JP2024505488A5 - - Google Patents
Info
- Publication number
- JP2024505488A5 JP2024505488A5 JP2023544580A JP2023544580A JP2024505488A5 JP 2024505488 A5 JP2024505488 A5 JP 2024505488A5 JP 2023544580 A JP2023544580 A JP 2023544580A JP 2023544580 A JP2023544580 A JP 2023544580A JP 2024505488 A5 JP2024505488 A5 JP 2024505488A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated device
- peripheral
- substrate
- interconnections
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/164,723 US11749611B2 (en) | 2021-02-01 | 2021-02-01 | Package with a substrate comprising periphery interconnects |
| US17/164,723 | 2021-02-01 | ||
| PCT/US2021/064902 WO2022164559A1 (en) | 2021-02-01 | 2021-12-22 | Package with a substrate comprising periphery interconnects |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024505488A JP2024505488A (ja) | 2024-02-06 |
| JP2024505488A5 true JP2024505488A5 (enExample) | 2024-12-03 |
| JP7789073B2 JP7789073B2 (ja) | 2025-12-19 |
Family
ID=79730483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023544580A Active JP7789073B2 (ja) | 2021-02-01 | 2021-12-22 | 周辺相互接続を備える基板をもつパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11749611B2 (enExample) |
| EP (1) | EP4285411A1 (enExample) |
| JP (1) | JP7789073B2 (enExample) |
| KR (1) | KR20230137330A (enExample) |
| CN (1) | CN116783706A (enExample) |
| BR (1) | BR112023014688A2 (enExample) |
| TW (1) | TW202234633A (enExample) |
| WO (1) | WO2022164559A1 (enExample) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62100726U (enExample) * | 1985-12-13 | 1987-06-26 | ||
| US6400575B1 (en) | 1996-10-21 | 2002-06-04 | Alpine Microsystems, Llc | Integrated circuits packaging system and method |
| JP2000307203A (ja) * | 1999-04-22 | 2000-11-02 | Denso Corp | 電子部品実装用基板 |
| US6909052B1 (en) * | 2002-08-23 | 2005-06-21 | Emc Corporation | Techniques for making a circuit board with improved impedance characteristics |
| JP2008147438A (ja) | 2006-12-11 | 2008-06-26 | Nec Electronics Corp | 半導体装置 |
| JP4967164B2 (ja) * | 2008-03-19 | 2012-07-04 | Ｎｅｃインフロンティア株式会社 | 多層プリント配線板及びそれを用いた電子機器 |
| US9691694B2 (en) | 2015-02-18 | 2017-06-27 | Qualcomm Incorporated | Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate |
| US10373893B2 (en) * | 2017-06-30 | 2019-08-06 | Intel Corporation | Embedded bridge with through-silicon vias |
| CN109564923B (zh) * | 2018-06-28 | 2020-04-28 | 长江存储科技有限责任公司 | 具有屏蔽层的三维存储器器件以及用于制造其的方法 |
| CN109219885A (zh) * | 2018-07-20 | 2019-01-15 | 长江存储科技有限责任公司 | 三维存储器件 |
| JP7133516B2 (ja) * | 2019-06-24 | 2022-09-08 | 日立Astemo株式会社 | 信号伝送回路、電子制御装置 |
| US11201139B2 (en) * | 2020-03-20 | 2021-12-14 | Sandisk Technologies Llc | Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same |
| US11444019B2 (en) | 2020-04-06 | 2022-09-13 | Qualcomm Incorporated | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package |
| US11322466B2 (en) * | 2020-05-20 | 2022-05-03 | Sandisk Technologies Llc | Semiconductor die containing dummy metallic pads and methods of forming the same |
| US11444039B2 (en) * | 2020-05-29 | 2022-09-13 | Sandisk Technologies Llc | Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same |
-
2021
- 2021-02-01 US US17/164,723 patent/US11749611B2/en active Active
- 2021-12-22 WO PCT/US2021/064902 patent/WO2022164559A1/en not_active Ceased
- 2021-12-22 EP EP21844911.4A patent/EP4285411A1/en active Pending
- 2021-12-22 BR BR112023014688A patent/BR112023014688A2/pt unknown
- 2021-12-22 KR KR1020237025274A patent/KR20230137330A/ko active Pending
- 2021-12-22 JP JP2023544580A patent/JP7789073B2/ja active Active
- 2021-12-22 CN CN202180090793.9A patent/CN116783706A/zh active Pending
- 2021-12-22 TW TW110148147A patent/TW202234633A/zh unknown