) |
Families Citing this family (38)
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| US9356352B2 (en) * | 2012-10-22 | 2016-05-31 | Texas Instruments Incorporated | Waveguide coupler |
| DE112016006695T5 (de) | 2016-04-01 | 2018-12-06 | Intel IP Corporation | Gehäuse auf Antennengehäuse |
| US10756033B2 (en) | 2016-06-03 | 2020-08-25 | Intel IP Corporation | Wireless module with antenna package and cap package |
| US10971822B2 (en) | 2016-10-31 | 2021-04-06 | Kyocera Corporation | Antenna, module substrate, and module |
| US10224634B2 (en) * | 2016-11-03 | 2019-03-05 | At&T Intellectual Property I, L.P. | Methods and apparatus for adjusting an operational characteristic of an antenna |
| US10944180B2 (en) * | 2017-07-10 | 2021-03-09 | Viasat, Inc. | Phased array antenna |
| US11735806B2 (en) * | 2018-05-14 | 2023-08-22 | Texas Instruments Incorporated | Wireless device with waveguiding structures between radiating structures and waveguide feeds |
| DE102018118765A1 (de) * | 2018-08-02 | 2020-02-06 | Endress+Hauser SE+Co. KG | Hochfrequenzbaustein |
| KR102656395B1 (ko) * | 2018-09-04 | 2024-04-09 | 삼성전기주식회사 | 고주파 필터 장치 및 고주파 모듈 |
| US20200212536A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Wireless communication device with antenna on package |
| DE102019102784A1 (de) * | 2019-02-05 | 2020-08-06 | Infineon Technologies Ag | Halbleitervorrichtungen mit Radar-Halbleiterchip und zugehörige Herstellungsverfahren |
| US10651541B1 (en) * | 2019-02-27 | 2020-05-12 | Nxp Usa, Inc. | Package integrated waveguide |
| US11031681B2 (en) | 2019-06-20 | 2021-06-08 | Nxp Usa, Inc. | Package integrated waveguide |
| US11335652B2 (en) | 2019-07-29 | 2022-05-17 | Nxp Usa, Inc. | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide |
| US11133578B2 (en) * | 2019-09-06 | 2021-09-28 | Nxp B.V. | Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide |
| US11133273B2 (en) * | 2019-12-17 | 2021-09-28 | Nxp Usa, Inc. | Semiconductor device with waveguide and method therefor |
| DE102020113232A1 (de) * | 2020-05-15 | 2021-11-18 | Infineon Technologies Ag | Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren |
| US11557544B2 (en) * | 2020-08-27 | 2023-01-17 | Nxp Usa, Inc. | Semiconductor device having a translation feature and method therefor |
| US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
| US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
| US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
| US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
| EP4030557A1 (en) | 2021-01-15 | 2022-07-20 | Nxp B.V. | A package |
| US12058804B2 (en) | 2021-02-09 | 2024-08-06 | Aptiv Technologies AG | Formed waveguide antennas of a radar assembly |
| US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
| US11600581B2 (en) | 2021-04-15 | 2023-03-07 | Texas Instruments Incorporated | Packaged electronic device and multilevel lead frame coupler |
| EP4084222A1 (en) | 2021-04-30 | 2022-11-02 | Aptiv Technologies Limited | Dielectric loaded waveguide for low loss signal distributions and small form factor antennas |
| US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
| US12033950B2 (en) * | 2021-07-13 | 2024-07-09 | Nxp Usa, Inc. | Semiconductor device with self-aligned waveguide and method therefor |
| US12444702B2 (en) | 2021-08-02 | 2025-10-14 | Texas Instruments Incorporated | Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate |
| US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
| US12224502B2 (en) | 2021-10-14 | 2025-02-11 | Aptiv Technologies AG | Antenna-to-printed circuit board transition |
| US12456816B2 (en) | 2022-05-02 | 2025-10-28 | Aptiv Technologies AG | Waveguide with slot antennas and reflectors |
| US12265172B2 (en) | 2022-05-25 | 2025-04-01 | Aptiv Technologies AG | Vertical microstrip-to-waveguide transition |
| EP4366077A1 (en) | 2022-11-04 | 2024-05-08 | Nxp B.V. | A system |
| US12424767B2 (en) | 2022-11-15 | 2025-09-23 | Aptiv Technologies AG | Planar surface features for waveguide and antenna |
| US12148992B2 (en) | 2023-01-25 | 2024-11-19 | Aptiv Technologies AG | Hybrid horn waveguide antenna |
| US12489211B2 (en) | 2023-03-15 | 2025-12-02 | Texas Instruments Incorporated | Electronic device with patch antenna in packaging substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007042938A3 (en) * | 2005-10-14 | 2007-11-22 | Fractus Sa | Slim triple band antenna array for cellular base stations |
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2012
- 2012-10-22 US US13/657,615 patent/US9356352B2/en active Active
-
2013
- 2013-10-22 JP JP2015539723A patent/JP6322639B2/ja active Active
- 2013-10-22 WO PCT/US2013/066254 patent/WO2014066437A1/en not_active Ceased
- 2013-10-22 CN CN201380055058.XA patent/CN104737364B/zh active Active
-
2016
- 2016-05-27 US US15/167,768 patent/US10164318B2/en active Active
-
2018
- 2018-12-22 US US16/231,463 patent/US11088432B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007042938A3 (en) * | 2005-10-14 | 2007-11-22 | Fractus Sa | Slim triple band antenna array for cellular base stations |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160276731A1 (en) | 2016-09-22 |
| US20190123416A1 (en) | 2019-04-25 |
| JP2015532570A (ja) | 2015-11-09 |
| WO2014066437A1 (en) | 2014-05-01 |
| US20140111394A1 (en) | 2014-04-24 |
| US9356352B2 (en) | 2016-05-31 |
| JP6322639B2 (ja) | 2018-05-09 |
| US10164318B2 (en) | 2018-12-25 |
| CN104737364A (zh) | 2015-06-24 |
| US11088432B2 (en) | 2021-08-10 |
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