JP2024502355A5 - - Google Patents
Info
- Publication number
- JP2024502355A5 JP2024502355A5 JP2023541318A JP2023541318A JP2024502355A5 JP 2024502355 A5 JP2024502355 A5 JP 2024502355A5 JP 2023541318 A JP2023541318 A JP 2023541318A JP 2023541318 A JP2023541318 A JP 2023541318A JP 2024502355 A5 JP2024502355 A5 JP 2024502355A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- integrated device
- interconnection
- interconnecting
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/148,367 | 2021-01-13 | ||
| US17/148,367 US11562962B2 (en) | 2021-01-13 | 2021-01-13 | Package comprising a substrate and interconnect device configured for diagonal routing |
| PCT/US2021/062237 WO2022154905A1 (en) | 2021-01-13 | 2021-12-07 | Package comprising a substrate and interconnect device configured for diagonal routing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024502355A JP2024502355A (ja) | 2024-01-18 |
| JP2024502355A5 true JP2024502355A5 (enExample) | 2024-11-18 |
| JP7765480B2 JP7765480B2 (ja) | 2025-11-06 |
Family
ID=79171288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541318A Active JP7765480B2 (ja) | 2021-01-13 | 2021-12-07 | 対角ルーティング用に構成された基板および相互接続デバイスを備えるパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11562962B2 (enExample) |
| EP (1) | EP4278382A1 (enExample) |
| JP (1) | JP7765480B2 (enExample) |
| KR (1) | KR20230130634A (enExample) |
| CN (1) | CN116686084A (enExample) |
| BR (1) | BR112023013290A2 (enExample) |
| TW (1) | TW202243179A (enExample) |
| WO (1) | WO2022154905A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11855057B2 (en) * | 2021-07-08 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of forming the same |
| US11978697B2 (en) * | 2021-07-16 | 2024-05-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
| US20230137877A1 (en) * | 2021-11-02 | 2023-05-04 | Intel Corporation | No-remelt solder enforcement joint |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050240893A1 (en) * | 2000-12-07 | 2005-10-27 | Cadence Design Systems, Inc. | Method and arrangement for layout and manufacture of nonmanhattan semiconductor integrated circuit using simulated euclidean wiring |
| JP4707446B2 (ja) | 2005-04-26 | 2011-06-22 | 富士通セミコンダクター株式会社 | 半導体装置 |
| JP2007194535A (ja) | 2006-01-23 | 2007-08-02 | Toshiba Corp | 半導体装置 |
| US8227904B2 (en) | 2009-06-24 | 2012-07-24 | Intel Corporation | Multi-chip package and method of providing die-to-die interconnects in same |
| US11121109B2 (en) * | 2017-10-26 | 2021-09-14 | Intel Corporation | Innovative interconnect design for package architecture to improve latency |
| US11569173B2 (en) | 2017-12-29 | 2023-01-31 | Intel Corporation | Bridge hub tiling architecture |
| US20200098692A1 (en) * | 2018-09-26 | 2020-03-26 | Intel Corporation | Microelectronic assemblies having non-rectilinear arrangements |
| US11652057B2 (en) * | 2019-05-07 | 2023-05-16 | Intel Corporation | Disaggregated die interconnection with on-silicon cavity bridge |
| US11222850B2 (en) | 2019-05-15 | 2022-01-11 | Mediatek Inc. | Electronic package with rotated semiconductor die |
| US11621223B2 (en) * | 2019-05-22 | 2023-04-04 | Intel Corporation | Interconnect hub for dies |
| US12176268B2 (en) * | 2020-03-24 | 2024-12-24 | Intel Corporation | Open cavity bridge co-planar placement architectures and processes |
-
2021
- 2021-01-13 US US17/148,367 patent/US11562962B2/en active Active
- 2021-12-07 EP EP21835540.2A patent/EP4278382A1/en active Pending
- 2021-12-07 WO PCT/US2021/062237 patent/WO2022154905A1/en not_active Ceased
- 2021-12-07 JP JP2023541318A patent/JP7765480B2/ja active Active
- 2021-12-07 TW TW110145673A patent/TW202243179A/zh unknown
- 2021-12-07 KR KR1020237022732A patent/KR20230130634A/ko active Pending
- 2021-12-07 CN CN202180087348.7A patent/CN116686084A/zh active Pending
- 2021-12-07 BR BR112023013290A patent/BR112023013290A2/pt unknown