JP2014522172A5 - - Google Patents

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Publication number
JP2014522172A5
JP2014522172A5 JP2014522931A JP2014522931A JP2014522172A5 JP 2014522172 A5 JP2014522172 A5 JP 2014522172A5 JP 2014522931 A JP2014522931 A JP 2014522931A JP 2014522931 A JP2014522931 A JP 2014522931A JP 2014522172 A5 JP2014522172 A5 JP 2014522172A5
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JP
Japan
Prior art keywords
conductive region
bond pad
region
conductive
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014522931A
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English (en)
Japanese (ja)
Other versions
JP6001071B2 (ja
JP2014522172A (ja
Filing date
Publication date
Priority claimed from US13/189,135 external-priority patent/US8842046B2/en
Application filed filed Critical
Publication of JP2014522172A publication Critical patent/JP2014522172A/ja
Publication of JP2014522172A5 publication Critical patent/JP2014522172A5/ja
Application granted granted Critical
Publication of JP6001071B2 publication Critical patent/JP6001071B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014522931A 2011-07-22 2012-07-23 ループアンテナ Active JP6001071B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/189,135 2011-07-22
US13/189,135 US8842046B2 (en) 2011-07-22 2011-07-22 Loop antenna
PCT/US2012/047868 WO2013016293A2 (en) 2011-07-22 2012-07-23 Loop antenna

Publications (3)

Publication Number Publication Date
JP2014522172A JP2014522172A (ja) 2014-08-28
JP2014522172A5 true JP2014522172A5 (enExample) 2015-09-03
JP6001071B2 JP6001071B2 (ja) 2016-10-05

Family

ID=47555413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014522931A Active JP6001071B2 (ja) 2011-07-22 2012-07-23 ループアンテナ

Country Status (4)

Country Link
US (1) US8842046B2 (enExample)
JP (1) JP6001071B2 (enExample)
CN (1) CN103703615B (enExample)
WO (1) WO2013016293A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9356352B2 (en) * 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
US8917210B2 (en) * 2012-11-27 2014-12-23 International Business Machines Corporation Package structures to improve on-chip antenna performance
KR102029477B1 (ko) * 2013-07-26 2019-10-07 삼성전기주식회사 무선통신모듈
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9917372B2 (en) * 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
CN104465547B (zh) * 2014-12-10 2017-06-30 华进半导体封装先导技术研发中心有限公司 高频天线信号反射的封装结构及制造方法
US10361476B2 (en) 2015-05-26 2019-07-23 Qualcomm Incorporated Antenna structures for wireless communications
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
CN111262003B (zh) * 2020-01-22 2021-09-14 Oppo广东移动通信有限公司 天线封装模组和电子设备
US11600581B2 (en) 2021-04-15 2023-03-07 Texas Instruments Incorporated Packaged electronic device and multilevel lead frame coupler
US12444702B2 (en) 2021-08-02 2025-10-14 Texas Instruments Incorporated Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate
US12489211B2 (en) 2023-03-15 2025-12-02 Texas Instruments Incorporated Electronic device with patch antenna in packaging substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6154176A (en) 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
JP2001102817A (ja) * 1999-09-29 2001-04-13 Nec Corp 高周波回路及び該高周波回路を用いたシールディドループ型磁界検出器
US7119745B2 (en) 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
EP2124291B1 (en) 2005-10-19 2013-09-18 D-Per Technologies Ltd. Antenna arrangement
US7423608B2 (en) * 2005-12-20 2008-09-09 Motorola, Inc. High impedance electromagnetic surface and method
JP2007174153A (ja) * 2005-12-21 2007-07-05 Kyocera Corp ループアンテナおよび通信機器
US7855689B2 (en) 2007-09-26 2010-12-21 Nippon Soken, Inc. Antenna apparatus for radio communication
JP2009260758A (ja) * 2008-04-18 2009-11-05 Murata Mfg Co Ltd 無線ｉｃデバイス
WO2010087783A1 (en) 2009-01-30 2010-08-05 Agency For Science, Technology And Research An antenna and method for manufacturing the same
JP5276463B2 (ja) * 2009-02-09 2013-08-28 Ｎｅｃトーキン株式会社 アンテナ装置及びそれを備えたｒｆｉｄタグ
US8674892B2 (en) * 2010-06-20 2014-03-18 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures
CN103038939B (zh) * 2010-09-30 2015-11-25 株式会社村田制作所 无线ic器件
CN104067444B (zh) * 2011-04-13 2016-04-27 泰科消防及安全有限公司 用于近场应用的小型宽带环形天线

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