JP6001071B2 - ループアンテナ - Google Patents

ループアンテナ Download PDF

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Publication number
JP6001071B2
JP6001071B2 JP2014522931A JP2014522931A JP6001071B2 JP 6001071 B2 JP6001071 B2 JP 6001071B2 JP 2014522931 A JP2014522931 A JP 2014522931A JP 2014522931 A JP2014522931 A JP 2014522931A JP 6001071 B2 JP6001071 B2 JP 6001071B2
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JP
Japan
Prior art keywords
conductive region
bond pad
region
conductive
electrical contact
Prior art date
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JP2014522931A
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English (en)
Japanese (ja)
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JP2014522172A5 (enExample
JP2014522172A (ja
Inventor
ソク ウニョン
ソク ウニョン
ピー ギンスバーグ ブライアン
ピー ギンスバーグ ブライアン
ハルーン バヘル
ハルーン バヘル
ラマスワミ スリナス
ラマスワミ スリナス
ビー レンタラ ヴィジェイ
ビー レンタラ ヴィジェイ
Original Assignee
日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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Publication date
Application filed by 日本テキサス・インスツルメンツ株式会社, テキサス インスツルメンツ インコーポレイテッド, テキサス インスツルメンツ インコーポレイテッド filed Critical 日本テキサス・インスツルメンツ株式会社
Publication of JP2014522172A publication Critical patent/JP2014522172A/ja
Publication of JP2014522172A5 publication Critical patent/JP2014522172A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Landscapes

  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2014522931A 2011-07-22 2012-07-23 ループアンテナ Active JP6001071B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/189,135 2011-07-22
US13/189,135 US8842046B2 (en) 2011-07-22 2011-07-22 Loop antenna
PCT/US2012/047868 WO2013016293A2 (en) 2011-07-22 2012-07-23 Loop antenna

Publications (3)

Publication Number Publication Date
JP2014522172A JP2014522172A (ja) 2014-08-28
JP2014522172A5 JP2014522172A5 (enExample) 2015-09-03
JP6001071B2 true JP6001071B2 (ja) 2016-10-05

Family

ID=47555413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014522931A Active JP6001071B2 (ja) 2011-07-22 2012-07-23 ループアンテナ

Country Status (4)

Country Link
US (1) US8842046B2 (enExample)
JP (1) JP6001071B2 (enExample)
CN (1) CN103703615B (enExample)
WO (1) WO2013016293A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9356352B2 (en) * 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
US8917210B2 (en) * 2012-11-27 2014-12-23 International Business Machines Corporation Package structures to improve on-chip antenna performance
KR102029477B1 (ko) * 2013-07-26 2019-10-07 삼성전기주식회사 무선통신모듈
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9917372B2 (en) * 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
CN104465547B (zh) * 2014-12-10 2017-06-30 华进半导体封装先导技术研发中心有限公司 高频天线信号反射的封装结构及制造方法
US10361476B2 (en) 2015-05-26 2019-07-23 Qualcomm Incorporated Antenna structures for wireless communications
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
CN111262003B (zh) * 2020-01-22 2021-09-14 Oppo广东移动通信有限公司 天线封装模组和电子设备
US11600581B2 (en) 2021-04-15 2023-03-07 Texas Instruments Incorporated Packaged electronic device and multilevel lead frame coupler
US12444702B2 (en) 2021-08-02 2025-10-14 Texas Instruments Incorporated Flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrate
US12489211B2 (en) 2023-03-15 2025-12-02 Texas Instruments Incorporated Electronic device with patch antenna in packaging substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6154176A (en) 1998-08-07 2000-11-28 Sarnoff Corporation Antennas formed using multilayer ceramic substrates
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
JP2001102817A (ja) * 1999-09-29 2001-04-13 Nec Corp 高周波回路及び該高周波回路を用いたシールディドループ型磁界検出器
US7119745B2 (en) 2004-06-30 2006-10-10 International Business Machines Corporation Apparatus and method for constructing and packaging printed antenna devices
EP2124291B1 (en) 2005-10-19 2013-09-18 D-Per Technologies Ltd. Antenna arrangement
US7423608B2 (en) * 2005-12-20 2008-09-09 Motorola, Inc. High impedance electromagnetic surface and method
JP2007174153A (ja) * 2005-12-21 2007-07-05 Kyocera Corp ループアンテナおよび通信機器
US7855689B2 (en) 2007-09-26 2010-12-21 Nippon Soken, Inc. Antenna apparatus for radio communication
JP2009260758A (ja) * 2008-04-18 2009-11-05 Murata Mfg Co Ltd 無線ｉｃデバイス
WO2010087783A1 (en) 2009-01-30 2010-08-05 Agency For Science, Technology And Research An antenna and method for manufacturing the same
JP5276463B2 (ja) * 2009-02-09 2013-08-28 Ｎｅｃトーキン株式会社 アンテナ装置及びそれを備えたｒｆｉｄタグ
US8674892B2 (en) * 2010-06-20 2014-03-18 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures
CN103038939B (zh) * 2010-09-30 2015-11-25 株式会社村田制作所 无线ic器件
CN104067444B (zh) * 2011-04-13 2016-04-27 泰科消防及安全有限公司 用于近场应用的小型宽带环形天线

Also Published As

Publication number Publication date
US8842046B2 (en) 2014-09-23
WO2013016293A3 (en) 2013-05-10
WO2013016293A2 (en) 2013-01-31
CN103703615A (zh) 2014-04-02
US20130021208A1 (en) 2013-01-24
WO2013016293A8 (en) 2013-07-18
WO2013016293A9 (en) 2014-05-22
CN103703615B (zh) 2016-01-20
JP2014522172A (ja) 2014-08-28

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