JP2024503352A5 - - Google Patents

Info

Publication number
JP2024503352A5
JP2024503352A5 JP2023540569A JP2023540569A JP2024503352A5 JP 2024503352 A5 JP2024503352 A5 JP 2024503352A5 JP 2023540569 A JP2023540569 A JP 2023540569A JP 2023540569 A JP2023540569 A JP 2023540569A JP 2024503352 A5 JP2024503352 A5 JP 2024503352A5
Authority
JP
Japan
Prior art keywords
match
interconnect
core layer
dielectric layer
electrical path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540569A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024503352A (ja
Filing date
Publication date
Priority claimed from US17/148,257 external-priority patent/US11955409B2/en
Application filed filed Critical
Publication of JP2024503352A publication Critical patent/JP2024503352A/ja
Publication of JP2024503352A5 publication Critical patent/JP2024503352A5/ja
Pending legal-status Critical Current

Links

JP2023540569A 2021-01-13 2021-12-10 スキューマッチングのために構成されたコア層中に相互接続を備える基板 Pending JP2024503352A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/148,257 2021-01-13
US17/148,257 US11955409B2 (en) 2021-01-13 2021-01-13 Substrate comprising interconnects in a core layer configured for skew matching
PCT/US2021/062859 WO2022154914A1 (en) 2021-01-13 2021-12-10 Substrate comprising interconnects in a core layer configured for skew matching

Publications (2)

Publication Number Publication Date
JP2024503352A JP2024503352A (ja) 2024-01-25
JP2024503352A5 true JP2024503352A5 (enExample) 2024-11-20

Family

ID=79283142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540569A Pending JP2024503352A (ja) 2021-01-13 2021-12-10 スキューマッチングのために構成されたコア層中に相互接続を備える基板

Country Status (7)

Country Link
US (1) US11955409B2 (enExample)
EP (1) EP4278381A1 (enExample)
JP (1) JP2024503352A (enExample)
KR (1) KR20230130628A (enExample)
CN (1) CN116686396A (enExample)
BR (1) BR112023013292A2 (enExample)
WO (1) WO2022154914A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298273A (ja) * 2000-04-17 2001-10-26 Hitachi Ltd 電子部品内蔵実装基板及びそれを用いた半導体パッケージ
US7180011B1 (en) * 2006-03-17 2007-02-20 Lsi Logic Corporation Device for minimizing differential pair length mismatch and impedance discontinuities in an integrated circuit package design
US8319111B2 (en) 2006-10-04 2012-11-27 Ngk Spark Plug Co., Ltd. Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers
JP2012009510A (ja) 2010-06-22 2012-01-12 Sumitomo Bakelite Co Ltd 金属微細パターン付き基材、プリント配線板、及び半導体装置、並びに、金属微細パターン付き基材及びプリント配線板の製造方法
JP2013093405A (ja) 2011-10-25 2013-05-16 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2014032978A (ja) * 2012-07-31 2014-02-20 Ibiden Co Ltd インダクタ部品、インダクタ部品の製造方法及び配線板
JPWO2019194200A1 (ja) * 2018-04-04 2021-04-01 太陽誘電株式会社 部品内蔵基板

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